Circuits Assembly - January 2008 - (Page 24) ESD Control Walking on Water By Pierre Husson High-pressure humidification systems can improve quality and reduce energy costs. S tatic electricity and the potential for defects due to ESD is one of the biggest manufacturing headaches a board manufacturer can face,” says Itron’s Paul Anderson. In snowy Minnesota winters, the potential for ESD problems soars as icy outside air is heated to normal plant operating temperatures of around 70°F. Without proper humidity control, relative humidity in Anderson’s plant could plunge, creating ideal conditions for ESD problems. Anderson is facilities operations manager for Itron Inc.’s 540-employee, 110,000 sq. ft. manufacturing plant in Waseca, MN, which produces RF devices and automated meter reading equipment used by utilities and large water and power users. Anderson has managed the facility’s operations since 1999 and has 25 years of facilities management experience. Every year Anderson and Itron’s plant engineers huddle to make sure everything is working right. A constant discussion item has been process improvements aimed at continuing to reduce ESD damage to components. The physics is simple: Static builds as RH levels drop – the colder the air, the greater the potential for dry air and static buildup. As cold winter air is heated, it dries and loses its capacity for carrying moisture. For instance, when outside air with a temperature of 10°F and RH of 50% is heated to an internal temperature of 70°F, RH will drop to about 10%. Industry standards recommend minimum RH levels of at least 30% to avoid ESD problems, with levels of 40-50% RH considered desirable. Keeping RH at an acceptable level requires most plants add large amounts of water to the air through humidification systems. In warmer, drier climes like California, ESD problems are often a year-round issue, and maintaining consistently appropriate RH levels may require adding water to plant air all year. “Keeping ESD problems at bay was a topic that occupied our attention every year,” Anderson explains. “For years we operated a compressed air humidification system throughout the plant. It did a good job, but as humidification technology has moved forward, so has the capability to control RH levels tighter and more consistently, meaning ever tighter control of ESD.” The compressed air humidification system lacked the precise control Anderson and Itron personnel sought. It also came with other annoying, costly baggage: • Inefficiency. “The moisture it produced didn’t cover the area as uniformly as we wanted. That’s a tough problem here, because we have ceiling heights as low as 11' and 12' in some parts of our manufacturing area.” • Expense. “Compressed air is a very expensive commodity, and operating the humidification system had just about eaten up our compressor capacity, so manufacturing couldn’t use it. Adding compressor capacity wasn’t an option. 24 Circuits Assembly JANUARY 2008 circuitsassembly.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - January 2008 Circuits Assembly - January 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing Walking on Water Flux Selection for Lead-Free Wave Soldering An A-to-Z Guide to X-Ray Inspection, Part II Evolution in Action Research Priorities for the Electronics Industry Selective Soldering Process Doctor Pb-Free Lessons Learned Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - January 2008 Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover2) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 2) Circuits Assembly - January 2008 - Contents (Page 3) Circuits Assembly - January 2008 - Contents (Page 4) Circuits Assembly - January 2008 - Contents (Page 5) Circuits Assembly - January 2008 - Caveat Lector (Page 6) Circuits Assembly - January 2008 - Caveat Lector (Page 7) Circuits Assembly - January 2008 - Industry News (Page 8) Circuits Assembly - January 2008 - Industry News (Page 9) Circuits Assembly - January 2008 - Industry News (Page 10) Circuits Assembly - January 2008 - Industry News (Page 11) Circuits Assembly - January 2008 - Market Watch (Page 12) Circuits Assembly - January 2008 - Market Watch (Page 13) Circuits Assembly - January 2008 - Talking Heads (Page 14) Circuits Assembly - January 2008 - Talking Heads (Page 15) Circuits Assembly - January 2008 - Focus on Business (Page 16) Circuits Assembly - January 2008 - Focus on Business (Page 17) Circuits Assembly - January 2008 - On the Forefront (Page 18) Circuits Assembly - January 2008 - On the Forefront (Page 19) Circuits Assembly - January 2008 - Screen Printing (Page 20) Circuits Assembly - January 2008 - Screen Printing (Page 21) Circuits Assembly - January 2008 - Better Manufacturing (Page 22) Circuits Assembly - January 2008 - Better Manufacturing (Page 23) Circuits Assembly - January 2008 - Walking on Water (Page 24) Circuits Assembly - January 2008 - Walking on Water (Page 25) Circuits Assembly - January 2008 - Walking on Water (Page 26) Circuits Assembly - January 2008 - Walking on Water (Page 27) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 28) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 29) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 30) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 31) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 32) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 33) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 34) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 35) Circuits Assembly - January 2008 - Evolution in Action (Page 36) Circuits Assembly - January 2008 - Evolution in Action (Page 37) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 38) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 39) Circuits Assembly - January 2008 - Selective Soldering (Page 40) Circuits Assembly - January 2008 - Process Doctor (Page 41) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - January 2008 - Materials World (Page 44) Circuits Assembly - January 2008 - Product Spotlight (Page 45) Circuits Assembly - January 2008 - Ad Index (Page 46) Circuits Assembly - January 2008 - Assembly Insider (Page 47) Circuits Assembly - January 2008 - Technical Abstracts (Page 48) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover4)
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