Circuits Assembly - January 2008 - (Page 45)

SPOTLIGHT ‘Synthetic Imaging’ AOI Single-Step Underfill One-Step Underfill 688 is a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies. Acts as flux and underfill. May be applied directly after printing process and cured during standard Pb-free reflow. Can be used in mixed alloy solutions. Is said to offer reliability through high Tg, low CTE, and good fill with no voiding. Is compatible with no-clean flux residues. May be reworked at 120°C. Viscosity reportedly remains stable throughout shelf life. Wets to OSP, ENIG, ImAg and ImSn. AIM, aimsolder.com Product The iSpector 350 AOI platform features synthetic imaging and is said to deliver an optimum defect balance ratio. Is suitable for PCBs up to 350 x 250 mm. Is programmable through its component library or with a golden board. Includes prototype mode for first-off inspection and upgradeable lighting. Desktop configuration is upgradeable to inline operation. Marantz Business Electronics, marantz.com/bus/eu/ Rework Monitoring Scope Fineview video microscope workstation is said to permit detailed inspection and analysis of small PCBs and components for defect diagnostics, monitoring of rework results or repair-byhand applications. Comes as an all-in-one solution, including top camera, TFT screen, LED lighting, clamping support, laser pointer and multi-function control panel. Offers up to 25x motorized zoom magnification. Includes autofocus, manual focus and four integrated high-contrast power LEDs, as well as brightness control. Reduces surface reflections during top viewing. Finetech, finetech.de Lubricant Spray Valve Model SV1217SS spray valve and programmable controller SVC100 are said to direct a fine mist of lubricant to a moving part using time and pressure sequencing. Controlling the relationship between the lubricant start signal and the misting signal permits the lubricant line pressure to start momentarily after misting pressure initiates, reversing the process at the end of the cycle. This sequencing is said to ensure a non-clogging system. For up to 400 cpm. Viscosity can be accommodated up to 1000 cps. I&J Fisnar Inc., ijfisnar.com Submicron X-Ray Inspection The XiDAT XD7500NT digital x-ray inspection system is said to have submicron inspection capability and sealed tube technology. Provides oblique angle viewing of up to 70° for any position 360° around any point of the 18” x 16” inspection area. Features recognition to 950 nm. Real-time digital inspection of 1.3 MP viewed on a 20” flat panel LCD display. System magnification up to 7,400x. Comes with ImageWizard software. Dage Precision Industries Ltd., dage-group.com BGA Programming Sockets High-performance sockets designed for Pb-free BGA devices are available for any 0.8 pitch BGA device under 169 pins. Are designed for device programming and said to have a load cycle rating of 50,000 insertions. Can be used on universal and new Flashstream programming hardware. Reportedly have lower tooling cost per inserted device compared to standard burn-in test sockets and last up to 10 times longer. BPM Microsystems, bpmmicro.com Adjustable Spray Bottle Redesign The Vigon RC 101 spray bottle’s stream can be adjusted to spray on most oven surfaces’ shapes and configurations. Said to reduce amount of spray action. Has wide-angle nozzle. Includes point-to-point spraying feature. Is designed for 1-l bottle. Has no flash point and can be applied directly onto cold or warm oven surfaces. Tested with eutectic and Pb-free flux residues. Zestron America, zestron.com Rework Tweezers The MX-PTZ Precision Tweezer hand-piece for the Metcal MX-500 soldering/rework system uses SmartHeat. Soldering cartridges come in a variety of sizes for reworking discretes and SOICs. Is said to reduce stress on PCBs during rework operations without damaging package. Thermally applies heat to the end caps of devices while mechanically gripping the component during removal. Features double-sided pivot and dual position pitch adjustment. Includes adjustable tip alignment for height and rotation. OK International, okinternational.com Desktop Hot Bar Reflow Desktop systems for hot bar bonding applications use pulsed heat technology; can be used for hot bar reflow soldering, ACF bonding, heat-seal bonding and heat staking. Provide a method for joining flexible Continued on pg. 47 circuitsassembly.com Circuits Assembly JANUARY 2008 45 http://marantz.com/bus/eu/ http://www.aimsolder.com http://finetech.de http://www.dage-group.com http://ijfisnar.com http://zestron.com http://bpmmicro.com http://okinternational.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - January 2008

Circuits Assembly - January 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing Walking on Water Flux Selection for Lead-Free Wave Soldering An A-to-Z Guide to X-Ray Inspection, Part II Evolution in Action Research Priorities for the Electronics Industry Selective Soldering Process Doctor Pb-Free Lessons Learned Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - January 2008

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