Circuits Assembly - June 2008 - (Page 45) SPOTLIGHT Mid-Volume Printer MPM 125 screen printer is for low-tomedium volume applications. Reportedly features ±12.5 µm accuracy at Six-Sigma, with Cpk ≥ 2.0. Includes CANOpen motion control architecture, benchmarking software and Windows XP, and setup Wizards for ease of use. Speedline Technologies, speedlinetech. com Product High-Volume Pick-and-Place MY100DX component placement platform reportedly delivers 70% more throughput. Is designed for high-volume production. Has 96 feeder positions; also comes with 160 feeder positions (MY100DX-14). Both can be configured with various synergy options for inline production and are compatible with existing machines, feeders and software. Mydata Automation, mydata.com Programmable Preheater PCT-1000 benchtop programmable preheater is said to deliver more heat to difficult boards, while maintaining high levels of thermal control and lower operating temperatures. Delivers forced convection heat that can be controlled with four time and temperature zones, and an additional cooling zone. Is for Pb-free, multilayer boards and large ground planes. Features “external” thermocouple input. Design creates a convection vortex. Operates in manual or automatic mode. Up to 50 thermal profiles can be stored. OK International, okinternational.com ‘No Test Points’ ICT Cover-Extend Technology is a limited access solution for in-circuit test. Is said to eliminate the need for physical test points. Is part of VTEP v2.0 powered test suite. Is a hybrid between boundary scan and VTEP vectorless test. Relies on stimulus provided by boundary scan cells. Benefits reportedly include improved test coverage (up to 50% node access); savings on fixturing, and strain relief on solder joints. Agilent Technologies Inc., agilent.com Vapor Phase Rework Station V-Works 24 is said to deliver uniform condensation heat transfer to the single component rework environment. Permits use of absolute limits of maximum temperatures and small delta at peak temperatures. Comes with 24” x 24” working envelope, split mirror and camera vision system for aligning components; on-board recipe storage; touch-screen operator interface; manual x, y and z adjustment; vacuum system; bottom-side global preheat; semiautomatic cycle for component removal and replacement, and cool-down function. R&D Technical Services, rdtechnicalservices.com Low Power Reflow Pyramax 75A features 75” of heated length and six zones, 350˚C maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. Is said to deliver side-to-side recirculation and convection efficiency. Includes Windowsbased WINCON oven control software, parts-identification software, a range of options for flux management, advanced conveyor solutions, smart tracking SMEMA, optional barcode reader, and a comprehensive warranty. BTU International, btu.com ‘1% Dry’ Cabinet Models XSD series of 1% RH dry cabinets is designed to meet J-STD-033 for handling MSDs. Is said to deliver precision measurement, 24/7 data logging and ergonomic touch-screen operator interface. SDR series accepts full feeder trolleys from all pick-and-place manufacturers. Both deploy self-regenerating desiccant. Totech Super Dry, totech.eu.com ‘No CAD’ Line Transfer Tool vPlan version 1.2 introduces features intended to enhance the ability to transfer production between lines and factories, even when CAD and AVL data are not available. Creates manufacturing process definitions, even when incoming data are poor. Adds coverage for additional machine models. New features include re-optimization of legacy NC programs; Wave Height Monitor Wave height monitor and control module for KISS selective soldering line reportedly maintains solder wave heights to within +/-0.005”. Is said to be effective when working with wave nozzle sizes from 6 to 1.5 mm, and selectively soldering tight pitch component areas. Monitoring methodology incorporates resistive measurements of wave height relative to a known reference. ACE Production Technologies, ace-protech.com circuitsassembly.com Circuits Assembly JUNE 2008 45 http://mydata.com http://www.speedlinetech.com http://www.speedlinetech.com http://okinternational.com http://agilent.com http://rdtechnicalservices.com http://btu.com http://totech.eu.com http://ace-protech.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - June 2008 Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - June 2008 Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page Cover2) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 1) Circuits Assembly - June 2008 - Circuits Assembly - June 2008 (Page 2) Circuits Assembly - June 2008 - Contents (Page 3) Circuits Assembly - June 2008 - Letters (Page 4) Circuits Assembly - June 2008 - Letters (Page 5) Circuits Assembly - June 2008 - Caveat Lector (Page 6) Circuits Assembly - June 2008 - Caveat Lector (Page 7) Circuits Assembly - June 2008 - Industry News (Page 8) Circuits Assembly - June 2008 - Industry News (Page 9) Circuits Assembly - June 2008 - Industry News (Page 10) Circuits Assembly - June 2008 - Industry News (Page 11) Circuits Assembly - June 2008 - Industry News (Page 12) Circuits Assembly - June 2008 - Industry News (Page 13) Circuits Assembly - June 2008 - Industry News (Page 14) Circuits Assembly - June 2008 - Industry News (Page 15) Circuits Assembly - June 2008 - Market Watch (Page 16) Circuits Assembly - June 2008 - Talking Heads (Page 17) Circuits Assembly - June 2008 - Screen Printing (Page 18) Circuits Assembly - June 2008 - Screen Printing (Page 19) Circuits Assembly - June 2008 - Better Manufacturing (Page 20) Circuits Assembly - June 2008 - Better Manufacturing (Page 21) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 22) Circuits Assembly - June 2008 - China Goes ‘Upmarket’ (Page 23) Circuits Assembly - June 2008 - Out of the Garage (Page 24) Circuits Assembly - June 2008 - Out of the Garage (Page 25) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 26) Circuits Assembly - June 2008 - Improving Production Line Performance (Page 27) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 28) Circuits Assembly - June 2008 - Manufacturing Steps Onto the Enterprise IT Stage (Page 29) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 30) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 31) Circuits Assembly - June 2008 - Measuring and Controlling Wave Height and Dwell Time (Page 32) Circuits Assembly - June 2008 - Wave Soldering (Page 33) Circuits Assembly - June 2008 - Tech Tips (Page 34) Circuits Assembly - June 2008 - Tech Tips (Page 35) Circuits Assembly - June 2008 - Test and Inspection (Page 36) Circuits Assembly - June 2008 - Process Doctor (Page 37) Circuits Assembly - June 2008 - Process Doctor (Page 38) Circuits Assembly - June 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - June 2008 - Getting Lean (Page 40) Circuits Assembly - June 2008 - Eastern Advances (Page 41) Circuits Assembly - June 2008 - Eastern Advances (Page 42) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 43) Circuits Assembly - June 2008 - Semicon West Product Preview (Page 44) Circuits Assembly - June 2008 - Product Spotlight (Page 45) Circuits Assembly - June 2008 - Ad Index (Page 46) Circuits Assembly - June 2008 - Assembly Insider (Page 47) Circuits Assembly - June 2008 - Technical Abstracts (Page 48) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - June 2008 - Technical Abstracts (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.