Circuits Assembly - February 2008 - (Page 25)

Recent Patents to build with new designs, and it eases the weight and size of electronics modules. And we have had a successful Navy missile flight, and have built gun launch modules to withstand more than 20 kg of shock without failure. Ed.: US 7,116,557, “Imbedded Component Integrated Circuit Assembly and Method of Making Same,” covers a printed circuit board assembly comprising a primary core of thermally conductive material; a two-tiered laminate substrate connected to the primary core, the twotiered laminate substrate including a two-tiered cavity and electrically conductive circuit bonding pads connected to a circuit imbedded in a lower tier of the two-tiered laminate substrate; a circuit component disposed within the two-tiered cavity and connected to the primary core using a thermally conductive adhesive material, the circuit component including electrically conductive component bonding pads; flexible electrical interconnects connected to the electrically conductive circuit bonding pads and the electrically conductive component bonding pads; a conformal coating covering portions of the twotiered laminate substrate, the thermally conductive adhesive material, the circuit component, the electrically conductive component bonding pads, the flexible electrical interconnects, the electrically conductive circuit bonding pads, and any portions of the primary core located in the two-tiered cavity and not covered by the thermally conductive adhesive material; and an encapsulating material filling the two-tiered cavity and encapsulating the thermally conductive adhesive material, the circuit component, the electrically conductive component bonding pads, the flexible electrical interconnects, and the electrically conductive circuit bonding pad. To review the patent, visit http://cc.msnscache.com/cache. aspx?q=72375698744183&lang=enUS&w=e65f8287. ■ Jim D. Raby, PE, is founder of Soldering Technology International (STI Electronics Inc.) (stielectronicsinc. com); jraby@stielectronicsinc.com. Flux Removers Solvent Cleaners Contact Cleaners Connector Lubricants Conformal Coatings Aero-Duster® Freeze Spray PTFE Release Agents Krytox® Lubricants California - Illinois - Connecticut - Canada 203.743.4447 Fax 203.791.8702 e-mail: support@miller-stephenson.com www.miller-stephenson.com COWBOY UP! and REGISTER NOW! • Three Days of Targeted Technical Sessions • One Day Table Top Trade Show • Networking Opportunities • FREE Technical Sessions March 4-6, 2008 www.pcbshows.com/austin circuitsassembly.com Circuits Assembly FEBRUARY 2008 25 http://www.miller-stephenson.com http://www.miller-stephenson.com http://cc.msnscache.com/cache.aspx?q=72375698744183&lang=en-US&w=e65f8287 http://cc.msnscache.com/cache.aspx?q=72375698744183&lang=en-US&w=e65f8287 http://www.pcbshows.com/austin http://cc.msnscache.com/cache.aspx?q=72375698744183&lang=en-US&w=e65f8287 http://www.stielectronicsinc.com http://www.stielectronicsinc.com http://www.pcbshows.com/austin http://www.pcbshows.com/austin http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - February 2008

Circuits Assembly - February 2008 Contents Caveat Lector Letters Industry News Market Watch Global Sourcing Better Manufacturing Maximizing Lean Copper As a Viable Solution for IC Packaging Embedded Active Components for High-Rel Products Cover Story: XRF Equipment As a RoHS Screening Tool Tech Tips Selective Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - February 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.