Circuits Assembly - June 2008 - (Page 41) 从常见失误看 DFX的必要 性及临时对策的采用 北京柏瑞安科技有限公司 赵克彦 蔡三强 摘要:在EMS日益竞争激烈的今天,客户要求产品 的价格更低、质量更高、交货周期更短。采用DFX( 包括DFM、DFT、DFR、DFC、DFA等等)的产品在EMS 中能够有效地降低制造成本、提高产品质量及产品 的可靠性,所以说品质不仅是制造出来的,也是设 计出来的,二者密切相关。本文主要介绍:在波峰焊 接过程中由于不良的PCB设计导致制造成本提升、产 品可靠性降低时,临时对策和永久对策的采用。 关键词: 临时对策 永久对策 DFX:面向产品生命周期各个环节的设计 一.UFO式PAD设计 众所周知,设计阶段决定了一个产品约80%左右 的制造成本。无论是设计阶段还生产制造阶段,降 低生产成本是提高市场竞争力的关键。对于一些内 径大于或等于3mm的金属化安装孔,波峰焊接时则出 现堵孔现象。 临时对策: (1)对安装孔进行阻焊,大大提高了制造成 本。 永久对策: (1)两层板或多层板建议PCB设计工程师优选 UFO式设计。对TOP/BOTTOM需连通的焊盘是由一系 列金属化孔完成电路连接。去除安装孔孔壁内的金 属化镀层,将金属化孔改为非金属化孔,使其焊盘 间电阻随金属化孔数量地增加而降低。当无完整可 焊环路时,不会出现堵孔现象。轻微的锡堆还会提 高连接的可靠性。(图1) (2)单面板安装孔应在与过板方向垂直的焊盘 上开阻锡位,破坏可焊环路,以防止过波峰后出现 堵孔现象。(图2) 二.不良设计案例分析:晶振 在生产中经常会看到一些元器件由于不良的设计 给生产、调试、安装等带来一系列的影响。DFM对提 高THT制造的效率和可靠性起到很重要的作用,有助 于降低生产中的缺陷。要想从根本上解决问题,必 须修改设计。 不良设计案例: 1.将测试点设于有引线晶振的PAD上。 通常选用铁磁性材料(杜美丝)作为晶振的引 脚,使其引线与玻璃膨胀系数相匹配。因其涂层 的附着力低,在测试时常造成因涂层脱离而产生 的开焊现象,所以在FCT和ICT选点时要避开此类焊 点。DFT则要求设定专门的测试焊盘,从根本上杜绝 此类隐患的发生。(图3) 2.PAD与器件金属外壳间的短路。 临时对策 : (1)在晶振底部增加垫片来防止晶振本体与PAD 短路。 circuitsassembly.com Eastern Advances (2)在焊接过程中,将晶振距板面保持1mm~2mm 的距离来防止短路现象的发生。 以上两种临时对策虽然不会对产品的使用有影 响,但是造成生产工时的浪费,所以应从DFM根本上 解决。 永久对策: 为防止波峰焊接时焊锡从金属化孔上升到T面 PAD,导致对外壳短路。设计多层板时要注意: (1)对于金属壳的器件,外壳与PCB上的焊盘易 造成短路,因此TOP焊盘一定使用绿油或白油覆盖。 (图4) (2)使D-d≤0.2 保证晶振引线位移尽可能的 小,防止金属外壳与TOP PAD相连。(图5) (3) 使a≤A (a最小,a=D),即T面PAD无 环。(图5) 3.在残存助焊剂条件下,因晶振外壳与PAD的最小 间隙太小引起的绝缘阻抗降低。 晶振上的外壳尽可能与焊盘拉开距离,防止因波 峰焊接过程中助焊剂渗入残留影响晶振的正常工 作。 临时对策: (1)晶振增加垫片或采用手工补焊完成。 (2)选用有喷雾装置的波峰焊机进行焊接。因为 喷雾方式可有效控制助焊剂流量,在焊接过程中, 避免通过毛细现象使焊料爬升到PAD,而使绝缘阻抗 降低。 (3)值得注意的是:此类缺陷在异电位间隙为 0.1毫米以下时,时有发生。也可采用涂抹助焊剂阻 断剂(毛细防止剂)的方式达到很好的效果。前 提:孔壁应为非金属化。 永久对策: (1)尤其是当元器件重量较轻时,为防止由于 助焊剂毛细现象而引起的不良,晶振、PLCC座、微 动开关、中周等应优选用非金属化孔结构。正如一 些日本公司早期的P板设计规范规定,尽可能的避免 在金属化孔内插入引脚。(图6) 三.不良设计案例分析:LED 产品的可靠性与PCB设计、材料的选择、焊接工艺 等是密不可分的。例如:在波峰焊接过程时,由于 LED贴板插装,金属化孔内的焊料会上升直至触 到LED本体,实践中发现大量的此类器件损坏或性能 改变。 临时对策: (1)此类器件不能进行波峰焊接,则需采用手 工补焊完成,大大增加了生产成本。 永久对策: (1)保证LED本体到焊点的距离保持2mm~4mm为 宜. Circuits Assembly JUNE 2008 Keyan Zhao and Sanqian Cai are engineers at Beijing Brio (briotech.com/egsjg.htm). Contact: Amy Dai; amydai@brio-tech.ca. 41 http://briotech.com/egsjg.htm http://briotech.com/egsjg.htm http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - June 2008 Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - June 2008 Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover2) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 2) Circuits Assembly - June 2008 - Contents (Page 3) Circuits Assembly - June 2008 - Letters (Page 4) Circuits Assembly - June 2008 - Letters (Page 5) Circuits Assembly - June 2008 - Caveat Lector (Page 6) Circuits Assembly - June 2008 - Caveat Lector (Page 7) Circuits Assembly - June 2008 - Industry News (Page 8) Circuits Assembly - June 2008 - Industry News (Page 9) Circuits Assembly - June 2008 - Industry News (Page 10) Circuits Assembly - June 2008 - Industry News (Page 11) Circuits Assembly - June 2008 - Industry News (Page 12) Circuits Assembly - June 2008 - Industry News (Page 13) Circuits Assembly - June 2008 - Industry News (Page 14) Circuits Assembly - June 2008 - Industry News (Page 15) Circuits Assembly - June 2008 - Market Watch (Page 16) Circuits Assembly - June 2008 - Talking Heads (Page 17) Circuits Assembly - June 2008 - Screen Printing (Page 18) Circuits Assembly - June 2008 - Screen Printing (Page 19) Circuits Assembly - June 2008 - Better Manufacturing (Page 20) Circuits Assembly - June 2008 - Better Manufacturing (Page 21) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 22) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 23) Circuits Assembly - June 2008 - Out of the Garage (Page 24) Circuits Assembly - June 2008 - Out of the Garage (Page 25) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 26) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 27) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 28) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 29) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 30) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 31) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 32) Circuits Assembly - June 2008 - Wave Soldering (Page 33) Circuits Assembly - June 2008 - Tech Tips (Page 34) Circuits Assembly - June 2008 - Tech Tips (Page 35) Circuits Assembly - June 2008 - Test and Inspection (Page 36) Circuits Assembly - June 2008 - Process Doctor (Page 37) Circuits Assembly - June 2008 - Process Doctor (Page 38) Circuits Assembly - June 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - June 2008 - Getting Lean (Page 40) Circuits Assembly - June 2008 - Eastern Advances (Page 41) Circuits Assembly - June 2008 - Eastern Advances (Page 42) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 43) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 44) Circuits Assembly - June 2008 - Product Spotlight (Page 45) Circuits Assembly - June 2008 - Ad Index (Page 46) Circuits Assembly - June 2008 - Assembly Insider (Page 47) Circuits Assembly - June 2008 - Technical Abstracts (Page 48) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover4)
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