Circuits Assembly - March 2008 - (Page 72)

® ® PREVIEW Integrated Paste/Glue Dispenser iPAG integrated paste and glue dispenser module is production ready and can be integrated within the X6 and X4Pro printers. Comes with single or double heads, permitting glue, solder paste or both to be applied to substrates after printing. Deposits then can be inspected using EVA inspection technology. EKRA America, ekra-america.com Booth 1845 Product ESD-Lined PCB Storage The PCB Tray Storage Cart is designed to protect PCBs of all sizes during transport and storage. Is available in two standard sizes. Provides conductive trays with an electrostatic dissipative mat. The cart frame and brackets are manufactured from 14-gauge steel with a chrome epoxy finish. AGI Corp., agicorp.com Booth 1474 No-Clean Solder Reflows in Air Indium8.9 is an air reflow, no-clean Pb-free solder paste formulated to produce consistent print volumes through apertures below the minimum area ratio of 0.66. Exhibits low voiding (<5%) over many profiles when soldering BGAs with via-in-technology. Robust processing window said to minimize defects, and accommodate various board sizes and throughput requirements. Designed to be thermally stable and maintain a soft, pliable residue after reflow. Indium Corp., indium.com Booth 747 Noncontact Jet Dispenser Spectrum S-920 series scalable dispenser uses noncontact jetting and features software and hardware control based on Fluidmove XP software with process control features. Rapid response heater system reportedly minimizes startup time and delivers uniform heat across entire part surface. Controlled process heat software optional. Includes programmable fluid and valve pressure, mass flow control, calibrated process jetting, and a digital vision system. Can be configured with single or dual lanes, and one to three heat stations. Reportedly dispenses into 200 µm gaps; offers dispensing with flow rates up to 500 mg/sec. and shot rates up to 200 dots/sec. Asymtek, asymtek.com Booth 511 Post-Print Dispenser Module Stinger modular fluid dispense system expands capabilities of conventional screen printers by enabling dispense SMT adhesive or solder paste on a PCB, immediately following printing, while still in alignment from the screen print. Is coupled to the printer’s vision system by an electro-pneumatic interface that permits the module to be removed and reinstalled on the printer in seconds. Will dispense adhesive or paste on user-defined sites, while adjusting the dispense tip height with a laser-compensating servo-controlled z-axis. Is field-retrofittable. Ovation Products, grid-lok.com Booth 2471 ‘Low-Stress’ PCB Router Sayaka CT23NP inline PCB router combines low-stress depaneling with an easy programming feature using Windows XP image processing software. A turntable permits one board to be cut while another is uploaded. Flexible vacuum pickup and fixture permits depaneled board and waste to be unloaded simultaneously and safely. Other standard key features include automatic alignment by CCD camera, efficient dust collector, extended bit life and safety door. Sayaka/Seika Machinery, seikausa.com Booth 711 Solder Analysis, ID The LeadTracer-RoHS XRF system now comes with a solder analysis and identification feature that reportedly identifies all solder alloys within minutes. Performs solder pot analysis, permitting users to track changes in the process. Addresses potential weak links in the production chain. RMD Instruments, rmd-leadtracer.com Booth 1563 72 Circuits Assembly MARCH 2008 circuitsassembly.com http://ekra-america.com http://agicorp.com http://indium.com http://asymtek.com http://grid-lok.com http://seikausa.com http://rmd-leadtracer.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - March 2008

Circuits Assembly - March 2008 Caveat Lector Letters Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing What Drives the Crowd? Mastering ESD Control in Automated Handling Systems Beating the RoHS Heat Trade Secrets True to Its Roots The Road Abroad - Strategic Alliance or Greenfield Facility? Tech Tips Wave Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Materials World Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - March 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.