Circuits Assembly - April 2008 - (Page 16) W TCH A Navigating Up Trends in the U.S. electronics equipment market (shipments only). % Change Jan.* YTD Nov. Dec.r Computers and electronics products Computers Storage devices Other peripheral equipment Nondefense communications equipment Defense communications equipment A/V equipment Semiconductors Components1 Nondefense search and navigation equipment Defense search and navigation equipment Medical, measurement and control -0.1 0.5 1.8 -5.4 3.4 12.6 5.0 -0.7 -0.9 3.9 0.7 -3.3 0.8 2.9 -4.6 9.3 4.0 -11.9 -6.4 -1.1 2.9 -7.4 6.1 -2.6 6.2 0.2 9.2 -4.6 -4.5 6.6 -4.4 21.9 2.6 13.4 3.4 10.5 9.3 10.3 19.2 0.5 -0.6 16.2 -16.2 10.3 2.5 28.0 10.0 23.7 Market Edited by Chelsey Drysdale Car Electronics to Grow 13% in 2008 ARLINGTON, VA – Sales of in-vehicle consumer electronics will grow at a rate of 13% to more than $12.8 billion in 2008, according to the Consumer Electronics Association (ce.org). The typical American spends nearly 17 hours a week in their car, the CEA says, and 38% of drivers intend to purchase and install an in-vehicle CE product during the next year. At the top of the list are remote vehicle starters (15%), in-dash navigation systems (13%) and car alarms (12%). There are also strong purchase intentions for technologies like satellite radio, HD radio and DVD players, the company reports. rRevised. *Preliminary. 1Includes semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, March 5, 2008 Strong Demand Boosts Smaller Display Prices EL SEGUNDO, CA – Consumers are snapping up digital photo frames and tiny televisions, spurring a period of supply tightness and price increases for small/medium displays that is expected to linger through the first quarter, says iSuppli Corp (isuppli.com). In general, prices for smaller-sized small/medium displays are remaining steady or decreasing slightly, while larger displays are experiencing price increases. For 2008, small/medium display revenue is expected to rise to $27.6 billion, up 14.7% compared to 2007. Demand and supply are almost even, the firm says. “Availability of some screens has been constrained, which led to something that hasn’t been seen in the small/medium display market for a year: price increases,” said Vinita Jakhanwal, principal analyst, mobile displays. February Manufacturing Fails to Grow TEMPE, AZ – The manufacturing sector failed to grow in February, as the PMI dipped slightly to 48.3%. New orders decreased 40 basis points – the third straight month below parity, says the Institute for Supply Management (ism.ws), which issued the report. For the month, backlogs fell, but at their slowest rate since October. Production slipped 4.5 points. Inventories fell sharply as manufacturers pared stocks, and customer inventories were down marginally as well. The overall economy grew for the 76th consecutive month. “The manufacturing sector failed to grow during the month, as the PMI fell below 50%, which indicates weaker performance in February compared to January,” said ISM spokesperson, Norbert J. Ore. “Manufacturers' order backlogs continue to erode. With manufacturing inventories at reasonable levels, the major concern is rising prices and falling volume.” Oct. PMI New orders Production Inventories Customer inventories Backlogs 50.9 52.5 49.6 47.2 54.0 46.0 Nov. 50.8 52.6 51.9 46.9 49.0 41.5 Dec. 48.4 46.9 48.6 45.4 51.5 43.0 Jan. 50.7 49.5 55.2 49.1 49.5 44.0 Feb. 48.3 49.1 50.7 45.4 49.0 45.0 2008 Component Orders Flat ARLINGTON, VA – Sales of electronics components will grow at essentially the same rate or slightly higher this year than in 2007, and the markets determining component supply and demand look positive, in spite of a precarious economy, says ECA (ec-central.org). After an uptick in December, component orders dropped in January, keeping the 12-month order average somewhat flat, the firm says. Consumer electronics – the market driver of late – will grow 6.1% this year, ECA predicts, while iSuppli (isuppli.com) forecasts a 7% rise in global electronics gear revenue. Source: Institute for Supply Management, March 3, 2008 Industry Market Snapshot Book-to-bills of various components/equipment. Sept. Semiconductor equipment1 Semiconductors2 Rigid PCBs3 (North America) Flexible PCBs3 (North America) Computers/electronic products4 Sources: 1SEMI, 2SIA Metals Index Nov. 0.82 4.39% 1.06 1.02 4.97 Bureau, Dec. 0.85r 3.27%r 1.01 1.00 4.94r Jan. 0.89p 1.70%p 0.97 0.96 4.73p Date LME Cash Seller and Settlement for Tin LME Cash Seller and Settlement for Lead Handy and Harman Silver (COMEX Silver) LME Cash Seller and Settlement for Copper 3/12/07 $6.28 $0.85 $188.29 $2.80 Price Per Lb. 12/10/07 1/07/08 $7.44 $1.14 $213.94 $3.04 $7.51 $1.21 $224.57 $3.14 2/11/08 $7.69 $1.37 $251.64 $3.55 3/10/08 $8.73 $1.43 $294.94 $3.93 Oct. 0.80 4.58% 1.08 1.10 4.98 3IPC , 4Census 0.79 4.39% 1.08 1.08 4.90 (3-month moving average growth), ppreliminary, rrevised 16 Circuits Assembly APRIL 2008 circuitsassembly.com http://ce.org http://isuppli.com http://ec-central.org http://isuppli.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008 Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - April 2008 Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover2) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 2) Circuits Assembly - April 2008 - Contents (Page 3) Circuits Assembly - April 2008 - Contents (Page 4) Circuits Assembly - April 2008 - Contents (Page 5) Circuits Assembly - April 2008 - Caveat Lector (Page 6) Circuits Assembly - April 2008 - Caveat Lector (Page 7) Circuits Assembly - April 2008 - Industry News (Page 8) Circuits Assembly - April 2008 - Industry News (Page 9) Circuits Assembly - April 2008 - Industry News (Page 10) Circuits Assembly - April 2008 - Industry News (Page 11) Circuits Assembly - April 2008 - Industry News (Page 12) Circuits Assembly - April 2008 - Industry News (Page 13) Circuits Assembly - April 2008 - Industry News (Page 14) Circuits Assembly - April 2008 - Industry News (Page 15) Circuits Assembly - April 2008 - Market Watch (Page 16) Circuits Assembly - April 2008 - Talking Heads (Page 17) Circuits Assembly - April 2008 - Screen Printing (Page 18) Circuits Assembly - April 2008 - Screen Printing (Page 19) Circuits Assembly - April 2008 - Better Manufacturing (Page 20) Circuits Assembly - April 2008 - Better Manufacturing (Page 21) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 22) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 23) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 24) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 25) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 26) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 27) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 28) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 29) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 30) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 31) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 32) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 33) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 34) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 35) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 36) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 37) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 38) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 39) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 40) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 41) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 42) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 43) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 44) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 45) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 46) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 47) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 48) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 49) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 50) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 51) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 52) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 53) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 54) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 55) Circuits Assembly - April 2008 - Growing Your Brand (Page 56) Circuits Assembly - April 2008 - Growing Your Brand (Page 57) Circuits Assembly - April 2008 - Growing Your Brand (Page 58) Circuits Assembly - April 2008 - Growing Your Brand (Page 59) Circuits Assembly - April 2008 - Growing Your Brand (Page 60) Circuits Assembly - April 2008 - Growing Your Brand (Page 61) Circuits Assembly - April 2008 - This Year’s Model (Page 62) Circuits Assembly - April 2008 - This Year’s Model (Page 63) Circuits Assembly - April 2008 - Tech Tips (Page 64) Circuits Assembly - April 2008 - Reflow Soldering (Page 65) Circuits Assembly - April 2008 - Process Doctor (Page 66) Circuits Assembly - April 2008 - Process Doctor (Page 67) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 68) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 69) Circuits Assembly - April 2008 - Getting Lean (Page 70) Circuits Assembly - April 2008 - Getting Lean (Page 71) Circuits Assembly - April 2008 - Getting Lean (Page 72) Circuits Assembly - April 2008 - Getting Lean (Page 73) Circuits Assembly - April 2008 - Equipment Advances (Page 74) Circuits Assembly - April 2008 - Equipment Advances (Page 75) Circuits Assembly - April 2008 - Apex Product Preview (Page 76) Circuits Assembly - April 2008 - Apex Product Preview (Page 77) Circuits Assembly - April 2008 - Ad Index (Page 78) Circuits Assembly - April 2008 - Assembly Insider (Page 79) Circuits Assembly - April 2008 - Technical Abstracts (Page 80) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover4)
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