Circuits Assembly - February 2008 - (Page 20) Program Management Maximizing Lean By Todd Baggett PMs are often closest to the customer and have the best visibility into areas needing improvement. Ed.: For the complete article, visit circuitsassembly.com/cms/ content/view/6020. aining significant benefits from Lean manufacturing requires more than an EMS production floor focused on Lean principles. Achieving meaningful cost reduction requires a Lean-focused effort throughout the entire value chain, which involves implementation of Lean manufacturing principles at the EMS provider, within the designated supply base and at the customer site. While many functions contribute to the result, the EMS program manager plays a key role in helping orchestrate that teaming, as they often have the closest customer relationship and the best visibility into areas in need of improvement. OEMs that implement Lean principles have the luxury of being able to phase in Lean practices throughout every aspect of the product realization process, from design to material procurement to production to demand fulfillment. Conversely, EMS providers face the challenge of a mix of customers with varying degrees of acceptance of Lean practices. Every customer wants the flexibility and long-term path to cost reduction that well-implemented Lean techniques support. However, not every customer is willing to make G changes to internal practices to achieve optimum results. Just as with production Lean implementation, the smaller the effort the smaller the result. Epic’s Lean manufacturing philosophy is known as Synchronous Flow Manufacturing. SFM focuses on increasing factory throughput by optimizing and standardizing production. Rather than optimizing the factory floor process-byprocess, it takes a large-scale systems approach. Key implementation elements include: • Detailed process mapping to understand key processes involved in transforming production inputs to customer-desired outputs. • Identifying constraints in key processes that limit flexibility. • Developing strategies to eliminate constraints, including working with equipment suppliers, material suppliers and employees to develop unique solutions for maximum flexibility. • Standardizing the manufacturing solution through common equipment selections, which further improves assembly process flexibility. • Developing simple tools that ensure rapid exchange of real-time information. From a teaming perspective, focus on design is a critical starting point. Optimized design improves quality and will reduce cost of manufacturing. At a minimum, a focus on design for manufacturability/design for testability (DfM/DfT) is valuable. However, a more comprehensive focus that looks at component commonality and use of Lean suppliers can generate even better results. ■ Todd Baggett is vice president, business development, at Epic Technologies (epictech.com); todd.baggett@epictech.com. 20 Circuits Assembly FEBRUARY 2008 circuitsassembly.com http://circuitsassembly.com/cms/content/view/6020 http://circuitsassembly.com/cms/content/view/6020 http://epictech.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - February 2008 Circuits Assembly - February 2008 Contents Caveat Lector Letters Industry News Market Watch Global Sourcing Better Manufacturing Maximizing Lean Copper As a Viable Solution for IC Packaging Embedded Active Components for High-Rel Products Cover Story: XRF Equipment As a RoHS Screening Tool Tech Tips Selective Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - February 2008 Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover2) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 2) Circuits Assembly - February 2008 - Contents (Page 3) Circuits Assembly - February 2008 - Contents (Page 4) Circuits Assembly - February 2008 - Contents (Page 5) Circuits Assembly - February 2008 - Caveat Lector (Page 6) Circuits Assembly - February 2008 - Caveat Lector (Page 7) Circuits Assembly - February 2008 - Letters (Page 8) Circuits Assembly - February 2008 - Letters (Page 9) Circuits Assembly - February 2008 - Industry News (Page 10) Circuits Assembly - February 2008 - Industry News (Page 11) Circuits Assembly - February 2008 - Industry News (Page 12) Circuits Assembly - February 2008 - Industry News (Page 13) Circuits Assembly - February 2008 - Industry News (Page 14) Circuits Assembly - February 2008 - Industry News (Page 15) Circuits Assembly - February 2008 - Market Watch (Page 16) Circuits Assembly - February 2008 - Global Sourcing (Page 17) Circuits Assembly - February 2008 - Better Manufacturing (Page 18) Circuits Assembly - February 2008 - Better Manufacturing (Page 19) Circuits Assembly - February 2008 - Maximizing Lean (Page 20) Circuits Assembly - February 2008 - Maximizing Lean (Page 21) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 22) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 23) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 24) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 25) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 26) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 27) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 28) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 29) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 30) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 31) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 32) Circuits Assembly - February 2008 - Tech Tips (Page 33) Circuits Assembly - February 2008 - Tech Tips (Page 34) Circuits Assembly - February 2008 - Tech Tips (Page 35) Circuits Assembly - February 2008 - Selective Soldering (Page 36) Circuits Assembly - February 2008 - Selective Soldering (Page 37) Circuits Assembly - February 2008 - Test and Inspection (Page 38) Circuits Assembly - February 2008 - Test and Inspection (Page 39) Circuits Assembly - February 2008 - Process Doctor (Page 40) Circuits Assembly - February 2008 - Process Doctor (Page 41) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - February 2008 - Product Spotlight (Page 44) Circuits Assembly - February 2008 - Product Spotlight (Page 45) Circuits Assembly - February 2008 - Ad Index (Page 46) Circuits Assembly - February 2008 - Assembly Insider (Page 47) Circuits Assembly - February 2008 - Technical Abstracts (Page 48) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover4)
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