Circuits Assembly - April 2008 - (Page 78) Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. Special Advertising Section Assembly Insider Aim Solder, www.aimsolder.com . . . . . . . . . . . . . . . . . . . . . . . . . 51 AMTECH, www.solderproducts.com . . . . . . . . . . . . . . . . . . . . . . . 13 Aqueous Technologies, www.aqueoustech.com . . . . . . . . . . . . . . 57 Assembleon, www.assembleon.com/facts . . . . . . . . . . . . . . . . . . C4 Asymtek, www.asymtek.com. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Balver Zinn, www.balverzinn.com . . . . . . . . . . . . . . . . . . . . . . . . 21 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 78 BEST, Inc., www.solder.net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 BPM Microsystems, www.bpmicro.com . . . . . . . . . . . . . . . . . . . . 37 Cognex Corporation, www.cognex.com . . . . . . . . . . . . . . . . . . . . . 23 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . 39 DDi, www.ddiglobal.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ECD, www.ecd.com/mm20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 eFabPCB, www.efabpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 EFD, Inc., www.efdsolder.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 EISCC 2008, www.erai.com/publicvegas08.aspx . . . . . . . . . . . . . 63 Electronics Group of Henkel, www.electronics.henkel.com . . . . . . . 4 Ellsworth Adhesives, www.ellsworth.com . . . . . . . . . . . . . . . . . . . 75 Endicott Interconnect Technologies, www.eitny.com. . . . . . . . . . . 75 ERSA, www.ersa.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C2 Essemtec USA, www.essemtec.com . . . . . . . . . . . . . . . . . . . . . . . 40 Europlacer, www.europlacer.com . . . . . . . . . . . . . . . . . . . . . . . . . 42 FCT Assembly, www.fctassembly.com . . . . . . . . . . . . . . . . . . . . . 51 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 IBE SMT Equipment, www.ibesmt.com . . . . . . . . . . . . . . . . . . . . . 79 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 Innov-X Systems, www.innovxsys.com . . . . . . . . . . . . . . . . . . . . . 27 Insulfab, www.insulfab.com. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ITW Chemtronics, www.chemtronics.com . . . . . . . . . . . . . . . . . . . 19 JNJ Industries, Inc., www.jnj-industries.com . . . . . . . . . . . . . . . . 78 Juki Automation Systems, www.jas-smt.com . . . . . . . . . . . . . . . 33 KIC, www.kicthermal.com. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Kyzen Corporation, www.kyzen.com . . . . . . . . . . . . . . . . . . . . . . . 47 MEPTEC MEMS Symposium, www.meptec.org . . . . . . . . . . . . . . . 71 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . . . . 49 Mydata Automation, www.mydata.com . . . . . . . . . . . . . . . . . . . . C3 NEPCON East 2008, www.nepconeast.com . . . . . . . . . . . . . . . . . 77 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . 51 OK International, www.okinternational.com . . . . . . . . . . . . . . . . . 29 P. Kay Metal, Inc., www.pkaymetal.com . . . . . . . . . . . . . . . . . . . . . 5 Panasonic Factory Solutions Company of America, www.panasonicfa.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 phoenix|x-ray Systems + Services GmbH, www.phoenix-xray.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 79 RMD Instruments, www.rmd-leadtracer.com . . . . . . . . . . . . . . . . 55 SEHO Systems GmbH, www.seho.de . . . . . . . . . . . . . . . . . . . . . . . 41 Siemens Energy & Automation, www.siplace.com . . . . . . . . . . . . 15 SMT/Hybrid/Packaging 2008, www.smt-exhibition.com . . . . . . . . 73 Speedline Technology, www.speedlinetech.com . . . . . . . . . . . . . . 9 Virtual PCB, www.virtual-pcb.com . . . . . . . . . . . . . . . . . . . . . . . 69 Viscom Inc., www.viscomusa.com . . . . . . . . . . . . . . . . . . . . . . . . 35 Vision Engineering, www.visioneng.com/shop . . . . . . . . . . . . . . . 79 Vitronics Soltec, www.vitronics-soltec.com . . . . . . . . . . . . . . . . . 11 VJ Electronix, www.vjelectronix.com . . . . . . . . . . . . . . . . . . . . . . . 59 www.efabpcb.com Easy to use instant on-line quoting If you have any questions or need assistance Call Toll Free 1-877-332-2722 Or Contact - sales@efabpcb Prototypes thru Production Check out our low prices and save big $ Save more with our Proto-Power Pack Specials! Single sided – Double sided – Multilayer Thermagon – Flex and Rigid Flex Quality PCBs at Competitive Prices! Let us be your on-line PCB shop Lead free / RoHS finishes available ENIG – Immersion Silver – Immersion Tin OSP – Lead Free Solder efabpcb is a UL-approved – ISO9001:2000 certified facility Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Susan Jones Group Sales Director, (404) 822-8900 email: sjones@upmediagroup.com Kamden Robb Sales Associate, (678) 589-8843 email: krobb@upmediagroup.com Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr 78 Circuits Assembly APRIL 2008 circuitsassembly.com http://circuitsassembly.com http://www.efabpcb.com http://www.aimsolder.com http://www.solderproducts.com http://www.aqueoustech.com http://www.assembleon.com/facts http://www.asymtek.com http://www.balverzinn.com http://www.bareboard.com http://www.solder.net http://www.bpmicro.com http://www.cognex.com http://www.cyberoptics.com http://www.ddiglobal.com http://www.digikey.com http://www.ecd.com/mm20 http://www.efabpcb.com http://www.efd-inc.com http://www.erai.com/publicvegas08.aspx http://www.electronics.henkel.com http://www.ellsworth.com http://www.eitny.com http://www.ersa.com http://www.essemtec.com http://www.europlacer.com http://www.fctassembly.com http://www.grid-lok.com http://www.bareboard.com http://www.ibesmt.com http://www.pcbnet.com http://www.indium.com http://www.innovxsys.com http://www.insulfab.com http://www.chemtronics.com http://www.jnj-industries.com http://www.jas-smt.com http://www.kicthermal.com http://www.kyzen.com http://www.meptec.org http://www.mirtecusa.com http://www.mydata.com http://www.nepconeast.com http://www.nihonsuperior.co.jp http://www.okinternational.com http://www.jnj-industries.com http://www.pkaymetal.com http://www.panasonicfa.com http://www.phoenix-xray.com http://www.goppm.com http://www.rmd-leadtracer.com http://seho.de http://www.siplace.com http://www.smt-exhibition.com http://www.speedlinetech.com http://www.virtual-pcb.com http://www.viscomusa.com http://www.visioneng.com/shop http://www.vitronics-soltec.com http://www.vjelectronix.com http://www.jnj-industries.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - April 2008 Circuits Assembly - April 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules The ‘Big Brush Off’ Revisited Impact of Soldering Atmosphere on Solder Joint Formation Beyond Moore’s Law ESD Control For Class 0 ESDS Devices Growing Your Brand This Year’s Model Tech Tips Reflow Soldering Process Doctor Pb-Free Lessons Learned Getting Lean Equipment Advances Apex Product Preview Ad Index Assembly Insider Technical Abstracts Circuits Assembly - April 2008 Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page Cover2) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 1) Circuits Assembly - April 2008 - Circuits Assembly - April 2008 (Page 2) Circuits Assembly - April 2008 - Contents (Page 3) Circuits Assembly - April 2008 - Contents (Page 4) Circuits Assembly - April 2008 - Contents (Page 5) Circuits Assembly - April 2008 - Caveat Lector (Page 6) Circuits Assembly - April 2008 - Caveat Lector (Page 7) Circuits Assembly - April 2008 - Industry News (Page 8) Circuits Assembly - April 2008 - Industry News (Page 9) Circuits Assembly - April 2008 - Industry News (Page 10) Circuits Assembly - April 2008 - Industry News (Page 11) Circuits Assembly - April 2008 - Industry News (Page 12) Circuits Assembly - April 2008 - Industry News (Page 13) Circuits Assembly - April 2008 - Industry News (Page 14) Circuits Assembly - April 2008 - Industry News (Page 15) Circuits Assembly - April 2008 - Market Watch (Page 16) Circuits Assembly - April 2008 - Talking Heads (Page 17) Circuits Assembly - April 2008 - Screen Printing (Page 18) Circuits Assembly - April 2008 - Screen Printing (Page 19) Circuits Assembly - April 2008 - Better Manufacturing (Page 20) Circuits Assembly - April 2008 - Better Manufacturing (Page 21) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 22) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 23) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 24) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 25) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 26) Circuits Assembly - April 2008 - Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules (Page 27) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 28) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 29) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 30) Circuits Assembly - April 2008 - The ‘Big Brush Off’ Revisited (Page 31) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 32) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 33) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 34) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 35) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 36) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 37) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 38) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 39) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 40) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 41) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 42) Circuits Assembly - April 2008 - Impact of Soldering Atmosphere on Solder Joint Formation (Page 43) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 44) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 45) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 46) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 47) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 48) Circuits Assembly - April 2008 - Beyond Moore’s Law (Page 49) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 50) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 51) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 52) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 53) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 54) Circuits Assembly - April 2008 - ESD Control For Class 0 ESDS Devices (Page 55) Circuits Assembly - April 2008 - Growing Your Brand (Page 56) Circuits Assembly - April 2008 - Growing Your Brand (Page 57) Circuits Assembly - April 2008 - Growing Your Brand (Page 58) Circuits Assembly - April 2008 - Growing Your Brand (Page 59) Circuits Assembly - April 2008 - Growing Your Brand (Page 60) Circuits Assembly - April 2008 - Growing Your Brand (Page 61) Circuits Assembly - April 2008 - This Year’s Model (Page 62) Circuits Assembly - April 2008 - This Year’s Model (Page 63) Circuits Assembly - April 2008 - Tech Tips (Page 64) Circuits Assembly - April 2008 - Reflow Soldering (Page 65) Circuits Assembly - April 2008 - Process Doctor (Page 66) Circuits Assembly - April 2008 - Process Doctor (Page 67) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 68) Circuits Assembly - April 2008 - Pb-Free Lessons Learned (Page 69) Circuits Assembly - April 2008 - Getting Lean (Page 70) Circuits Assembly - April 2008 - Getting Lean (Page 71) Circuits Assembly - April 2008 - Getting Lean (Page 72) Circuits Assembly - April 2008 - Getting Lean (Page 73) Circuits Assembly - April 2008 - Equipment Advances (Page 74) Circuits Assembly - April 2008 - Equipment Advances (Page 75) Circuits Assembly - April 2008 - Apex Product Preview (Page 76) Circuits Assembly - April 2008 - Apex Product Preview (Page 77) Circuits Assembly - April 2008 - Ad Index (Page 78) Circuits Assembly - April 2008 - Assembly Insider (Page 79) Circuits Assembly - April 2008 - Technical Abstracts (Page 80) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - April 2008 - Technical Abstracts (Page Cover4)
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