Circuits Assembly - February 2008 - (Page 3)

Post-Print Inspection: Pay Now, or Pay Later FEBRUARY 2008 circuitsassembly.com Gotcha! FEBRUARY 2008 – Vol. 19 No. 2 Maximizing the Benefits of Lean How XRF Systems Really Fare in Measuring Banned Substances FIRST PERSON 6 Caveat Lector Rabid for Raby. Mike Buetow Embedding Actives Large BGA Attachment Profiling FEATURES Program Management ON THE COVER: An NPL study finds XRF systems beat chemical analysis for unit and operational costs, and time to results. 8 Letters 20 Maximizing Lean While customers want flexibility and long-term paths to cost reduction that Lean supports, they aren’t always agreeable to the necessary internal changes. But the smaller the effort, the smaller the result. By Todd Baggett MONEY MATTERS 17 Global Sourcing Bad parts, like colds, come from anywhere, and no one is immune. A new database might help. Mike Buetow Component Packaging 22 Copper as a Viable Solution for IC Packaging As gold prices spike, some are turning to copper in ball-bonding processes for its conductivity and lower cost. By Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera and Chris Stai Recent Patents 24 Embedded Active Components for High-Rel Products Inside the missile, a heavy module on the board surface was breaking loose and failing. The answer: A solderless, wire-bonded chip-to-board solution covered with copper ìlidsî to quell vibration. By Jim D. Raby TECH TALK 18 Better Manufacturing Keep an eye on vision. Phil Zarrow COVER STORY 26 XRF Equipment as a RoHS Screening Tool A jointly funded industry/DTI collaborative project, led by the National Physical Laboratory, investigated the suitability of XRF techniques for determining the presence and levels of RoHSrestricted substances in typical electronics components. The 15-system study found most – but not all – are viable. By Martin Wickham and Dr. Christopher Hunt 33 Tech Tips Large BGA attachment profiling. American Competitiveness Institute 36 Selective Soldering Wave or selective for high-rel products? Ursula Marquez de Tino This month at PCDandF.com Advanced Glass Fabrics for Improved PCB Performance A uniquely woven glass fabric promises to resolve the challenges of mechanical and electrical performance associated with fiber weave effect. By Russell Dudek, Patricia Goldman and John Kuhn 38 Test and Inspection The fixture is in. Stacy Kalisz Johnson 40 Process Doctor Localized extraction clearly shows residue volumes at isolated spots. Terry Munson Improved Circuit Design Using IC Packaging/ PCB Co-Design Techniques Dynamic new co-design strategies will give PCB designers the flexibility to re-map legacy pinouts to improve overall PCB design. Martin Hart 42 Pb-Free Lessons Learned Wake up to the value of boards. Chrys Shea DEPARTMENTS 10 Industry News 16 Market Watch 44 Product Spotlight 46 Ad Index 47 Assembly Insider 48 Technical Abstracts Photo courtesy RMD Instruments http://circuitsassembly.com http://PCDandF.com

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Circuits Assembly - February 2008 Contents Caveat Lector Letters Industry News Market Watch Global Sourcing Better Manufacturing Maximizing Lean Copper As a Viable Solution for IC Packaging Embedded Active Components for High-Rel Products Cover Story: XRF Equipment As a RoHS Screening Tool Tech Tips Selective Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - February 2008

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