Circuits Assembly - July 2008 - (Page 78)

Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. SMTA International PREVIEW Product ACL Staticide, Inc., www.aclstaticide.com . . . . . . . . . . . . . . . . . . 29 Aim Solder, www.aimsolder . . . . . . . . . . . . . . . . . . . . . . . . . . 13, 17 AMTECH, www.amtechsolder.com. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Aqueous Technologies, www.aqueoustech.com . . . . . . . . . . . .46-47 Assembleon, www.assembleon.com . . . . . . . . . . . . . . . . . . . . . . . 23 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 79 BPM Microsystems, www.bpmicro.com . . . . . . . . . . . . . . . . . . . . 54 Charlie Barnhart & Associates, www.charliebarnhart.com . . . . . 73 Cognex Corporation, www.cognex.com . . . . . . . . . . . . . . . . . . . . C2 Compufab, www.compufab.com. . . . . . . . . . . . . . . . . . . . . . . . . . 79 Cookson Electronic Assembly Materials, www.cooksonelectronics.com . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DEK USA, www.dek.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ECD, to be noted on the ad materials . . . . . . . . . . . . . . . . . . . . 33 eFabPCB, www.efabpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Electronics Assembly Show, www.electronicsassemblyshow.com . . . . . . . . . . . . . . . . . . . . . 77 Electronics Group of Henkel, www.electronics.henkel.com . . . . . . . 5 Ellsworth Adhesives, www.ellsworth.com . . . . . . . . . . . . . . . . . . . . 3 Europlacer, www.europlacer.com . . . . . . . . . . . . . . . . . . . . . . .40-41 FCT Assembly, www.fctasembly.com . . . . . . . . . . . . . . . . . . . 13, 17 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . .48-49 ICON Technologies, www.iconprinter.com . . . . . . . . . . . . . . . . .52-53 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 IPC Midwest, www.IPCMidwestShow.org . . . . . . . . . . . . . . . . . . . 34 ITW Chemtronics, www.chemtronics.com . . . . . . . . . . . . . . . . . . . 28 JETPCB Inc., www.jetpcb.com . . . . . . . . . . . . . . . . . . . . . . . . 59, 79 Juki Automation Systems, www.jas-smt.com . . . . . . . . . . . . . . . 55 Kyzen Corporation, www.kyzen.com . . . . . . . . . . . . . . . . . . . . .50-51 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . .42-43 Mydata Automation, www.mydata.com . . . . . . . . . . . . . . . . . . . . C3 NEPCON China/EMT China 2008, www.nepconchina.com . . . . . . 63 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . .13, 17, 44-45 PCB Orlando, www.pcbshows.com/orlando . . . . . . . . . . . . . . . . . . 4 Seika Machinery, www.seikausa.com . . . . . . . . . . . . . . . . . . . . . . 39 SMTA International, www.smta.org/smtai/ . . . . . . . . . . . . . . . . . . 35 Speedline Technology, www.speedlinetech.com . . . . . . . . . . . . . 11 Viscom, Inc., www.viscom.com. . . . . . . . . . . . . . . . . . . . . . . . . . . 31 VJ Electronix, www.vjelectronix.com . . . . . . . . . . . . . . . . . . . . . . . 56 Mid-size Placer Pantera-XV SMD placement system addresses prototyping and production runs in mid-sized quantities. Is said to handle 0201s to 50 x 50 mm QFPs, and pitches to 0.4 mm. Offers up to 108 feeder slots in a footprint less than 1 sq. m. Intelligent tape and stick feeders recognized automatically. Tape feeders are motorized; transport speed is programmable. 0201 chips can be placed at up to 4500 cph. Resolution of magnetic linear measuring system is 1 µm. Essemtec, essemtec.com Booth 211 Continued from pg. 24 Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Susan Jones Group Sales Director, (404) 822-8900 email: sjones@upmediagroup.com Krista Fabian Sales Associate, (678) 589-8840 email: kfabian@upmediagroup.com Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr To achieve small package bodies, an increasing number of companies use flip chip inside the package, especially for the bottom die in a package of a PoP. Flip chip reduces pitch for the top package of a PoP, and improves electrical performance for devices such as baseband processors by delivering power directly to the processor core, along with reduced IR drop and reduced EMI. TSV: The ultimate in 3-D. TSV technology permits devices to be placed and wired in the third dimension. 3-D TSV adoption promises higher clock rates, lower power dissipation and higher integration density. The technology will be adopted in many applications because it solves issues related to electrical performance, memory latency, power, and noise on and off the chip. For some applications, a high-bandwidth memory interface to the logic has been the main driver for the technology’s development. Both logic and memory device applications are expected to begin within a few years. The addition of DSP to image sensors is also anticipated in future camera module versions. There were more than three dozen papers on 3-D packaging at the Electronic Components and Technology Conference in May 27-30, and the sessions were packed. Even with 3-D ICs’ advantages, there are several challenges to the adoption of 3-D architectures. These challenges need to be overcome for the technology to see widespread adoption: · Commercial availability of EDA tools and design methodologies. · Thermal concerns due to increased power densities. · Test, especially for repartitioned logic. The TSV market will be established when the benefits justify the cost, and on a case-by-case basis. While through vias are used in image sensors for camera modules today, other applications will take time. TSMC’s recent TSV announcements as part of its Open Innovation Platform will aid the adoption. TSMC is working with customers on design software and has introduced a SPICE tool design kit. The first technology is a post through-silicon via technology capable of 140 µm pitch. By the end of 2009, TSMC will offer a post TSV technology with 60 µm pitch and, sometime in 2011, 17 µm pitch inline capability. Movement in the z-direction continues and a variety of solutions will remain. Stacked die CSPs will continue to see high growth. PoP adoption will expand as many system makers hop on the bandwagon. The ultimate silicon stacking, 3-D TSV, will see widespread adoption as some of today’s key issues are resolved. n References 1. TechSearch International Inc., Advanced Packaging Update: Market and Technology Trends, March 2008. 2. B. Toleno Ph.D., and D. Maslyk, “Process and Assembly Methods for Increased Yield of Package On Package Devices,” IPC Apex Proceedings, April 2008. 3. F. Yuan, Ph.D., and R. Crisp, “Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules,” CirCuits Assembly, April 2008. 78 Circuits Assembly JULY 2008 circuitsassembly.com http://circuitsassembly.com http://www.aclstaticide.com http://www.aimsolder http://www.amtechsolder.com http://www.aqueoustech.com http://www.assembleon.com http://www.bareboard.com http://www.bpmicro.com http://www.charliebarnhart.com http://www.cognex.com http://essemtec.com http://www.compufab.com http://www.cooksonelectronics.com http://www.dek.com http://www.digikey.com http://www.efabpcb.com http://www.electronicsassemblyshow.com http://www.electronics.henkel.com http://www.ellsworth.com http://www.europlacer.com http://www.fctasembly.com http://www.grid-lok.com http://www.iconprinter.com http://www.pcbnet.com http://www.indium.com http://www.IPCMidwestShow.org http://www.chemtronics.com http://www.jetpcb.com http://www.jas-smt.com http://www.kyzen.com http://www.mirtecusa.com http://www.mydata.com http://www.nepconchina.com http://www.nihonsuperior.co.jp http://www.pcbshows.com/orlando http://www.seikausa.com http://www.smta.org/smtai/ http://www.speedlinetech.com http://www.viscom.com http://www.vjelectronix.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - July 2008

Circuits Assembly - July 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Tech Tips Will Electronics Follow the Sun? ‘Warm’ Manufacturing Heats Up Reputation Trumps Recession, China ‘Web Circuits’ A Novel Non-VOC Conformal Coating Krypton: Benchmarking Customer Satisfaction 2008-09 CIRCUITS ASSEMBLY Buyers Guide Wave Soldering Pb-Free Lessons Learned Process Doctor Materials World SMTA Int'l Product Preview Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - July 2008

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