Circuits Assembly - June 2008 - (Page 40) Getting Lean Dfx for Lean, Part II A simple scale highlights recommended changes and benefits. s mentioned in this space in April, an EMS provider’s facility can completely embrace Lean Manufacturing principles, but if the OEM customer’s products aren’t designed for Lean, the result is inefficiency and missed cost-reduction opportunities. In April, we focused on key cost drivers in manufacturing and test, and likely improvements that could increase throughput. This month, we look at ways EMS providers and OEMs can build a robust Dfx for Lean teaming framework. Most OEMs find the efficiency and flexibility driven by Lean principles highly attractive. However, the greatest levels of efficiency and flexibility are achieved when products are designed for Lean. Achieving the optimum mix of best design for process and component selection for best sourcing involves cooperation among the OEM, EMS provider and the supply chain. The challenge can occur when legacy product is best served by redesign or changes to the approved vendor list. In those situations, the costs and benefits of making the change must be weighed carefully. In the EPIC system, each customer data package is analyzed during the project launch phase using advanced product quality planning (APQP) techniques. While APQP was developed by the automotive industry, its basic philosophy makes sense for any Lean product launch process. Key points include: • Understand customer requirements. • Use a robust process for product design and development verification. • Use a robust process for production process design and development verification. • Validate both product and process. • Use a focused product launch process with feedback, assessment and corrective action mechanisms to ensure product meets customer requirements. The first step in this process is the design review summary. This report lists the recommendations of the Design for Manufacturing Evaluation and scores each based on relative importance. Each importance level is defined as: • 5 – Will not build the assembly with this issue unresolved. • 4 – Major design issues. Can build product as designed. • 3 - Issue should be corrected. Can build product as designed. • 2 – Minor design issue. • 1 – Nice to have item. With this scale, OEMs have an easy-to-use formula for evaluating the recommended changes. Likewise, Circuits Assembly JUNE 2008 A the EMS provider can easily point to the benefit each recommendation would achieve. While the analysis is conducted using internal DfM and DfT guidelines optimized for the specific production environment, the foundation for those standards is based on industryaccepted guidelines, including those published by IPC. A ranking system doesn’t necessarily eliminate a customer response of “if I don’t make the change, how much will it cost,” but it does help focus DfM/DfT recommendations in a cost/benefit framework from the start and prioritize discussions on critical recommendations. As with any other EMS-developed tool, its actual value in reducing total cost is often determined by the customer’s willingness to accept the recommendations. Optimum Sourcing Another area of potential challenge can be raw material sourcing. As mentioned in April, permitting the EMS provider to source small chip components through a master AVL can be beneficial. Similarly, minimizing use of sole-sourced parts or non-returnable, non-cancellable (NCNR) parts also contributes to reduced cost. Ultimately, it is desirable to design-in component sources willing to embrace Lean stocking principles. This is where a strong design partnership between an EMS provider and OEM can be invaluable because, while the OEM team may understand the best component choices for form, fit and function, the EMS team may have experience with which of those AVL choices are willing to support Lean practices, such as: • Willingness to support short cycle times, flexible lot sizes and high quality. • Ability to ensure adequate stock based on forecast while delivering to pull signals vs. requiring firm release dates over an extended lead-time. • Willingness to maintain appropriately sized material buffers in close proximity to the production facility. While tradeoffs are inevitable, a focus on analyzing optimum AVL choices in the design phase can help minimize the potential for raw material flow disruptions. Ensuring optimum design for Lean is not always possible. Product design constraints such as packaging, ergonomics and regulatory restrictions can be prohibitive to Lean manufacturing principles. However, approaches that analyze key cost-drivers related to production and logistics throughput can identify potential problem areas to be addressed immediately on current product or over time (e.g., the next-generation designs). Continued on pg. 42 Chris Munroe is director of engineering at EPIC Technologies (epictech.com); chris. munroe@epictech. com. His column appears bimonthly. 40 circuitsassembly.com http://epictech.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - June 2008 Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - June 2008 Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover2) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 2) Circuits Assembly - June 2008 - Contents (Page 3) Circuits Assembly - June 2008 - Letters (Page 4) Circuits Assembly - June 2008 - Letters (Page 5) Circuits Assembly - June 2008 - Caveat Lector (Page 6) Circuits Assembly - June 2008 - Caveat Lector (Page 7) Circuits Assembly - June 2008 - Industry News (Page 8) Circuits Assembly - June 2008 - Industry News (Page 9) Circuits Assembly - June 2008 - Industry News (Page 10) Circuits Assembly - June 2008 - Industry News (Page 11) Circuits Assembly - June 2008 - Industry News (Page 12) Circuits Assembly - June 2008 - Industry News (Page 13) Circuits Assembly - June 2008 - Industry News (Page 14) Circuits Assembly - June 2008 - Industry News (Page 15) Circuits Assembly - June 2008 - Market Watch (Page 16) Circuits Assembly - June 2008 - Talking Heads (Page 17) Circuits Assembly - June 2008 - Screen Printing (Page 18) Circuits Assembly - June 2008 - Screen Printing (Page 19) Circuits Assembly - June 2008 - Better Manufacturing (Page 20) Circuits Assembly - June 2008 - Better Manufacturing (Page 21) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 22) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 23) Circuits Assembly - June 2008 - Out of the Garage (Page 24) Circuits Assembly - June 2008 - Out of the Garage (Page 25) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 26) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 27) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 28) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 29) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 30) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 31) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 32) Circuits Assembly - June 2008 - Wave Soldering (Page 33) Circuits Assembly - June 2008 - Tech Tips (Page 34) Circuits Assembly - June 2008 - Tech Tips (Page 35) Circuits Assembly - June 2008 - Test and Inspection (Page 36) Circuits Assembly - June 2008 - Process Doctor (Page 37) Circuits Assembly - June 2008 - Process Doctor (Page 38) Circuits Assembly - June 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - June 2008 - Getting Lean (Page 40) Circuits Assembly - June 2008 - Eastern Advances (Page 41) Circuits Assembly - June 2008 - Eastern Advances (Page 42) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 43) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 44) Circuits Assembly - June 2008 - Product Spotlight (Page 45) Circuits Assembly - June 2008 - Ad Index (Page 46) Circuits Assembly - June 2008 - Assembly Insider (Page 47) Circuits Assembly - June 2008 - Technical Abstracts (Page 48) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.