Circuits Assembly - August 2008 - (Page 12) NEWS People Cognex Corp. named Robert Willett president, Modular Vision Systems Division, the company’s largest operating division. He was group vice president of business development and innovation for product identification at Danaher Corp., and president of Videojet Technologies. CyberOptics promoted Steven DiMarco to vice president and general manager, Inspection Systems Business, responsible for new systems product development and a manufacturing center in Singapore, as well as global sales, marketing and service. He has been with CyberOptics since 2005, most recently as vice president of sales and marketing. EPIC Technologies named Bhawnesh Mathur CEO, replacing interim CEO Randy Haight, who remains on the company’s board. Mathur has nearly 30 years’ experience in electronics with IBM, Arrow Electronics and Sanmina-SCI. AIM named Lauro Montalvo national sales manager, Mexico, responsible for managing promotional, sales and support activities. Lauro has 16 years’ experience in soldering technologies, including as an SMT process engineer with Delphi Electronics. ViTechnology Inc. named Michael Greenlee president. Sypris Solutions vice president and CEO T. Scott Hatton resigned, effective July 4. Anthony C. Allen, vice president, treasurer and assistant secretary, has been named acting CFO. TT Electronics named Geraint Anderson chief executive, effective Aug. 4. He supersedes Neil Rodgers, who resigned. Anderson was previously global vice president of Cisco’s Linksys Service Provider business. EMS firm Winland Electronics named Warren Mitchell vice president of operations and supply chain. He has 20 years’ experience in manufacturing and supply chain management, including with Pemstar Inc. “During the past year, it has become increasingly obvious to the two parties that it would be more optimal for the Lego Group to manage its global manufacturing set up,” Lego said in a statement. As of next year, Lego will assume production at Flextronics’ sites in Juarez, Mexico, and Nyiregyhaza, Hungary. The companies are negotiating the terms. Lego said it seeks to take over the Nyiregyhaza plant and staff, while it would move the Juarez production to a new site in Monterrey, Mexico. – Mike Buetow Industry Elcoteq Halts Sale of Russian Unit to Flextronics HELSINKI – A deal to purchase Elcoteq’s subsidiary in Russia fell through after Flextronics failed to obtain approval from Russian competition authorities. In May, a Russian paper reported Flextronics (flextronics.com) had failed to provide data about its beneficiaries. “As these conditions were not met by the deadline stated in the agreement, Flextronics decided to use its right to terminate the transaction,” Elcoteq said in a statement. As part of the original agreement, Flextronics gave Elcoteq (elcoteq.com) a nonrefundable payment of 1 million euros ($1.56 million). Elcoteq had agreed to sell its troubled ZAO Elcoteq subsidiary in St. Petersburg to Flextronics in February as part of a broad restructuring plan. The company is reportedly in talks with other parties to purchase the plant. – Chelsey Drysdale Nihon Superior Upgrades Singapore to Regional HQ SINGAPORE – Nihon Superior Co. (nihonsuperior.co.jp) has upgraded its Singapore location – Nihon Superior Trading (S) Pte Ltd. – to a regional headquarters, with plans to establish an English-speaking R&D center there. The R&D center will be in operation before the end of 2008, with an initial investment of SG$1.275 million (US$934,000), the company reports. The initial focus will be on establishing analytical capability with XRF and ICP equipment. Additional tools required for the development and testing of soldering materials and the diagnosis of microscopy and mechanical testing will follow. NSTS was established in 1988 as a joint venture with Matsushita Electric Industrial Co. In 2007, NSTS accounted for 16% of Nihon’s total sales. – Chelsey Drysdale People Indium named Greg Hayes Southeastern USA regional sales manager, responsible for soldering products for the region. He has 15 years’ experience in soldering materials sales, and a bachelor’s degree in business management from the University of Phoenix. Key Tronic Corp. promoted Doug Burkhardt to vice president of worldwide operations and Larry Bostwick to vice president of engineering and quality. Burkhardt has been with Key Tronic for 19 years, most recently as director of China operations. Bostwick has been with Key Tronic for two years, most recently as director of corporate quality and engineering. Also, Efren Perez retired as vice president of Southwest operations after 19 years with the company. EMS firm Silicon Forest Electronics named Jim Yeager quality assurance manager. He was previously director of quality and engineering at Suntron. Also, Jay Schmidt has been named sales and marketing manager. He was vice president-operations at OECO and plant manager at Tyco-Precision Interconnect. HumiSeal Europe named John Anderson development chemist. He received a master’s in science in chemical biology from the University of Leeds in 2007. Assembly and process equipment supplier APS Novastar LLC named Tim Kardish chief executive. He was president of Labsphere Inc., and also held executive positions at X-Rite and Leica Microsystems. 12 Circuits Assembly AUGUST 2008 circuitsassembly.com http://flextronics.com http://eficiaries.As http://elcoteq.com http://nihonsuperior.co.jp http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - August 2008 Circuits Assembly - August 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Auditing a Fabricatior Cutting Machine Programming Time Simultaneous Acoustic Imaging and Surface Mapping Tech Tips Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Component Advances Product Spotlight Ad Index Assembly Insider Techincal Abstracts Circuits Assembly - August 2008 Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page Cover1) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page Cover2) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page 1) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page 2) Circuits Assembly - August 2008 - Contents (Page 3) Circuits Assembly - August 2008 - Contents (Page 4) Circuits Assembly - August 2008 - Contents (Page 5) Circuits Assembly - August 2008 - Caveat Lector (Page 6) Circuits Assembly - August 2008 - Caveat Lector (Page 7) Circuits Assembly - August 2008 - Industry News (Page 8) Circuits Assembly - August 2008 - Industry News (Page 9) Circuits Assembly - August 2008 - Industry News (Page 10) Circuits Assembly - August 2008 - Industry News (Page 11) Circuits Assembly - August 2008 - Industry News (Page 12) Circuits Assembly - August 2008 - Industry News (Page 13) Circuits Assembly - August 2008 - Market Watch (Page 14) Circuits Assembly - August 2008 - Market Watch (Page 15) Circuits Assembly - August 2008 - Talking Heads (Page 16) Circuits Assembly - August 2008 - Talking Heads (Page 17) Circuits Assembly - August 2008 - Screen Printing (Page 18) Circuits Assembly - August 2008 - Screen Printing (Page 19) Circuits Assembly - August 2008 - Better Manufacturing (Page 20) Circuits Assembly - August 2008 - Better Manufacturing (Page 21) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 22) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 23) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 24) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 25) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 26) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 27) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 28) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 29) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 30) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 31) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 32) Circuits Assembly - August 2008 - Tech Tips (Page 33) Circuits Assembly - August 2008 - Soldering (Page 34) Circuits Assembly - August 2008 - Soldering (Page 35) Circuits Assembly - August 2008 - Test and Inspection (Page 36) Circuits Assembly - August 2008 - Process Doctor (Page 37) Circuits Assembly - August 2008 - Pb-Free Lessons Learned (Page 38) Circuits Assembly - August 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - August 2008 - Getting Lean (Page 40) Circuits Assembly - August 2008 - Getting Lean (Page 41) Circuits Assembly - August 2008 - Component Advances (Page 42) Circuits Assembly - August 2008 - Component Advances (Page 43) Circuits Assembly - August 2008 - Product Spotlight (Page 44) Circuits Assembly - August 2008 - Product Spotlight (Page 45) Circuits Assembly - August 2008 - Ad Index (Page 46) Circuits Assembly - August 2008 - Assembly Insider (Page 47) Circuits Assembly - August 2008 - Techincal Abstracts (Page 48) Circuits Assembly - August 2008 - Techincal Abstracts (Page Cover3) Circuits Assembly - August 2008 - Techincal Abstracts (Page Cover4)
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