Circuits Assembly - June 2008 - (Page 43)

PREVIEW Small Die Size Adhesives Ablestik 8000 series die attach adhesives are formulated to optimize wafer backside coating processes. Come in conductive and nonconductive formulations. Said to address requirements of smaller die sizes, for packages such as COLs, SOs, TSOPs and QFNs. Include Ablestik 8008 electrically conductive material, Ablestik 8008NC nonconductive formulation, Ablestik 8008HT, a high thermal adhesive suitable for discrete and small power IC devices. Henkel, us.henkel.com Booth 8311 Product 25-µm Die Attach Coater DirEKt Coat printing platform enables wafer coating with die attach materials down to a reported 25 µm thickness. Is enabled by a flat pallet, wafer shield for active side wafer protection, Galaxy printer and specially designed squeegee. Delivers a solution for die attach materials, epoxy and protective backside coatings. DEK International, dek.com Booth 8111 Die Attach Materials Hysol QMI5100 and Hysol QMI5200 are designed to streamline die attach for stacked die applications; combine properties and functions of die attach film and dicing tape into one. Are dual structured materials. Film is laminated to the backside of the wafer; the wafer is diced, then picked and moved to die placement. Are said to leave no burrs after dicing; enable bondline thickness control, and eliminate common bleed issues. QMI5100 is a 10 µm thick material and is most commonly used on the DAX levels of the die stack. QMI5200 is available in a thickness of 20 µm and is approved for use on DA1 and/or DAX. Henkel, us.henkel.com Booth 8311 High-Speed Die Sorter DS 15000 die sorter is said to have full flip-chip and vision inspection capability up to 15,000 UPH. Reportedly minimizes material changeover times and has 100% online quality inspection and 100% inkless manufacturing as a result of wafer mapping. Muhlbauer Inc., muhlbauer.com Booth 7047 Wafer Temperature Profiler Solar Cell monitors cell temperature as it passes through the contact firing process. Consists of data logger, thermal barrier and Insight software; monitors wafer temperature as it travels through the furnace, without disrupting production. Pinpoints hot or cold spots in the process. Datapaq, datapaq.com Booth 9652 Batch and Inline Water Cleaner Tabletop Pick, Place and Dispenser ONYX500 automatically picks, places, dispenses and assembles. Offers the same features of the highspeed cell platform, in a tabletop footprint. Uses upper and lower vision-based digital cameras; is reportedly capable of placement within 5 µm. Applications include semiconductors, photonics, MEMS and micro-assembly. Air-Vac Engineering, air-vac-eng.com Booth 8623 Micronox MX2628 aqueous cleaner is a versatile chemistry that can be used in batch or inline cleaners. Is designed to clean advanced packaging Pb-free fluxes. Is environmentally friendly, said to have a long tank life and safe for multiple pass applications. Runs at low concentrations and low temperatures. Reportedly is compatible with all common materials in electronics assembly and cleaning processes. Is biodegradable and low VOC; contains no CFCs or HAPs. All ingredients are TSCA listed. Is nonflammable and noncorrosive. Comes in one-, five- and 55-gal. containers. Kyzen Corp., kyzen.com Booth 7514 Oblique Angle Inspection Lynx optical inspection system now employs LED illumination and an oblique and direct viewer. Provides a 360° view around the components for 34° angled inspection of corners that are reportedly hard to reach using stereo inspection methods. Vision Engineering, visioneng.com/us Booth 7952 circuitsassembly.com Circuits Assembly JUNE 2008 43 http://dek.com http://us.henkel.com http://us.henkel.com http://muhlbauer.com http://datapaq.com http://kyzen.com http://visioneng.com/us http://air-vac-eng.com http://circuitsassembly.com

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Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - June 2008

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