Circuits Assembly - June 2008 - (Page 3)

Soldering SAC Parts with SnPb Solder, pg. 34 JUNE 2008 circuitsassembly.com The Optimized Unbalanced Line Increasing Throughput Via Staggered Buffers JUNE 2008 – Vol. 19 No. 6 Innovation at Inovar FIRST PERSON 4 6 Letters Caveat Lector As the earth moves. Mike Buetow Correlating 2-D and 3-D SPI Copper Dissolution ON THE COVER: Correctly designed unbalanced lines can increase throughput. FEATURES Nepcon China 17 Talking Heads iNEMI’s Dr. Haley Fu. Mike Buetow 22 China Goes ‘Upmarket’ Among Chinese suppliers, the learning curve is clearly shortening, making the annual Shanghai show a must-see. But can what some call the world’s leading SMT show fend off a competitive challenge? By Mike Buetow TECH TALK 18 Screen Printing Correlating 2-D and 3-D SPI. Dr. Rita Mohanty Inovar 24 Out of the Garage The snow-capped mountains of Cache Valley provide an eye-pleasing backdrop to a cresting EMS company. By Mike Buetow 20 Better Manufacturing Feeling heat over China. Phil Zarrow COVER STORY 26 Improving Production Line Performance Balanced lines are thought to be standard for efficient production, yet in some cases, the total buffer capacity has to be spaced unevenly. The latest research shows why deliberately unbalancing the buffers may be beneficial. By Dr. Sabry Shaaban and Dr. Sarah Hudson 33 Wave Soldering Copper dissolution gets the yank. Ursula Marquez de Tino Productivity Tools 34 Tech Tips Soldering SAC-finished parts with SnPb solder. American Competitiveness Institute 28 Manufacturing Steps Onto the Enterprise IT Stage The concept of a single, comprehensive information solution collapses when one enters the manufacturing, quality and process engineering offices, and certainly the factory floor. This has led to a new category of “enterprise level” tools called manufacturing operations system (MOS) software. By Jason Spera 36 Test and Inspection Quick looks at the latest in boundary scan. Ted T. Turner 37 Process Doctor Quick analytical tests for surface cleanliness. Ravi Parthasarathy, Dr. Harald Wack and Dr. Helmut Schweigart Wave Control 30 39 Pb-Free Lessons Learned Diagnosing fab problems. Chrys Shea Measuring and Controlling Wave Height and Dwell Time When something changes in the process, the solder wave is often the culprit. A novel direct measurement, closed-loop system can resolve problems regulating critical parameters such as wave height and dwell time. By Ken Kirby 40 Getting Lean The design scale. Chris Munroe DEPARTMENTS 8 Industry News 16 Market Watch 43 Semicon West Product Preview 45 Product Spotlight 46 Ad Index 47 Assembly Insider 41 Eastern Advances Why you need DfX. Keyan Zhao and Sanqian Cai 48 Technical Abstracts Photo by Tom Mc Nemar

Table of Contents Feed for the Digital Edition of Circuits Assembly - June 2008

Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - June 2008

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