Circuits Assembly - February 2008 - (Page 6) Caveat Lector Where the Light Is Always On his month’s issue includes an article on a process for embedding active components for “high-reliability” (think missiles) applications. The process is more than just a concept. It’s actually passed DoD testing and is in use today. A patent for the process has been issued as well. The inventor? Jim Raby, 73 years young. Raby has spent his entire career – covering more than 50 years – in electronics manufacturing. It’s hard to imagine anyone in assembly who hasn’t been impacted, directly or otherwise, by his work. The laundry list of his accomplishments runs the gamut from designing to building to training. He has patents for wave soldering, worked on the Saturn/Apollo Program, and initiated the Zero Defect Program for wave soldering. He is credited for developing the NASA and Navy (the famous China Lake) soldering schools, and was instrumental in developing the IPC soldering certification curriculum. He initiated the Electronics Manufacturing Productivity Facility (now known as the American Competitiveness Institute). All in all, he has trained tens of thousands of engineers and operators. For more than 30 years, Raby has worked on industry standards, including DOD-STD-2000, MIL-STD-2000, J-STD-001 and IPC-A-610. He also helped write and implement standards for wire harnesses. He has been involved in the research for lead-free solder processes and materials. Naturally, Raby’s standards background is intertwined with IPC’s. His relationship with the trade group dates to 1960, when his boss assigned him to provide technical support for government representatives. In 1976, he was named co-chair of a committee to write a specification that could be used for lesser level military hardware. That threeyear project begat a soldering standard, IPC-815, and the term “solderability,” a major problem for industry. It also led to Raby’s full-fledged involvement in standards work, to which his lab contributed a large amount of test data in support of various requirements. “Dieter Bergman, IPC’s then technical director, led a group of engineers to China Lake many times to work on requirements, the best one being the contamination levels of solder in a wave pot,” Raby recalls. “I obtained all the Navy contractors’ previous years’ test results, and we took that very large amount of data and broke it down to requirements usable and acceptable by all industry (commercial and military).” His seminal paper, “Standardization of Military Specifications,” was the roadmap for reducing some 219 specifications into a single four-document set known as MILSTD-2000, the precursor to J-STD-001 and IPC-A-610. He has worked on more than a dozen standards and training T programs, and chaired or vice-chaired four key committees, including ones for soldering, rework and repair, component mounting, and product assurance. He wrote the curriculum and conducted beta testing for IPC training programs for J-STD-001, IPC-A-610D, IPC/WHMAA-620, and IPC-7711/7721A. In recognition of his work, Raby won IPC’s Presidents Award in 1984. Yet, while Raby is probably best known for setting up the soldering programs that have trained three generations of engineers and operators, it would surprise many to learn he is also the person behind the Lights Out Factory concept that revolutionized the modern electronics manufacturing facility. The Lights Out Factory was the result of the Circuit Cards Assembly and End Processing System (CCAPS), a Navy-funded program in the mid 1980s. Mel Scott, who worked on CCAPS with Raby, calls it “where automated manufacturing got its start.” The Navy invested about $60 million in CCAPS over a seven-year period, and IBM was the prime contractor. “We were able to develop a lights-out manufacturing facility, with plated through-hole and the beginnings of SMT, using robots to make assemblies, with a lot of vision and x-ray,” Scott says. “It was the beginning of automation. A lot of what came out is used today. At that time, equipment OEMs were going outside for software development. It launched SMEMA: the idea of making one piece of equipment communicate down the line with another. It was Jim’s idea. If we were to automate, and increase hardware reliability, the process equipment would have to talk. He sold the vision and idea and benefits to the Navy’s ManTech Program, which (ultimately) funded it.” Today Raby is technical director and program manager at STI Electronics in in Madison, AL, where he provides technical direction on all government and military contracts. Last month, IPC issued its annual call for nominations for its Hall of Fame. Inductees are individuals who, in the trade group’s words, have reached “the highest level of achievement, extraordinary contributions and distinguished service to IPC and in the advancement of the industry…. This is the highest level of recognition … and is based on exceptional merit over a long-term basis, the operative imperative being long term [italics mine].” Few have served the IPC and industry longer than Jim Raby. Even fewer have served it better. Do you support Jim’s nomination? Write IPC or drop me a line. Mike Buetow, Editor-in-Chief mbuetow@upmediagroup.com P.S. Check out Virtual PCB, the industry’s first Web-based, fully interactive, virtual event for PCB assemblers. The show dates are Feb. 12-13, and registration (virtual-pcb.com) is free. 6 Circuits Assembly FEBRUARY 2008 circuitsassembly.com http://virtual-pcb.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - February 2008 Circuits Assembly - February 2008 Contents Caveat Lector Letters Industry News Market Watch Global Sourcing Better Manufacturing Maximizing Lean Copper As a Viable Solution for IC Packaging Embedded Active Components for High-Rel Products Cover Story: XRF Equipment As a RoHS Screening Tool Tech Tips Selective Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - February 2008 Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page Cover2) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 1) Circuits Assembly - February 2008 - Circuits Assembly - February 2008 (Page 2) Circuits Assembly - February 2008 - Contents (Page 3) Circuits Assembly - February 2008 - Contents (Page 4) Circuits Assembly - February 2008 - Contents (Page 5) Circuits Assembly - February 2008 - Caveat Lector (Page 6) Circuits Assembly - February 2008 - Caveat Lector (Page 7) Circuits Assembly - February 2008 - Letters (Page 8) Circuits Assembly - February 2008 - Letters (Page 9) Circuits Assembly - February 2008 - Industry News (Page 10) Circuits Assembly - February 2008 - Industry News (Page 11) Circuits Assembly - February 2008 - Industry News (Page 12) Circuits Assembly - February 2008 - Industry News (Page 13) Circuits Assembly - February 2008 - Industry News (Page 14) Circuits Assembly - February 2008 - Industry News (Page 15) Circuits Assembly - February 2008 - Market Watch (Page 16) Circuits Assembly - February 2008 - Global Sourcing (Page 17) Circuits Assembly - February 2008 - Better Manufacturing (Page 18) Circuits Assembly - February 2008 - Better Manufacturing (Page 19) Circuits Assembly - February 2008 - Maximizing Lean (Page 20) Circuits Assembly - February 2008 - Maximizing Lean (Page 21) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 22) Circuits Assembly - February 2008 - Copper As a Viable Solution for IC Packaging (Page 23) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 24) Circuits Assembly - February 2008 - Embedded Active Components for High-Rel Products (Page 25) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 26) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 27) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 28) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 29) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 30) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 31) Circuits Assembly - February 2008 - Cover Story: XRF Equipment As a RoHS Screening Tool (Page 32) Circuits Assembly - February 2008 - Tech Tips (Page 33) Circuits Assembly - February 2008 - Tech Tips (Page 34) Circuits Assembly - February 2008 - Tech Tips (Page 35) Circuits Assembly - February 2008 - Selective Soldering (Page 36) Circuits Assembly - February 2008 - Selective Soldering (Page 37) Circuits Assembly - February 2008 - Test and Inspection (Page 38) Circuits Assembly - February 2008 - Test and Inspection (Page 39) Circuits Assembly - February 2008 - Process Doctor (Page 40) Circuits Assembly - February 2008 - Process Doctor (Page 41) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - February 2008 - Pb-Free Lessons Learned (Page 43) Circuits Assembly - February 2008 - Product Spotlight (Page 44) Circuits Assembly - February 2008 - Product Spotlight (Page 45) Circuits Assembly - February 2008 - Ad Index (Page 46) Circuits Assembly - February 2008 - Assembly Insider (Page 47) Circuits Assembly - February 2008 - Technical Abstracts (Page 48) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - February 2008 - Technical Abstracts (Page Cover4)
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