Circuits Assembly - July 2008 - (Page 34)

Emerging Technologies Conclusion Nanotechnology provides many useful tools to enhance the properties and processing of electronic materials. The enhanced materials and processes will have to prove their reliability and economic value to compete, but the sheer volume of opportunities and potential solutions suggests we’ll be seeing a lot more nanomaterials in our industry. n References GET INTERCONNECTED “I’m glad I attended IPC Midwest to learn about solutions to challenges we are seeing, especially with lead free. It’s important to have a forum like this where critical industry issues can be discussed.” Robert Cook, Technical Fellow, Visteon Corporation, Van Buren Township, Michigan Keep up with global changes in technology, standards and customer expectations. If you need to see electronics assembly or PCB equipment, you need to be at this show! DESIGN PRINTED CIRCUIT BOARDS ELECTRONICS ASSEMBLY TEST 1. A. Rae and A. Skipor, “Nanotechnology and Room Temperature Assembly,” SMTA: Emerging Technologies Summit, Sept. 25, 2006. 2. C. R. M. Wronski, “The Size Dependence of the Melting Point of Small Particles of Tin,” Brit J. Appl. Phys., vol. 18, 1967. 3. Ph. Buffat and J. P. Borel, “Size Effect on the Melting Temperature of Gold Particles,” Physical Review A, vol. 13, no. 6, June 1976. 4. S. L. Lai, J. Y. Guo, V. Petrova, G. Ramanath, L. H. Allen, “Size-Dependent Meeting Properties of Small Tin Particles: Nanocalorimetric Measurements,” Physical Review Letters, vol. 77, no. 1, July 1996. 5. Leslie H. Allen, “Nanocalorimetry Studies of Materials: Melting Point Depression and Magic Nanostructures,” NNUN Abstracts 2002/Materials, Physics, Process & Characterization, 2002, p. 40. Bringing a world 6. M. Zhang, et al, “Size Dependent Melting Point Depression of Nanoof information to you structures: Nanocalorimetric Measurements,” Physical Review B, vol. 62, no. 15, October 2000. 7. Kevin Grossklaus, Melting and Coalescence Behavior of Tin Nanoparticles for Use in Low Temperature Solder Applications, Purdue University, master’s thesis, August 2007. 8. Lin-yin Hsiao and Jengong Duh, “Synthesis and Characterization of Lead free Solders with Sn-3.5Ag-xCu (x=0.2,0.5,1.0) Alloy Nanoparticles by the Chemical Reduction Method,” J. of the Electrochemical Society, 152, (9), 2005. 9. Savas Berber, Young-Kyun Kwon and David Tamanek, “Bonding and Energy Dissipation in a Nanohook Assembly,” Physical Review of Letters, vol. 91, no. 16, October 2003. 10. University of Akron News, “UA Synthetic Gecko Foot-Hairs Leading to Reusable Adhesives,” uakron.edu/news/articles/uamain_1293. php, Aug. 12, 2005. 11. Liehui Ge, Sunny Sethi, Lihie Ci, Pulickel Ajayan and Ali Dhinojwala, “Carbon Nanotube-based Synthetic Gecko Tapes,” Proceedings of the National Academy of Sciences of the United States of America, vol. 104, no. 26, June 26, 2007. 12. Alan Rae, “Nanosolder – What’s Next?” International Conference on Soldering and Reliability, May 16, 2008. Acknowledgments The authors gratefully acknowledge the support and contributions of colleagues at NanoDynamics, MetaMateria Partners, Motorola, Purdue University Delphi, and iNEMI. Ed.: This article is excerpted from a paper in the proceedings of the 2007 SMTA Pan Pacific Microelectronics Symposium and is printed with permission. Alan Rae, Ph.D., is vice president of innovations for NanoDynamics (nanodynamics.com) and chair of the iNEMI Research Committee; area@nanodynamics.com. Andrew Skipor, Ph.D., is a distinguished member of the technical staff and distinguished innovator, a nanotechnology leader for Motorola Labs (motorola.com), and chairs of the iNEMI Pb-Free Nano-Solder Project. Marc Chason is an iNEMI consultant and president of Marc Chason and Associates. Sunday–Thursday, September 24–25, 2008 Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill www.IPCMidwestShow.org 34 Circuits Assembly JULY 2008 circuitsassembly.com http://www.IPCMidwestShow.org http://uakron.edu/news/articles/uamain_1293.php http://uakron.edu/news/articles/uamain_1293.php http://nanodynamics.com http://www.IPCMidwestShow.org http://circuitsassembly.com

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Circuits Assembly - July 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Tech Tips Will Electronics Follow the Sun? ‘Warm’ Manufacturing Heats Up Reputation Trumps Recession, China ‘Web Circuits’ A Novel Non-VOC Conformal Coating Krypton: Benchmarking Customer Satisfaction 2008-09 CIRCUITS ASSEMBLY Buyers Guide Wave Soldering Pb-Free Lessons Learned Process Doctor Materials World SMTA Int'l Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - July 2008

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