Circuits Assembly - April 2008 - (Page 76)

® ® PREVIEW High Feeder Count Multifunctional Placement iineo-II, a flexible, dual-gantry SMT assembly machine, comes with eight or 12 spindle rotary heads. Handles maximum PCB sizes of 18” x 20” (standard) with options to handle up to 24” x 28”, and features standard placement accuracy of 35 µm (QFPs) to 60 µm (chips), a range of intelligent feeders from eight through 88 mm tapes, an intelligent beltfeeder for sticks, a matrix tray holder and a feeder capacity of 264 x 8 mm. Europlacer, europlacer.com Booth 1624 Product Water-Soluble Pb-Free Solder Paste EnviroMark 828 solder paste combines low voiding, high wetting and ease of cleaning. Is said to be extremely stable in stencil printing, regardless of print speed, idle time and throughput. Highly wettable with a wide variety of board and component finishes. Kester Inc., kester.com Booth 1660 Aqueous Cleaner for Batch Washers Aquanox A4625B biodegradable low-VOC aqueous chemistry removes all types of flux residues, including Pb-free, in batch washers. Is environmentally friendly, has a long tank life and low maintenance cost. Is said to provide brilliant mirrored finishes even after multiple cleaning cycles. Is non-flammable and non-corrosive. Kyzen Corp., kyzen.com Booth 2219 Boundary Scan/ Vectorless Hybrid for ICT Medalist VTEP v2.0 vectorless test suite, for ICT, is a hybrid between boundary scan and VTEP vectorless testing. Features digital stimulus capability and reduces need for text fixtures and probing. Permits PCB designs with less electrical test access. Agilent Technologies, agilent.com/see/ vtep Booth 1735 Selective Soldering Fluxer KISS-104F inline fluxer is said to flux only the specific components to be selectively soldered. Applies flux via X-Y motion under programmable control. Reportedly reaches all areas of a PCB panel up to 18” x 24”. Features standard precision aerosol flux applicator with a deposition range of 4 to 25 mm, and an optional drop-jet applicator with dot size as small as 1.5 mm. Can be configured with multiple applicators to apply mixed flux chemistry. Accepts all conventional flux chemistries. ACE Production Technologies, ace-protech.com Booth 335 Batch Cleaners AquaTherm family of high-performance batch cleaners features a flexible cleaning system. Has steam-cleaning capability via an onboard steam generator. Austin American Technology, aat-corp. com Booth 2249 Oven Temperature Profiler Surveyor reflow oven thermal performance monitor includes fixed sensors and SPC analysis to automatically identify outof-tolerance conditions. Comes with sensor that reportedly eliminates variables associated with thermocouple attachment; an adjustable frame that rides on the oven’s rail or mesh belt; new software that automatically stores profiles for easy analysis. Said to eliminate test boards. Datapaq, datapaq.com Booth 1438 High Durability Fluid Reservoir Tanks ASME-certified fluid reservoir tanks include top and bottom-ported models ranging from 2 qt. to 5 gal. Top-ported reservoirs are said to be suitable for liquids less than 150,000 cps and bottomported reservoirs for fluids less than 300,000 cps. Manufactured from highgrade stainless steel or aluminum. Come in bottle-type with a narrow opening, or open-top for insertion of liners and containers. Supplied with a 10’ fluid hose and 0.25” air line. I&J Fisnar Inc., ijfisnar.com Booth 571 Closed-Loop Stencil Cleaner EnviroGuard aqueous stencil cleaner is said to clean all types of solder paste with a 100% closed-loop wash and rinse process. Filtration/UV system ensures no VOCs. Low-maintenance filters need changing twice annually. Retrofits to certain stencil cleaners. Smart Sonic, smartsonic.com Booth 1664 76 Circuits Assembly APRIL 2008 circuitsassembly.com http://europlacer.com http://kester.com http://kyzen.com http://agilent.com/see/vtep http://agilent.com/see/vtep http://ace-protech.com http://www.aat-corp.com http://www.aat-corp.com http://datapaq.com http://ijfisnar.com http://smartsonic.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008

Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - April 2008

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