Circuits Assembly - April 2008 - (Page 63)

ESD Standards • The inherent MM dependence on HBM indicates a worst-case MM level is 30V for HBM between 500V to 2000V. • While MM level is always available through HBM meaISO 9001:2000 surements, both 1kV HBM and 30V MM guarantee safe production within basic ESD-controlled areas. • Finally, the Council recommends adoption of 1kV Over 65 Adhesive & Dispensing Manufacturers HBM as the relevant new target requirement for IC Next-Generation Electronics Assembly qualification across all technologies to maintain the same product quality seen at suppliers, customers and PCB Assembly & Protection product end-users. Invariably the question arises whether the new recomThermal Management mended levels would have an impact on system-level ESD performance. First, as evidenced by the more than 20 bilRoHS Compliant lion unit data, no increase in system failures have been Lead-Free Technology seen, even for products at 500V or 1kV HBM. Second, when the IC is placed in a system board, UV & LED Cure Systems unless it has direct interface pins, the system-level ESD test (which is very different from the component-level 75 Sales Reps Offering Adhesive, Dispensing, Curing & Cost Saving Solutions test) shows no impact. The protection for these types of interface pins is tested with the IEC method at the system www.ellsworth.com level (IEC standard 61000-4-2), when the IC is mounted Shop • RFQ • Online Tech Support • MSDS / TDS Search in the application board. Thus, the strategy of system 800-888-0698 • 262-253-8600 protection design is different and requires a completely U.S. • Mexico • Europe • Asia • Canada • Malaysia separate focus. But, the important point remains that a component-level ESD reduction has never shown sensitivity to system-level performance for products with no direct interface to the outside world. The Council’s findings and recommendations are Ellsworth_CircuitAssembly_3.375x1 1 3/6/08 comprehensively documented in a white paper 1 published Supplying innovative, in August 2007. The Council is diligently working to advanced electronic establish similar realistic requirements for charged device interconnect solutions model (CDM). ■ 8:52:58 AM Reference 1. White Paper 1: A Case for Lowering Component Level HBM/MM ESD Specifications and Requirements, esdtargets.blogspot.com, August 2007. Ed.: This was written on behalf of the Industry Council on ESD Target Levels, consisting of experts from ESD test equipment suppliers, major semiconductor corporations, OEMs and EMS. Dr. Charvaka Duvvury is a Texas Instruments Fellow at Texas Instruments (ti.com); c-duvvury@ti.com. Dr. Harald Gossner is manager, ESD division, at Infineon Technologies (infineon.com). consisting of fabrication and assembly of complex PCBs, advanced ﬂip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. Stop by and see us in Booth #1911 at the IPC Printed Circuits Expo, APEX and the Designers Summit www.endicottinterconnect.com circuitsassembly.com Circuits Assembly APRIL 2008 63 http://www.ellsworth.com http://www.ellsworth.com http://esdtargets.blogspot.com http://ti.com http://infineon.com http://www.endicottinterconnect.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008

Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - April 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.