Circuits Assembly - January 2008 - (Page 38)

iNEMI's Emerging Technologies Research Priorities for the Electronics Industry By Alan Rae, Ph.D., Robert C. Pfahl, Ph.D., and Charles Richardson The merger of micro and nano, chemical, and other sensors with micro- and nanoelectronics could mean disruption ahead. Ed: The complete article can be found at circuitsassembly.com/ cms/content/view/5918. onsumer and professional electronics are still evolving rapidly; the need for lower cost, higher speed, more memory, better displays and smaller form factors combined with wireless connectivity, new functionality and longer battery life in handheld devices are forcing many traditional materials and systems “against the stops.” Electronics system miniaturization for mobile computing, communication and sensing will drive a new generation of low-cost packaging technologies over the next decade. Multifunctional integration, ultra small form factor and low cost will be the defining characteristics of next-generation packaging. This new packaging technology will interface with integrated or embedded active and passive components, cooling structures and advanced interconnect structures in ultra-thin silicon and organic type substrate platforms. Chip and package co-design and considerable integration of digital, RF, optical, sensing and biological functions in 2-D and 3-D architectures will be realized. These technologies will need advanced materials with enhanced electrical, thermal and 38 Circuits Assembly JANUARY 2008 C thermo-mechanical properties, and advanced manufacturing processes. The 2007 iNEMI Roadmap1 identified a number of key areas where rapid development or discontinuous change may be required to meet these needs. The iNEMI research priorities recommended three areas for action: Innovative packaging for gigafunctional systemin-package (SiP). Traditional interconnections of surface-mounted discretes are being changed to ultra-fine-pitch interconnections connecting embedded ultra-thin film components on ultra-thin silicon and organic type substrates. The package integration will evolve into system integration, leveraging the system-on-chip, wafer-level packaging and embedded passives and actives on organic substrate technologies. Convergent micro- and nano-systems will have not only digital and portable wireless electronics, but also bioelectronic functions. These electronics and bioelectronics devices, advanced interconnects, batteries, thermal solutions and other user interfaces such as connectors and cables can lead to multifunctional systems in the short term and more integrated gigafunctional systems in the long run. This SiP concept integrates disparate technologies to achieve multiple system functions in a single package, while providing an ultrasmall form factor. Materials and reliability. Materials continue to pace the introduction of packaging technologies to meet the major manufacturing requirements of low cost through increased modularity, integration for smaller size, and higher bandwidth for more functionality. ■ circuitsassembly.com http://circuitsassembly.com/cms/content/view/5918 http://circuitsassembly.com/cms/content/view/5918 http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - January 2008

Circuits Assembly - January 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing Walking on Water Flux Selection for Lead-Free Wave Soldering An A-to-Z Guide to X-Ray Inspection, Part II Evolution in Action Research Priorities for the Electronics Industry Selective Soldering Process Doctor Pb-Free Lessons Learned Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - January 2008

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