Circuits Assembly - April 2008 - (Page 6) Caveat Lector A Logistical Nightmare recall, about seven years ago, then Viasystems vice president of global supply chain management Ken Pastewka telling me the EMS firm was seeking five layers of visibility into its supply chain “all the way back to the mines.” It seemed like a great idea. OEMs could “see” into their EMS suppliers and vice versa, thus averting costly overinventor y issues. Further down the line, assemblers and fabricators could ascertain stock levels and constraints at their suppliers, thus achieving long-sought supply chain balance. The news last month that Congolese rebel soldiers are running national tin mines – the same mines that ultimately supply many leading assemblers around the world – made painfully clear Mr. Pastewka’s vision most decidedly has not come to fruition. Among the mines being run by the renegades is the Bisie mine, which produces 63% of Congo’s tin exports, according to British government estimates. The resulting journey the tin (which is mined as cassiterite and yields tin after smelting) takes as it makes its way into everything from video games to TVs is wreaking havoc with consumer electronics firms intent on following best practices for corporate humanitarianism. As reported by the Financial Times in early March, Congolese-mined tin is finding its way through middlemen to solder manufacturers in Asia. That uncomfortable fact is spurring several big-name OEMs, Hitachi, Microsoft, Pioneer and Samsung among them, to investigate the possibility they could be indirectly procuring tin solder from these unlawful miners. According to the FT, the Malaysia Smelting Corp. Berhad purchases about 12% of its tin ore from the region. The FT fingered Hitachi, Kenwood, Panasonic, Pioneer and Sony as among the companies that purchase the refined solder powder from Malaysia Smelting’s customers. This is disconcerting on many levels, not the least of which is that the Congo is Ground Zero to the world’s deadliest battles since World War II. More than 5 million people have perished there over the past decade, and the United I Nations estimates more than 1,000 people a day are dying as result of the ongoing conflict. The Bisie mine is controlled by rebel Congolese soldiers accused of a long list of crimes: forced labor, robbing other miners, illegal taxing, rape, torture, murder. It was somewhat reassuring to hear the OEMs aren’t taking the news lightly. Samsung has asked for an investigation into its component suppliers’ tin, while Hitachi said the company would review compliance of primary suppliers. Pioneer is also said to be taking the allegations seriously and looking thoroughly into the matter. Yet for electronics companies, this represents another potential black mark on their supplychain management report card. One need only consider the recent problems of counterfeit parts plaguing the industry – as we’ve reported often over the past year – to draw the conclusion that the space between EMS companies’ boasts of expertise in supply-chain management and logistics and what is really happening when laborers (some reportedly as young as 12) descend into the sweaty depths of the earth to extract much-needed metals is more gulf than gap. It also casts doubt on the ability of OEMs and EMS firms to ensure their solder vendors are following the rules. As the saying goes, a chain is only as strong as its weakest link. None of this is helped by the fact that tin prices have run up 39% over the past 12 months (see Market Watch, page 16), and – tin being a core replacement constituent to lead in solder – as the leadfree movement hits full stride, there’s no end in sight. It is an exceedingly difficult task, we know, to truly be in command of every detail of your supply chain. An appeal of outsourcing is that it obviates us from direct responsibility for all sorts of unpleasantries. But knowing I might be in some small part accountable for funding the hatcheting of some of the most vulnerable people on earth would certainly keep me up at night. It is incumbent on all of us not to dismiss this as something else to outsource. Mike Buetow, Editor-in-Chief mbuetow@upmediagroup.com 6 Circuits Assembly APRIL 2008 circuitsassembly.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008 Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - April 2008 Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover2) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 2) Circuits Assembly - April 2008 - Contents (Page 3) Circuits Assembly - April 2008 - Contents (Page 4) Circuits Assembly - April 2008 - Contents (Page 5) Circuits Assembly - April 2008 - Caveat Lector (Page 6) Circuits Assembly - April 2008 - Caveat Lector (Page 7) Circuits Assembly - April 2008 - Industry News (Page 8) Circuits Assembly - April 2008 - Industry News (Page 9) Circuits Assembly - April 2008 - Industry News (Page 10) Circuits Assembly - April 2008 - Industry News (Page 11) Circuits Assembly - April 2008 - Industry News (Page 12) Circuits Assembly - April 2008 - Industry News (Page 13) Circuits Assembly - April 2008 - Industry News (Page 14) Circuits Assembly - April 2008 - Industry News (Page 15) Circuits Assembly - April 2008 - Market Watch (Page 16) Circuits Assembly - April 2008 - Talking Heads (Page 17) Circuits Assembly - April 2008 - Screen Printing (Page 18) Circuits Assembly - April 2008 - Screen Printing (Page 19) Circuits Assembly - April 2008 - Better Manufacturing (Page 20) Circuits Assembly - April 2008 - Better Manufacturing (Page 21) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 22) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 23) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 24) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 25) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 26) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 27) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 28) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 29) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 30) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 31) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 32) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 33) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 34) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 35) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 36) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 37) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 38) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 39) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 40) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 41) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 42) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 43) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 44) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 45) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 46) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 47) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 48) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 49) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 50) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 51) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 52) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 53) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 54) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 55) Circuits Assembly - April 2008 - Growing Your Brand (Page 56) Circuits Assembly - April 2008 - Growing Your Brand (Page 57) Circuits Assembly - April 2008 - Growing Your Brand (Page 58) Circuits Assembly - April 2008 - Growing Your Brand (Page 59) Circuits Assembly - April 2008 - Growing Your Brand (Page 60) Circuits Assembly - April 2008 - Growing Your Brand (Page 61) Circuits Assembly - April 2008 - This Year’s Model (Page 62) Circuits Assembly - April 2008 - This Year’s Model (Page 63) Circuits Assembly - April 2008 - Tech Tips (Page 64) Circuits Assembly - April 2008 - Reflow Soldering (Page 65) Circuits Assembly - April 2008 - Process Doctor (Page 66) Circuits Assembly - April 2008 - Process Doctor (Page 67) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 68) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 69) Circuits Assembly - April 2008 - Getting Lean (Page 70) Circuits Assembly - April 2008 - Getting Lean (Page 71) Circuits Assembly - April 2008 - Getting Lean (Page 72) Circuits Assembly - April 2008 - Getting Lean (Page 73) Circuits Assembly - April 2008 - Equipment Advances (Page 74) Circuits Assembly - April 2008 - Equipment Advances (Page 75) Circuits Assembly - April 2008 - Apex Product Preview (Page 76) Circuits Assembly - April 2008 - Apex Product Preview (Page 77) Circuits Assembly - April 2008 - Ad Index (Page 78) Circuits Assembly - April 2008 - Assembly Insider (Page 79) Circuits Assembly - April 2008 - Technical Abstracts (Page 80) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover4)
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