Circuits Assembly - March 2008 - (Page 64) Test and Inspection Implementing AOI Successfully The data are useful, but at times overwhelming. Here’s how to cut them to size. ach AOI or SPI model offers Table 1. Sample Inspection Use Models, By Application different advantages such as Product Type Use Model Reason inspection coverage, speed, Automotive Customer elected to Customer required this save a picture of every level of liability protection programming time, vendor supcomponent on the in case boards were damaged port or cost. However, general use board after reflow. during final assembly, which models are consistent: Each perThe images are saved was performed at a different facility. on a server by serial number. forms user-defined inspections of Consumer Goods Customer and vendorWith the large amount of data a board and provides lists of suscreated software to produced during AOI, it is pected defects and data for each delete certain data important to “clean” information component inspected. Depending after a fixed time that is not relevant for period while archiving manufacturing or quality requirements. on the implementation strategy other information for Understanding the field failure – SPI (3-D or 2-D), pre-reflow, longer periods of time. rates allows users to delete mixed mode, post-reflow, or information after a period. post-wave/final assembly – there Telecommunications Storing component text Many customers store and images for long-term component text, but storing is ample information available liability purposes. Data are images and text removes to the user. Again, depending on stored by serial number any question of misreads the implementation, there will be for easy retrieval. or characters that may not be 100% readable. inherent differences in the data SPI customer kept volumetric Keeping the data available and their usefulness. Certain data Automotive data for every deposit for access by other will be more applicable for differinspected until the board manufacturing and test ent users, but determining what is cleared final assembly and engineers allows them the data were deemed to use the information available, where and for how long no longer necessary. for reports, defect validation and is important to inspection success. long-term monitoring of AOI and SPI generally provide process variables. measurement data, defect calls and defect images. All this is important, but how can a user before machines are moved inline and what can occur quantify and use the information efficiently? How after the fact. long should data be stored? What information should Next, sit down with your vendor and determine be readily available and what should be archived or available data, how long they are stored, and available removed? A post-reflow AOI system can generate offformat(s). The vendor will probably have standard set, presence scores, joint measurements and additional formats available but may have several other options component data for every device on the board. On a if they understand your goals and needs. Images may laptop assembly, this could result in 40,000 data points be stored locally on the system, but scripts or configufor every board inspected. For manufacturers running rations may need to be deleted or images moved to three shifts, that means nearly 200 million data points a defined locations. day! Should all these data need to be archived infiniteThird, ensure everyone follows through on and ly? Should operators be shown every SPC chart known executes the plans. If the goal is to use AOI to improve to man? How long are images of the defects useful? the process, the relevant information must be proWhen implementing AOI, certain key steps need vided to manufacturing in real-time so that potential to take place. issues can be corrected quickly. If the goal is for First, there should be internal meetings with all liability purposes and customer reports, it’s important levels of users to determine the facility needs. Operato determine what data need be kept and for how tors and technicians should be involved in the brainlong. Backup strategies and accessing the information storming sessions, along with engineers and managshould also be at the top of the list. ers, to discuss all variations of needs and practical Finally, consider other test and measurement implementation. Important points to be considered equipment in your production facility. How can the include data storage capacity, customer requirements, data be used to improve processes or better mold your liability, factory software databases, and how each overall manufacturing and test strategies (Table 1)? group would like the data presented. A prioritized list Some of the pitfalls users should try to avoid of the needs is important for the manufacturer and include not involving operators/technicians in the vendor, as this will help determine what is required discussion. These individuals are the front line in E Jeff Bishop is product marketing engineer at Agilent Technologies (agilent.com) 64 Circuits Assembly MARCH 2008 circuitsassembly.com http://agilent.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - March 2008 Circuits Assembly - March 2008 Caveat Lector Letters Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing What Drives the Crowd? Mastering ESD Control in Automated Handling Systems Beating the RoHS Heat Trade Secrets True to Its Roots The Road Abroad - Strategic Alliance or Greenfield Facility? Tech Tips Wave Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Materials World Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - March 2008 Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 3) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 4) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 5) Circuits Assembly - March 2008 - Caveat Lector (Page 6) Circuits Assembly - March 2008 - Caveat Lector (Page 7) Circuits Assembly - March 2008 - Letters (Page 8) Circuits Assembly - March 2008 - Letters (Page 9) Circuits Assembly - March 2008 - Industry News (Page 10) Circuits Assembly - March 2008 - Industry News (Page 11) Circuits Assembly - March 2008 - Industry News (Page 12) Circuits Assembly - March 2008 - Industry News (Page 13) Circuits Assembly - March 2008 - Industry News (Page 14) Circuits Assembly - March 2008 - Industry News (Page 15) Circuits Assembly - March 2008 - Industry News (Page 16) Circuits Assembly - March 2008 - Industry News (Page BEST1) Circuits Assembly - March 2008 - Industry News (Page BEST2) Circuits Assembly - March 2008 - Market Watch (Page 17) Circuits Assembly - March 2008 - Talking Heads (Page 18) Circuits Assembly - March 2008 - Talking Heads (Page 19) Circuits Assembly - March 2008 - Focus on Business (Page 20) Circuits Assembly - March 2008 - Focus on Business (Page 21) Circuits Assembly - March 2008 - On the Forefront (Page 22) Circuits Assembly - March 2008 - On the Forefront (Page 23) Circuits Assembly - March 2008 - Screen Printing (Page 24) Circuits Assembly - March 2008 - Screen Printing (Page 25) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 26) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 27) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 28) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 29) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 30) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 31) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 32) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 33) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 34) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 35) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 36) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 37) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 38) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 39) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 40) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 41) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 42) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 43) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 44) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 45) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 46) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 47) Circuits Assembly - March 2008 - Trade Secrets (Page 48) Circuits Assembly - March 2008 - Trade Secrets (Page 49) Circuits Assembly - March 2008 - Trade Secrets (Page 50) Circuits Assembly - March 2008 - Trade Secrets (Page 51) Circuits Assembly - March 2008 - True to Its Roots (Page 52) Circuits Assembly - March 2008 - True to Its Roots (Page 53) Circuits Assembly - March 2008 - True to Its Roots (Page 54) Circuits Assembly - March 2008 - True to Its Roots (Page 55) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 56) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 57) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 58) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 59) Circuits Assembly - March 2008 - Tech Tips (Page 60) Circuits Assembly - March 2008 - Tech Tips (Page 61) Circuits Assembly - March 2008 - Wave Soldering (Page 62) Circuits Assembly - March 2008 - Wave Soldering (Page 63) Circuits Assembly - March 2008 - Test and Inspection (Page 64) Circuits Assembly - March 2008 - Test and Inspection (Page 65) Circuits Assembly - March 2008 - Process Doctor (Page 66) Circuits Assembly - March 2008 - Pb-Free Lessons Learned (Page 67) Circuits Assembly - March 2008 - Getting Lean (Page 68) Circuits Assembly - March 2008 - Materials World (Page 69) Circuits Assembly - March 2008 - Equipment Advances (Page 70) Circuits Assembly - March 2008 - Equipment Advances (Page 71) Circuits Assembly - March 2008 - Apex Product Preview (Page 72) Circuits Assembly - March 2008 - Apex Product Preview (Page 73) Circuits Assembly - March 2008 - Apex Product Preview (Page 74) Circuits Assembly - March 2008 - Apex Product Preview (Page 75) Circuits Assembly - March 2008 - Apex Product Preview (Page 76) Circuits Assembly - March 2008 - Apex Product Preview (Page 77) Circuits Assembly - March 2008 - Ad Index (Page 78) Circuits Assembly - March 2008 - Assembly Insider (Page 79) Circuits Assembly - March 2008 - Technical Abstracts (Page 80) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover4)
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