Circuits Assembly - June 2008 - (Page 48)

Technical Abstracts In Case You Missed It Business Planning “Rising Opportunities for EMS Organizations in the Medical, Industrial, and Aerospace/Defense/Homeland Security” Author: Charles W. Wade; cwade@techforecasters. com Abstract: The worldwide EMS industry is growing: a 12% annual rate over the next five years to $222 billion by 2011. Whereas EMS companies now produce 13% of the world’s electronics products, we project this capture rate of global Cost of Goods Sold to increase to more than 16% by 2011. Whereas larger EMS providers derive almost three-quarters of revenues from the computer, communications and consumer segments (EMS penetration of 16%, 25% and 10%, respectively), smaller companies serve a much more balanced market, such as industrial, medical and aerospace. Those latter segments are also increasingly receptive to outsourcing. These segments have a much lower current rate of outsourcing (2.5% to 6.9%) and, therefore, offer significant opportunities for contract manufacturers over the next five years. (Apex, April 2008) Component Packaging “Thin Film Crack on the Top Die of a 2 Chip-On-Board (2COB) VFBGA Package” Authors: C.W. Gee, E. Poh, K.W. Ting and S. Low Abstract: Thin-film cracking was observed on the top die of a 2COB vfBGA package, post MST soak and 3X reflow. A detailed investigation revealed the presence of die bonding tape at the interface between the top die and mold compound initiated thin-film crack propagation from the die edge into the active circuit area, causing electrical failures. (IEEE International Reliability Physics Symposium, April 2008) “Packaging Substrate Technologies Trend In Japan” Author: Henry H. Utsunomiya; henryutsunomiya@ mac.com. Abstract: Japan’s packaging substrate production in 2007 was an estimated $6.8 billion, more than 45% of the world’s total. System-in-package (SiP) and module boards with embedded active devices are in volume production in Japan, mostly for cellular phone applications. This is expected to expand to cellphone motherboards in the near future. For packaging substrates, three major embedded technologies are possible: embedded wafer-level, embedded bare die (e.g., flip chip), both of which are in volume production, and embedded bare die on other semiconductors with PWB and thin-film process (chip-on-chip). Flip-chip interconnects are forecast to drive packaging substrates, with minimum line widths reaching 5 µm and via diameters of 5 to 30 µm during the next five years. (SMTA Pan Pac Symposium, January 2008) Circuits Assembly JUNE 2008 Inventory Management “Lean Kitting: A Case Study” Authors: Ranko Vujosevic, Ph.D., Larry HausmanCohen, Jose A. Ramirez and Srinivasan Venkataraman; ranko@optelco.com. Abstract: This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major EMS site. In general, the process recommended for electronics assembly plants: Dismantle central stockroom if currently in use. Abolish ERP system-based component procurement. Sign a contract with a single contractor that will supply all types of components used in the plant. Establish on-hand quantity for each component based on actual sales. Use an MES system to monitor component consumption and attrition. Provide daily component consumption data to component supplier, which restocks components once a week. Several component supermarkets are established on the shop floor (vertical carousels, if possible). Provide each supermarket area with an offline setup area for kitting and component and setup verification using the MES system. Maintain supermarkets for reels that stay on feeders at all times. Use MES system to maintain quantity of reels that stay on feeder per part number. Provide a Kanban setup area for each supermarket (offline setup area) where setup carts are delivered. Each assembly line is provided a maximum of three setups at a time: one on the line, one in Kanban area waiting for production, and one currently being kitted. MES system provides a kit-monitoring tool that permits plant-wide to view the status of each kit and Kanban content. After setup is completed, all parts (except reels that stay on feeders) are taken off the feeders and returned to the supermarket. (Apex, April 2008) Packaging Reliability “Impact of IC Diffusion and Assembly Processes on Package Stress Induced Product Reliability Issues – An Insight into the Package Stress Relief Design Rules by Simulation” Authors: Y. Li, M.A.J. van Gils, W.D. van Driel, R.B.R. van Silfhout, J. Bisschop, J.H.J. Janssen, G.Q. Zhang Abstract: The chip layout and parameters of IC diffusion fab and assembly fab processes are taken into account in the simulations to study the impacts of those parameters on the packaging stress-induced damages, to evaluate the commonly used design rules and to find a systematic approach to the problem. (IEEE International Reliability Physics Symposium, April 2008) circuitsassembly.com CirCuits Assembly provides abstracts of papers from recent industry conferences and company white papers. With the amount of information increasing, our goal is to provide an added opportunity for readers to keep abreast of technology and business trends. 48 http://circuitsassembly.com

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Circuits Assembly - June 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing China Goes ‘Upmarket’ Out of the Garage Improving Production Line Performance Manufacturing Steps Onto the Enterprise IT Stage Measuring and Controlling Wave Height and Dwell Time Wave Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Eastern Advances Semicon West Product Preview Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - June 2008

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