Circuits Assembly - January 2008 - (Page 46) Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. SPOTLIGHT High-Speed Conformal Coat Dispenser Select Coat SL-940E conformal coating dispenser is said to have up to 30% faster throughput, a vision system, closed-loop process controls, traceability, and advanced integrated software. Motion system attains 750 mm per sec. speed and 1 g peak acceleration. Accommodates product sizes up to 500 mm. Enables velocity with up to 2 kg payload. Has dispense area of 500 x 475 mm. Viscosity control system and SC-204 and SC-205 film coater modules available. The Swirl Coat SC-300 applicator is a three-mode swirl system, while the PreciseCoat SC-400 jet applicator can be used for high selectivity applications. Integrated downdraft and spill containment. Asymtek, asymtek.com Product Aim Solder, www.aimsolder.com . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Aqueous Technologies, www.aqueoustech.com . . . . . . . . . . . . . . 25 Asahi Chemical & Solder, www.LeadFreeService.com . . . . . . . 9, 19 Balver Zinn, www.balverzinn.com . . . . . . . . . . . . . . . . . . . . . . . . C2 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 47 BPM Microsystems, www.bpmicro.com . . . . . . . . . . . . . . . . . . . . 13 CIRCUITS ASSEMBLY Directory of EMS Companies circuitsassembly.com/cms/dems . . . . . . . . . . . . . . . . . . . . . . . 26 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . C3 Dage Precision Industries, www.dage-group.com . . . . . . . . . . . . 47 DEK USA, www.dek.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 eFabPCB, www.efabpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 EFD, Inc., www.efdsolder.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 FCT Assembly, www.fctassembly.com . . . . . . . . . . . . . . . . . . . . . . 4 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Imagineering Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 IPC Apex, www.goipcshows.org . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Juki Automation Systems, www.jas-smt.com . . . . . . . . . . . . . . . 17 Kyzen Corporation, www.kyzen.com . . . . . . . . . . . . . . . . . . . . . . . 27 MEPTEC, www.meptec.org . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . . 4 PCB East, www.pcbeast.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 PCB Shows, www.pcbshows.com . . . . . . . . . . . . . . . . . . . . . . . . . 41 Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 47 RMD Instruments, www.rmd-leadtracer.com . . . . . . . . . . . . . . . . 21 RVSI, www.rvsi.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Speedline Technology, www.speedlinetech.com . . . . . . . . . . . . . 11 Virtual PCB, www.virtual-pcb.com . . . . . . . . . . . . . . . . . . . . . . . . 33 VJ Electronix, www.vjelectronix.com . . . . . . . . . . . . . . . . . . . . . . . 29 Self-Contained IR Preheater Hot Beam 03 rapid IR underheater is a self-contained unit said to boost PCB preheat temperatures at the rate of 3.5ºC/ sec. Set temperatures are maintained during soldering. With up to 50% of thermal energy from below, temperature of solder tips is reportedly lowered by approximately 50ºC. When shut down, reportedly instantly returns to touchable ambient temperature. Is thermocouple profilable and stores 11 programs. Handles board sizes to 400 x 400 mm and any thickness. Manncorp, manncorp.com Ultrasonic Immersion Cleaner Aquanox A4651US is a low pH ultrasonic immersion cleaner. Is said to provide cleaning on all the latest flux formulations. Reportedly provides solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. Is multi-metal safe, including aluminum and copper. Is a biodegradable aqueous solution that contains no CFCs or HAPs. Kyzen Corp., kyzen.com ‘Jet-Head’ Paste Dispenser Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Susan Jones Group Sales Director, (404) 822-8900 email: sjones@upmediagroup.com Kamden Robb Sales Associate, (678) 589-8843 email: krobb@upmediagroup.com The second-generation MY500 jet printer offers offline programming said to permit setups and changeovers in seconds. Permits adjustments on the spot, in three dimensions. Features easy-to-use, 2-D inspection and repair. A paste syringe and ejection technology have “snap-to-machine” loading; said to permit quick paste refill as needed or switches from lead to Pb-free paste in seconds. Mydata Automation, mydata.se Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr 46 Circuits Assembly JANUARY 2008 circuitsassembly.com http://circuitsassembly.com http://www.aimsolder.com http://www.aqueoustech.com http://www.LeadFreeService.com http://www.balverzinn.com http://www.bareboard.com http://www.bpmicro.com http://circuitsassembly.com/cms/dems http://www.cyberoptics.com http://asymtek.com http://www.dage-group.com http://www.dek.com http://www.digikey.com http://www.efabpcb.com http://www.efdsolder.com http://www.fctassembly.com http://www.grid-lok.com http://www.pcbnet.com http://www.indium.com http://manncorp.com http://www.goipcshows.org http://www.jas-smt.com http://www.kyzen.com http://www.meptec.org http://www.nihonsuperior.co.jp http://www.pcbeast.com http://www.pcbshows.com http://www.goppm.com http://kyzen.com http://www.rmd-leadtracer.com http://www.rvsi.com http://www.speedlinetech.com http://www.virtual-pcb.com http://www.vjelectronix.com http://www.mydata.se http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - January 2008 Circuits Assembly - January 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing Walking on Water Flux Selection for Lead-Free Wave Soldering An A-to-Z Guide to X-Ray Inspection, Part II Evolution in Action Research Priorities for the Electronics Industry Selective Soldering Process Doctor Pb-Free Lessons Learned Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - January 2008 Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page Cover2) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 1) Circuits Assembly - January 2008 - Circuits Assembly - January 2008 (Page 2) Circuits Assembly - January 2008 - Contents (Page 3) Circuits Assembly - January 2008 - Contents (Page 4) Circuits Assembly - January 2008 - Contents (Page 5) Circuits Assembly - January 2008 - Caveat Lector (Page 6) Circuits Assembly - January 2008 - Caveat Lector (Page 7) Circuits Assembly - January 2008 - Industry News (Page 8) Circuits Assembly - January 2008 - Industry News (Page 9) Circuits Assembly - January 2008 - Industry News (Page 10) Circuits Assembly - January 2008 - Industry News (Page 11) Circuits Assembly - January 2008 - Market Watch (Page 12) Circuits Assembly - January 2008 - Market Watch (Page 13) Circuits Assembly - January 2008 - Talking Heads (Page 14) Circuits Assembly - January 2008 - Talking Heads (Page 15) Circuits Assembly - January 2008 - Focus on Business (Page 16) Circuits Assembly - January 2008 - Focus on Business (Page 17) Circuits Assembly - January 2008 - On the Forefront (Page 18) Circuits Assembly - January 2008 - On the Forefront (Page 19) Circuits Assembly - January 2008 - Screen Printing (Page 20) Circuits Assembly - January 2008 - Screen Printing (Page 21) Circuits Assembly - January 2008 - Better Manufacturing (Page 22) Circuits Assembly - January 2008 - Better Manufacturing (Page 23) Circuits Assembly - January 2008 - Walking on Water (Page 24) Circuits Assembly - January 2008 - Walking on Water (Page 25) Circuits Assembly - January 2008 - Walking on Water (Page 26) Circuits Assembly - January 2008 - Walking on Water (Page 27) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 28) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 29) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 30) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 31) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 32) Circuits Assembly - January 2008 - Flux Selection for Lead-Free Wave Soldering (Page 33) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 34) Circuits Assembly - January 2008 - An A-to-Z Guide to X-Ray Inspection, Part II (Page 35) Circuits Assembly - January 2008 - Evolution in Action (Page 36) Circuits Assembly - January 2008 - Evolution in Action (Page 37) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 38) Circuits Assembly - January 2008 - Research Priorities for the Electronics Industry (Page 39) Circuits Assembly - January 2008 - Selective Soldering (Page 40) Circuits Assembly - January 2008 - Process Doctor (Page 41) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - January 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - January 2008 - Materials World (Page 44) Circuits Assembly - January 2008 - Product Spotlight (Page 45) Circuits Assembly - January 2008 - Ad Index (Page 46) Circuits Assembly - January 2008 - Assembly Insider (Page 47) Circuits Assembly - January 2008 - Technical Abstracts (Page 48) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - January 2008 - Technical Abstracts (Page Cover4)
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