Circuits Assembly - February 2008 - (Page 44) SPOTLIGHT Process Equipment Tooling VacuNest compliant tooling system for printing, dispensing and placement machines has a working area of up to 330 mm x 330 mm; the tabletop configuration is said to handle shape memory tooling beyond board handling. Each module is a pliable antistatic chamber containing a foam former surrounded by polymer granules. The chamber reportedly can be profiled within 30 sec. to the shape of the work piece assembly or enclosure. Novatec, novatec-eap.com Product Convection-IR Combo Curing SCS Precision IRT combines convection and IR heat sources for curing a variety of coatings. Handles high- and low-solvent coatings, adhesives and other heat-curable materials. Reportedly reduces solvent entrapment, bubbling and blistering. Independently controlled convection and IR modules. Drip pans removable for fast, easy maintenance. Specialty Coating Systems, scscoatings.com Component Inventory Management 2000 Pro component inventory management system consists of a motorized surface mount parts counter, barcode reader and label laser printer. May detect shortages by scanning barcode on the reel, verifying the count, then printing a new barcode identity label with the current quantity, date and time. Reportedly will process a 7”or 13” reel containing 5,000 taped parts with pitches of 0.002” to 0.032” in approximately 90 sec. Manncorp, manncorp.com/smt_counters.php 12-Zone N2 Reflow The CHA-500 12-zone reflow oven is said to consume less than 200 L/min nitrogen when oxygen level is 800 ppm. Reportedly achieves temperature rise time in starting and profile changeover within 15 min. Flux filtration system contains chiller, enabling 2-5°C per sec. cooling. High filtration fluxer reduces pot cleaning to 1 to 3 months. Wave Point, wp-wavepoint.com Solder Paste Analyzer The ShareGen SPA 1000 analyzer provides testing to control and manage solder paste. Is said to reduce a range of defects, including missing components, tombstoning, component misalignment, and non-wetting. Reportedly can perform up to six separate tests. Can be used to conduct solder paste open time testing. Ascentech LLC, ascentechllc.com Modular Placement Platform GXH-3 modular direct drive mounter 4-Gantry Placement Machine The Quadris-3 quad-gantry model achieves a reported maximum throughput of 95,000 cph by maximizing SW sequences and minimizing delay times between motion sequences. Uses the same software and hardware as the Quadris-S, but with improved ease of use and maintenance. Handles components from 0201 to 44 x 44 mm, in tape and tray feeders, including dual-track feeders. Transparent acryl cover on the top and side enhances visibility. Universal Instruments, uic.com platform is capable of high-speed assembly and handling odd-shaped parts. Throughput is said to be up to 95,000 cph. Comes in four gantry (GXH-3) or two gantry (GXH-3J) versions. Modular concept permits multiple configurations. Hitachi High-Technologies Europe, hht-eu.com Noncontact Jet Dispenser The Spectrum S-920 series of scalable dispensing uses noncontact jetting. Rapid response heater system reportedly minimizes startup time and delivers uniform heat across entire part surface. Includes programmable fluid and valve pressure, mass flow control, calibrated process jetting, and a digital vision system. Can be configured with single or dual lanes, and one to three heat stations. Reportedly dispenses into 200 µm gaps; offers dispensing with flow rates up to 500 mg/sec. and shot rates up to 200 dots/sec. Asymtek, asymtek.com Small-Sized Solder Station Hakko FX-951 compact soldering station is said to fit on one's palm. Features heat transfer and thermal recovery, a lockout key card that reportedly prevents accidental or unauthorized temperature settings, auto shutoff after 30 min. of non-use, and sleep mode functionality. Hakko Products, hakkousa.com 44 Circuits Assembly FEBRUARY 2008 circuitsassembly.com novatec-eap.com scscoatings.com manncorp.com/smt_counters.php wp-wavepoint.com ascentechllc.com hht-eu.com uic.com hakkousa.com asymtek.com circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - February 2008 Circuits Assembly - February 2008 Contents Caveat Lector Letters Industry News Market Watch Global Sourcing Better Manufacturing Maximizing Lean Copper As a Viable Solution for IC Packaging Embedded Active Components for High-Rel Products Cover Story: XRF Equipment As a RoHS Screening Tool Tech Tips Selective Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - February 2008 Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover2) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 2) Circuits Assembly - February 2008 - Contents (Page 3) Circuits Assembly - February 2008 - Contents (Page 4) Circuits Assembly - February 2008 - Contents (Page 5) Circuits Assembly - February 2008 - Caveat Lector (Page 6) Circuits Assembly - February 2008 - Caveat Lector (Page 7) Circuits Assembly - February 2008 - Letters (Page 8) Circuits Assembly - February 2008 - Letters (Page 9) Circuits Assembly - February 2008 - Industry News (Page 10) Circuits Assembly - February 2008 - Industry News (Page 11) Circuits Assembly - February 2008 - Industry News (Page 12) Circuits Assembly - February 2008 - Industry News (Page 13) Circuits Assembly - February 2008 - Industry News (Page 14) Circuits Assembly - February 2008 - Industry News (Page 15) Circuits Assembly - February 2008 - Market Watch (Page 16) Circuits Assembly - February 2008 - Global Sourcing (Page 17) Circuits Assembly - February 2008 - Better Manufacturing (Page 18) Circuits Assembly - February 2008 - Better Manufacturing (Page 19) Circuits Assembly - February 2008 - Maximizing Lean (Page 20) Circuits Assembly - February 2008 - Maximizing Lean (Page 21) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 22) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 23) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 24) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 25) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 26) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 27) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 28) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 29) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 30) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 31) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 32) Circuits Assembly - February 2008 - Tech Tips (Page 33) Circuits Assembly - February 2008 - Tech Tips (Page 34) Circuits Assembly - February 2008 - Tech Tips (Page 35) Circuits Assembly - February 2008 - Selective Soldering (Page 36) Circuits Assembly - February 2008 - Selective Soldering (Page 37) Circuits Assembly - February 2008 - Test and Inspection (Page 38) Circuits Assembly - February 2008 - Test and Inspection (Page 39) Circuits Assembly - February 2008 - Process Doctor (Page 40) Circuits Assembly - February 2008 - Process Doctor (Page 41) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - February 2008 - Product Spotlight (Page 44) Circuits Assembly - February 2008 - Product Spotlight (Page 45) Circuits Assembly - February 2008 - Ad Index (Page 46) Circuits Assembly - February 2008 - Assembly Insider (Page 47) Circuits Assembly - February 2008 - Technical Abstracts (Page 48) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover4)
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