Circuits Assembly - March 2008 - (Page 40)

Cover Story insulation resistance tests have been completed to validate that the VP process and fluid used do not leave residual contaminates on the PCB that are detrimental to the assembly’s long-term performance.1 What has been done to determine that VP solder joint quality is as good as convection or IR? There are many independent studies on vapor phase reflow. In conjunction with the available studies from independent laboratories, EPIC has completed a number of validation protocols to show the capability of the vapor phase process to solder both lead and Pb-free PCBs. Test cycles included thermal cycle, thermal shock, shear, vibration and cross-sectional analysis of the solder fillets. In all cases, the solder joint quality was as good or better than those produced using convection reflow processes (Figures 2 and 3). Also, vapor phase reflow has been used in high reliability military and aerospace programs since the early 70s. How safe is the Teflon material for the environment and workforce health? The material used for vapor phase is an FDA-approved Teflon. There is no risk of harmful exposure to the material, and no fluorocarbons are produced at the operating temperatures used for reflow soldering of PCBs. EPIC has conduced two independent laboratory studies to validate there are no health and safety risks to its employees when exposed to the Teflon materials. Employees are monitored on an ongoing basis, and air quality samples are taken yearly. Why recommend vapor phase reflow when the industry is predomi- Figure 2. A Pb-free, tin J-lead processed using no-clean, convection reflow. nately convection reflow? Solder joint quality is improved with vapor phase, with an inert soldering environment, and superior heat transfer. As the industry changes to Pb-free, manufacturers have encountered suppliers that are not informing the industry on component plating changes. Vapor phase is much more forgiving to these changes and improves the solder process window. There should be no concern on the use of vapor phase reflow 40 Circuits Assembly MARCH 2008 circuitsassembly.com http://www.ecd.com/mm20 http://www.ecd.com/mm20 http://circuitsassembly.com

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Circuits Assembly - March 2008 Caveat Lector Letters Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing What Drives the Crowd? Mastering ESD Control in Automated Handling Systems Beating the RoHS Heat Trade Secrets True to Its Roots The Road Abroad - Strategic Alliance or Greenfield Facility? Tech Tips Wave Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Materials World Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - March 2008

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