Circuits Assembly - March 2008 - (Page 70) Equipment Advances Juki’s FX-3 Modular Chipshooter J uki’s high-speed modular chipshooter, the FX-3, features two placement stations, each with two head beams. In each placement station, the two heads are arranged in front and behind each other, alternately carrying out component picking and placement. The four high-speed assembly heads each support six nozzles, for a total of 24 nozzles. The component placement range is from 01005 (0402 metric) through 33.5 mm sq. Each head is driven by an overhead x-y dual gantry positioning system with closed-loop independent linear servomotors and magnetic linear encoders. The y beam has dual synchronized linear motors for each station, both left and right. Each nozzle is controlled with independent z and AC servomotors featuring new encoders with a resolution of 260,000 pulses per revolution, for reliability and accuracy. Control of each nozzle is possible without affecting other nozzles. This reportedly aids machine uptime, as well as time between repairs. The design results in a placement rate of 60,000 cph (0.06 sec./chip), according to IPC-9850. The head unit is equipped with a new precision laser alignment and control system for both upper and lower rotary axes to improve efficiency. Placement is done via exclusive laser centering using the new CyberOptics LNC60 system. The LNC60 laser uses novel Tangent Line Centering, which takes multiple views of the component by rotating it 360° through the laser to achieve a full outline of the component. The LNC60 measures the component’s center, dimensions and angular correction in a single sweep. The machine features 1 µm linear encoders on the x and y axes. Combined, these enhancements improve placement accuracy to ±50 µm (Cpk >/= 1). Other important features of the LNC60 laser include the exact height of the nozzle tip, bent nozzle detection, and a tombstone pick. Additionally, it ensures a component is present before placement, and that the component has been placed successfully. The LNC60 laser measures components while they move from the pick to the placement site and never requires moving to a stationary camera or Line Scan Camera because it is built into the head, creating an efficient method of component measurement. The optical design of this laser has been simplified to provide higher reliability in a thinner and lighter package. The head unit is designed for easy maintenance. Vacuum filters have been moved for better access and reportedly require no adjustments or calibrations after replacement. Laser centering measures the components on the side. It is not affected by variations of compo- The FX-3 design places a reported 60,000 cph per IPC-9850. nent color or width/length; unlike vision centering, there is no need to edit component data for different component vendors. Component data can be completed by entering approximate dimensions, type and packaging information. The exact dimensions and lead count/pitch are measured by the machine and automatically entered into the component data. A vacuum self-calibration function eliminates the need for a vacuum “blowing-off ” during placement, which can disturb neighboring components or solder paste. Standard features include: • Pick position auto teach, for 8 mm components, to reduce changeover time and mis-picks. • OCC lighting system/fiducial recognition systems, which support a variety of board materials including flexible PCBs. Programmable brightness and directional lighting improves fiducial recognition. • Height measurement system, for quick, accurate measurement of component pick height. A laser sensor measures the distance instantly without physical contact. • Bad mark detection, which is performed using the machine’s standard downward-looking camera (also used for fiducials and teaching) and detects a range of marks on various substrates, including flex circuits. • Cast iron frame: A high-rigidity frame made by cast metal molding has excellent anti-vibration characteristics that support high-speed operation. • Operations can be carried out easily using the touch panel while referring to camera-recognized images. • Screens can be switched between real-time display in Japanese, English and Chinese. Available from Juki Automation Systems, jas-smt. com. ■ circuitsassembly.com 70 Circuits Assembly MARCH 2008 http://jas-smt.com http://jas-smt.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - March 2008 Circuits Assembly - March 2008 Caveat Lector Letters Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing What Drives the Crowd? Mastering ESD Control in Automated Handling Systems Beating the RoHS Heat Trade Secrets True to Its Roots The Road Abroad - Strategic Alliance or Greenfield Facility? Tech Tips Wave Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Materials World Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - March 2008 Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page Cover2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 1) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 2) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 3) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 4) Circuits Assembly - March 2008 - Circuits Assembly - March 2008 (Page 5) Circuits Assembly - March 2008 - Caveat Lector (Page 6) Circuits Assembly - March 2008 - Caveat Lector (Page 7) Circuits Assembly - March 2008 - Letters (Page 8) Circuits Assembly - March 2008 - Letters (Page 9) Circuits Assembly - March 2008 - Industry News (Page 10) Circuits Assembly - March 2008 - Industry News (Page 11) Circuits Assembly - March 2008 - Industry News (Page 12) Circuits Assembly - March 2008 - Industry News (Page 13) Circuits Assembly - March 2008 - Industry News (Page 14) Circuits Assembly - March 2008 - Industry News (Page 15) Circuits Assembly - March 2008 - Industry News (Page 16) Circuits Assembly - March 2008 - Industry News (Page BEST1) Circuits Assembly - March 2008 - Industry News (Page BEST2) Circuits Assembly - March 2008 - Market Watch (Page 17) Circuits Assembly - March 2008 - Talking Heads (Page 18) Circuits Assembly - March 2008 - Talking Heads (Page 19) Circuits Assembly - March 2008 - Focus on Business (Page 20) Circuits Assembly - March 2008 - Focus on Business (Page 21) Circuits Assembly - March 2008 - On the Forefront (Page 22) Circuits Assembly - March 2008 - On the Forefront (Page 23) Circuits Assembly - March 2008 - Screen Printing (Page 24) Circuits Assembly - March 2008 - Screen Printing (Page 25) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 26) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 27) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 28) Circuits Assembly - March 2008 - What Drives the Crowd? (Page 29) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 30) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 31) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 32) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 33) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 34) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 35) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 36) Circuits Assembly - March 2008 - Mastering ESD Control in Automated Handling Systems (Page 37) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 38) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 39) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 40) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 41) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 42) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 43) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 44) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 45) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 46) Circuits Assembly - March 2008 - Beating the RoHS Heat (Page 47) Circuits Assembly - March 2008 - Trade Secrets (Page 48) Circuits Assembly - March 2008 - Trade Secrets (Page 49) Circuits Assembly - March 2008 - Trade Secrets (Page 50) Circuits Assembly - March 2008 - Trade Secrets (Page 51) Circuits Assembly - March 2008 - True to Its Roots (Page 52) Circuits Assembly - March 2008 - True to Its Roots (Page 53) Circuits Assembly - March 2008 - True to Its Roots (Page 54) Circuits Assembly - March 2008 - True to Its Roots (Page 55) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 56) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 57) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 58) Circuits Assembly - March 2008 - The Road Abroad - Strategic Alliance or Greenfield Facility? (Page 59) Circuits Assembly - March 2008 - Tech Tips (Page 60) Circuits Assembly - March 2008 - Tech Tips (Page 61) Circuits Assembly - March 2008 - Wave Soldering (Page 62) Circuits Assembly - March 2008 - Wave Soldering (Page 63) Circuits Assembly - March 2008 - Test and Inspection (Page 64) Circuits Assembly - March 2008 - Test and Inspection (Page 65) Circuits Assembly - March 2008 - Process Doctor (Page 66) Circuits Assembly - March 2008 - Pb-Free Lessons Learned (Page 67) Circuits Assembly - March 2008 - Getting Lean (Page 68) Circuits Assembly - March 2008 - Materials World (Page 69) Circuits Assembly - March 2008 - Equipment Advances (Page 70) Circuits Assembly - March 2008 - Equipment Advances (Page 71) Circuits Assembly - March 2008 - Apex Product Preview (Page 72) Circuits Assembly - March 2008 - Apex Product Preview (Page 73) Circuits Assembly - March 2008 - Apex Product Preview (Page 74) Circuits Assembly - March 2008 - Apex Product Preview (Page 75) Circuits Assembly - March 2008 - Apex Product Preview (Page 76) Circuits Assembly - March 2008 - Apex Product Preview (Page 77) Circuits Assembly - March 2008 - Ad Index (Page 78) Circuits Assembly - March 2008 - Assembly Insider (Page 79) Circuits Assembly - March 2008 - Technical Abstracts (Page 80) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - March 2008 - Technical Abstracts (Page Cover4)
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