Circuits Assembly - April 2008 - (Page 14) NEWS People SCM supplier Zurvahn LLC named Jim Hutkay vice president of sales. He was previously an executive with Arrow Electronics Inc., Capstone Electronics and Anthem Electronics. Also, Jurgen Kruppa has been named vice president, business development, responsible for engineering services and prototype products. Electronic Systems Inc. named Lynne Mooney director of program management, responsible for leading customer relationships. She has 20 years’ EMS experience in medical, instrumentation, aerospace and industrial programs. DEK named David Byrd global manager for engineered products. He joined DEK in 2005 as America operations manager. Also, Kent Ang (pictured) was promoted to process manufacturing engineer, responsible for production for electroform and platinum stencils. Zestron promoted Ravi Parthasarathy to senior process engineer, responsible for key account management in North America. He will oversee initial cleaning process qualifications in Zestron’s Technical Center, process implementations, and process optimizations. The Millennia Group named Tip Turpin vice president, sales/marketing. He has 30 years’ experience in management, sales, marketing, and manufacturing, most recently with electronics component distributor Harry Krantz Co. The Morey Corp. named John Kennedy account manager. He has a bachelor’s in economics and business administration, and nearly 20 years’ sales and customer service experience, most recently with Interlake Material Handling. Sunburst Electronics named Kevin McDonough vice president of sales and marketing, replacing Dennis Cantoni, who retired. • The electronic licensing system will be upgraded to permit the submission of all types of defense trade licenses and to enable all agencies to access the same electronic information. • US controls on exports involving dual and third-country nationals from NATO and other allied countries will be updated. • A formal interagency dispute mechanism will be created to permit the timely resolution of licensing jurisdiction issues involving the departments of State and Commerce under the commodity jurisdiction process. • The National Security Council will undertake a review to make sure the CJ process is efficient and timely. • A multi-agency working group will be established to improve procedures for conducting export enforcement investigations. – Mike Buetow Industry New Solder Co. Enters China Fray OXFORD, UK - BizEsp Ltd. (bizesp.com) has announced the launch of Oxford Solders for electronics assembly products. The product line reportedly will be marketed toward Chinese and Indian manufacturers, and will include solder powders and pastes, fluxes and BGA spheres. The company will provide local service, support and training in China and India, and named Mauricia Wang business manager for China. The company is positioning itself as a provider of “green” products at China prices and better customer service. – Chelsey Drysdale EPM to Shutter US Plant MANCHESTER, NH – EMS firm EPM (epmnet.com) is closing its sole US factory and laying off 50 workers. The 45,000-sq. ft. factory, which opened in 2006, housed two SMT lines and was originally intented to give the Canadian company a foothold in the US. However, the firm had undergone a pair of management changes before deciding to pull the plug. – Mike Buetow CTS Acquires Orion Manufacturing ELKHART, IN – CTS Corp. (ctscorp.com) announced the acquisition of privately held Orion Manufacturing Inc. for approximately $10 million in cash. CTS expects the transaction to be accretive in the first year. Under terms of the agreement, CTS may pay up to an additional $1.75 million in cash based on the achievement of certain financial targets in 2008 and 2009. San Jose-based Orion provides electronics manufacturing services to the defense, aerospace, industrial and medical markets. It had 2007 sales of approximately $27 million. The move will push CTS's estimated annual EMS revenues over $400 million. CTS will combine its operation in Santa Clara, CA, with Orion. – Mike Buetow Tin Whiskers Email Forum Open SAN JOSE – An email forum for discussing tin whisker issues and research has been created and is up and running. The forum, also known as a listserv, came from discussions among numerous engineers interested in mitigating potential risks to high reliability products. To subscribe to the list, sending an email to tinwhiskers-request@freelists.org with “subscribe” in the subject field. – Mike Buetow circuitsassembly.com 14 Circuits Assembly APRIL 2008 http://bizesp.com http://epmnet.com http://ctscorp.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008 Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - April 2008 Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover2) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 2) Circuits Assembly - April 2008 - Contents (Page 3) Circuits Assembly - April 2008 - Contents (Page 4) Circuits Assembly - April 2008 - Contents (Page 5) Circuits Assembly - April 2008 - Caveat Lector (Page 6) Circuits Assembly - April 2008 - Caveat Lector (Page 7) Circuits Assembly - April 2008 - Industry News (Page 8) Circuits Assembly - April 2008 - Industry News (Page 9) Circuits Assembly - April 2008 - Industry News (Page 10) Circuits Assembly - April 2008 - Industry News (Page 11) Circuits Assembly - April 2008 - Industry News (Page 12) Circuits Assembly - April 2008 - Industry News (Page 13) Circuits Assembly - April 2008 - Industry News (Page 14) Circuits Assembly - April 2008 - Industry News (Page 15) Circuits Assembly - April 2008 - Market Watch (Page 16) Circuits Assembly - April 2008 - Talking Heads (Page 17) Circuits Assembly - April 2008 - Screen Printing (Page 18) Circuits Assembly - April 2008 - Screen Printing (Page 19) Circuits Assembly - April 2008 - Better Manufacturing (Page 20) Circuits Assembly - April 2008 - Better Manufacturing (Page 21) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 22) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 23) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 24) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 25) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 26) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 27) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 28) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 29) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 30) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 31) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 32) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 33) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 34) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 35) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 36) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 37) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 38) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 39) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 40) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 41) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 42) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 43) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 44) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 45) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 46) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 47) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 48) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 49) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 50) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 51) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 52) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 53) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 54) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 55) Circuits Assembly - April 2008 - Growing Your Brand (Page 56) Circuits Assembly - April 2008 - Growing Your Brand (Page 57) Circuits Assembly - April 2008 - Growing Your Brand (Page 58) Circuits Assembly - April 2008 - Growing Your Brand (Page 59) Circuits Assembly - April 2008 - Growing Your Brand (Page 60) Circuits Assembly - April 2008 - Growing Your Brand (Page 61) Circuits Assembly - April 2008 - This Year’s Model (Page 62) Circuits Assembly - April 2008 - This Year’s Model (Page 63) Circuits Assembly - April 2008 - Tech Tips (Page 64) Circuits Assembly - April 2008 - Reflow Soldering (Page 65) Circuits Assembly - April 2008 - Process Doctor (Page 66) Circuits Assembly - April 2008 - Process Doctor (Page 67) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 68) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 69) Circuits Assembly - April 2008 - Getting Lean (Page 70) Circuits Assembly - April 2008 - Getting Lean (Page 71) Circuits Assembly - April 2008 - Getting Lean (Page 72) Circuits Assembly - April 2008 - Getting Lean (Page 73) Circuits Assembly - April 2008 - Equipment Advances (Page 74) Circuits Assembly - April 2008 - Equipment Advances (Page 75) Circuits Assembly - April 2008 - Apex Product Preview (Page 76) Circuits Assembly - April 2008 - Apex Product Preview (Page 77) Circuits Assembly - April 2008 - Ad Index (Page 78) Circuits Assembly - April 2008 - Assembly Insider (Page 79) Circuits Assembly - April 2008 - Technical Abstracts (Page 80) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover4)
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