Circuits Assembly - April 2008 - (Page 3)

Cleaning After Hand Soldering, pg. 28 APRIL 2008 circuitsassembly.com Reaction Formation Making Great Solder Joints with Less Nitrogen APRIL 2008 – Vol. 19 No. 4 Integrating SiPs New ESD Requirements Printer Assessments FIRST PERSON 6 Caveat Lector Broken chains. Mike Buetow FEATURES Component Packaging ON THE COVER: Flux chemistry can dramatically affect solder joint results. 17 Talking Heads KPS’s Pierre de Villemejane. Mike Buetow 22 Design and Modeling of High-Speed, HighDensity 3-D CSPs and Memory Modules DDR2 pushed memory clock frequencies to 400 MHz and data rates to 800 Mbps. DDR3 further pushes clock frequencies to 800 MHz, while DDR4 is up to 1.6 GHz. New packaging technologies such as die stacking and package-on-package (PoP) are being developed to accommodate the advances. By Dr. Frank Y. Yuan and Richard Crisp TECH TALK 18 Screen Printing Equipment assessment methods. Dr. Rita Mohanty Benchtop Cleaning 28 The ‘Big Brush Off’ Revisited In rework and repair, if you can’t rinse, you can’t clean. A prescription for cleaning a board after hand-soldering. By Mike Jones 20 Better Manufacturing Big, bad black pad. Phil Zarrow COVER STORY 64 Tech Tips Pulled apart. American Competitiveness Institute 32 Impact of Soldering Atmosphere on Solder Joint Formation This collaborative effort between Flextronics and Vitronics Soltec investigated different techniques that can significantly reduce nitrogen consumption without affecting final assembly quality. Alternative nitrogen supply methods were studied, such as applying nitrogen only on the reflow areas in combination with different oxygen ppm levels during reflow process and their impact on the secondary wave soldering process of copper OSP PCBs. By Ursula Marquez de Tino, Dr. Denis Barbini and Wesley Enroth 65 Reflow Soldering ‘Weighing’ thermal profiling. Dr. Denis Barbini 66 Process Doctor Finding chemistry in cleaning. Dr. Mike Bixenman Packaging Developments 44 Beyond Moore’s Law Evolving 3-D system-in-packaging architectures require advanced co-design tools linked with modeling and simulation capability to facilitate effective collaboration between system, device and packaging engineers, and new materials that meet environmental requirements. But as an integrator of components and technologies from different areas, SiP is positioned to become a primary architecture. By Dr. W.R. Bottoms 68 Pb-Free Lessons Learned Paging Ben Franklin. Chrys Shea 70 Getting Lean Don’t design in cost. Chris Munroe Protecting Parts 50 ESD Control For Class 0 ESDS Devices A summary of problems associated with protecting state-of-the-art devices with standard ESD controls, and specific controls necessary for reliable protection for devices sensitive between 20 and 100V. By Roger Peirce 74 Equipment Advances Siemens’ X4i placement machine. 80 Technical Abstracts DEPARTMENTS 8 16 76 78 79 Industry News Market Watch Apex Product Preview Ad Index Assembly Insider Program Management 56 Growing Your Brand For nearly three decades, Sue Mucha has led EMS marketing teams at companies large and small, public and private. Now the CIRCUITS ASSEMBLY columnist has written about her experiences prepping EMS teams on growth strategies in a new book. By Mike Buetow ESD Standards 62 This Year’s Model ESD qualification methods for ICs have a history requiring performance to human-body-model levels of 2kV, and in some cases 200V for machine model levels. New investigations on target levels establish more realistic levels for HBM and MM. By Dr. Charvaka Duvvury and Dr. Harald Gossner Photo by Mariano Ruiz ow Sh ex Ap ue Iss http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008

Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - April 2008

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