Circuits Assembly - March 2008 - (Page 66) Process Doctor Inline Vs. Batch Cleaning Low volumes support batches; high volumes favor inline. rocesses in the precision cleaning industries are driven by customer requirements and economical efficiency. Published studies have concluded that overall process cost, with all its individual contributors, is essential in calculating the latter. Batch Process Standard Inline Process Cleanliness requirements, on the other Optimized Inline Process hand, depend largely on the cleaning agent technology and equipment employed. And it is here where industry opinions differ, especially when Board amount (Day) one is deciding whether to purchase Figure 1. Inline versus batch cleaning cost analysis. conveyorized inline or batch cleaning equipment. OEMs will showcase bentechnologies include fully biodegradable products that efits and disadvantages of both process technologies minimize the environmental effect. Studies also sugin an attempt to provide a sound platform to facilitate gest the organic content found from chemical isolation decision-making. (It is worth mentioning that during effluents is significantly below 1% by volume. the past few years, significant improvements have been Pb-free solder’s emergence brought about an intermade to both technologies.) esting trend that affects inline cleaning. In the past, the To effectively analyze and compare different cleanuse of OA fluxes coincided with the use of DI water to ing processes, the user has to take into account all the clean. Such machines rely on cascading DI water syselements of pure cost associated with cleaning and tems and do not run effectively with a cleaning agent, rinsing agents, including associated costs for disposal, because of the lack of a chemical isolation section. The electricity, compatibility, labor and equipment mainteincrease in soldering temperatures due to Pb-free opernance. Earlier studies suggest costs per cleaned board ations now makes the removal of OA flux significantly range from $0.20 to more than $1, depending on the harder. Because of equipment limitations, chemical situation (Figure 1). The determinant, then, will be the assistance is not possible, resulting in additional capital number of boards used. In other words, the variable expenditures. As a result, a chemical isolation section as cost aspects for inline processes vary as the number of a simple fallback should be considered (thus providing cleaned assemblies increases. Fixed costs will remain long-term cost savings). steady. Last, the user should consider future production With respect to other mechanical considerations, requirements. A smaller machine might be sufficient at the authors have established that with all professional present, but not so much if production requirements process installations currently available, residues can were to increase. be cleaned successfully, even under most demanding Conveyorized equipment can give specific attention standoff heights or geometries. The same holds true to to each and every board that enters the process. This batch cleaning operations, as their average cycle times minimizes process risks, as changes can be implementare three to five times longer than that of inline cleaned per board, and also leads to a high degree of process ing. Despite historically lower pressure settings, the control. Recent research on nozzle technologies shows prolonged cycle times are ample compensation. promising results, further permitting individualization. Spray pressure innovations have further helped Clearly, a fully automated process is designed for high batch systems compete with conveyorized machines. throughput operations, and it is here where such cleanSuch advancements, for instance, address operating ing equipment will be most economical overall. pressures and mechanisms to minimize spray shadowOne oft-cited limitation is the larger footprint. ing; the latter an often-cited customer concern. Some recent advances in cleaning nozzle efficiency Naturally, batch cleaners require somewhat more have provided shorter, more compact inline machines. laborious interaction, and typically process boards as Another concern is the rinse and wastewater generaa group, not individually. Throughput is beginning tion. Bigger machines generate up to 2 gpm or more to be addressed, but at the cost of a larger footprint. of wastewater. Depending on local requirements, effluent flow must be addressed. Recent cleaning agent $.90 $0.80 Cleaning Cost per board ($) P $1.00 $0.70 $0.60 $0.50 $0.40 $0.30 $0.20 $0.10 $0.0 0 100 200 300 400 500 600 700 800 90 0 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 Ravi Parthasarathy is a senior process engineer at Zestron America (zestron.com); r.parthasarathy@ zestron.com. Continued on pg. 65 66 Circuits Assembly MARCH 2008 circuitsassembly.com http://zestron.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - March 2008 Circuits Assembly - March 2008 Caveat Lector Letters Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing What Drives the Crowd? Mastering ESD Control in Automated Handling Systems Beating the RoHS Heat Trade Secrets True to Its Roots The Road Abroad - Strategic Alliance or Greenfield Facility? Tech Tips Wave Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Materials World Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - March 2008 Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 3) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 4) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 5) Circuits Assembly - March 2008 - Caveat Lector (Page 6) Circuits Assembly - March 2008 - Caveat Lector (Page 7) Circuits Assembly - March 2008 - Letters (Page 8) Circuits Assembly - March 2008 - Letters (Page 9) Circuits Assembly - March 2008 - Industry News (Page 10) Circuits Assembly - March 2008 - Industry News (Page 11) Circuits Assembly - March 2008 - Industry News (Page 12) Circuits Assembly - March 2008 - Industry News (Page 13) Circuits Assembly - March 2008 - Industry News (Page 14) Circuits Assembly - March 2008 - Industry News (Page 15) Circuits Assembly - March 2008 - Industry News (Page 16) Circuits Assembly - March 2008 - Industry News (Page BEST1) Circuits Assembly - March 2008 - Industry News (Page BEST2) Circuits Assembly - March 2008 - Market Watch (Page 17) Circuits Assembly - March 2008 - Talking Heads (Page 18) Circuits Assembly - March 2008 - Talking Heads (Page 19) Circuits Assembly - March 2008 - Focus on Business (Page 20) Circuits Assembly - March 2008 - Focus on Business (Page 21) Circuits Assembly - March 2008 - On the Forefront (Page 22) Circuits Assembly - March 2008 - On the Forefront (Page 23) Circuits Assembly - March 2008 - Screen Printing (Page 24) Circuits Assembly - March 2008 - Screen Printing (Page 25) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 26) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 27) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 28) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 29) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 30) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 31) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 32) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 33) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 34) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 35) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 36) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 37) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 38) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 39) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 40) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 41) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 42) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 43) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 44) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 45) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 46) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 47) Circuits Assembly - March 2008 - Trade Secrets (Page 48) Circuits Assembly - March 2008 - Trade Secrets (Page 49) Circuits Assembly - March 2008 - Trade Secrets (Page 50) Circuits Assembly - March 2008 - Trade Secrets (Page 51) Circuits Assembly - March 2008 - True to Its Roots (Page 52) Circuits Assembly - March 2008 - True to Its Roots (Page 53) Circuits Assembly - March 2008 - True to Its Roots (Page 54) Circuits Assembly - March 2008 - True to Its Roots (Page 55) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 56) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 57) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 58) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 59) Circuits Assembly - March 2008 - Tech Tips (Page 60) Circuits Assembly - March 2008 - Tech Tips (Page 61) Circuits Assembly - March 2008 - Wave Soldering (Page 62) Circuits Assembly - March 2008 - Wave Soldering (Page 63) Circuits Assembly - March 2008 - Test and Inspection (Page 64) Circuits Assembly - March 2008 - Test and Inspection (Page 65) Circuits Assembly - March 2008 - Process Doctor (Page 66) Circuits Assembly - March 2008 - Pb-Free Lessons Learned (Page 67) Circuits Assembly - March 2008 - Getting Lean (Page 68) Circuits Assembly - March 2008 - Materials World (Page 69) Circuits Assembly - March 2008 - Equipment Advances (Page 70) Circuits Assembly - March 2008 - Equipment Advances (Page 71) Circuits Assembly - March 2008 - Apex Product Preview (Page 72) Circuits Assembly - March 2008 - Apex Product Preview (Page 73) Circuits Assembly - March 2008 - Apex Product Preview (Page 74) Circuits Assembly - March 2008 - Apex Product Preview (Page 75) Circuits Assembly - March 2008 - Apex Product Preview (Page 76) Circuits Assembly - March 2008 - Apex Product Preview (Page 77) Circuits Assembly - March 2008 - Ad Index (Page 78) Circuits Assembly - March 2008 - Assembly Insider (Page 79) Circuits Assembly - March 2008 - Technical Abstracts (Page 80) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover4)
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