Circuits Assembly - August 2008 - (Page 44) SPOTLIGHT 3-D Laser Scanning Microscope VK-9700 confocal microscope has capabilities of SEMs and noncontact profilometry. Said to be capable of 18,000x magnification and 0.001 µm precision. Performs surface profile, roughness, 3-D and comparative measurements. Optional adjustable stand permits measurement of objects up to 3.94”. Larger stages for wafers up to 11.81”, electric stages for automatic image assembly, and a separate measuring head are available. Keyence Corp. of America, keyence.com Product Vacuum Component Pickup ProcessMate PM100 lifts and positions small or delicate parts in benchtop assembly processes. Designed as a pick-and-place tool for use with Performus fluid dispensers; permits positioning of parts with one hand and application of adhesives, solder pastes and other assembly fluids with the other. Both use the same size cabinet. Options include a double foot pedal that controls the dispenser and vacuum system, and a finger switch for manual operation. EFD Inc., efd-inc.com Electroformed Ni Squeegee Blades Slic Blade squeegee blades are said to form a surface with low surface energy. Provide 100% electroformed nickel that reportedly will not chip or flake. Are said to provide lowest wiping pressure, longest blade life, enhanced stencil life and the least stencil damage. Eliminate solder paste sticking and shearing against the blade. Fine Line Stencil/FCT Assembly, finelinestencil.com Enterprise Monitoring Dashboards iMonitor 2.0 enables creation of real-time dashboards to monitor the enterprise, factory, and lines in real-time through web browsers. Creates unlimited numbers of interactive and real-time production tracking, materials, utilization and quality dashboards. Dashboards are constructed by dragging-and-dropping gauges, charts and other active elements into a design view, along with graphics such as line pictures or plant drawings. Permits building of slide shows of multiple dashboards that rotate at user-defined time intervals. Aegis Software Corp., aiscorp.com 120-Feeder Placement Machine MC-12 is said to pack up to 120 feeders into a 1.25 x 1.44 m machine. Has a top speed of 36,000 cph. Board size support is 510 x 460 mm. Comes with component side-view camera, and a complete set of software options. Has 12 mm high-performance electrical intelligent feeder platform, and self-correcting pickup. Comes with two 60-position feeder bars, with a feeder exchange system and a built-in tape cutter as options. Accepts components from 01005 up to 20 mm x 20 mm; is said to place chips with 50 µm accuracy at 3σ. Assembléon, assembleon.com Placement Machine with Dispensing Head FLX2010 MKL placement machine now comes with a threehead system that performs material dispensing and consecutive placement of LEDs on film substrates. Features placement axis with an integrated component adjustment mechanism, and two independent axes with a piezo flow valve and a time-pressure dispenser gear. Dispensing valves are mounted on motorized, closed-loop driven linear axes. Is said to handle substrates up to 800 x 600 mm, with vacuum table. Essemtec AG, essemtec.com Dipping Paste for PoP Devices LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray of 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow. Almit Ltd., almit.com 3-Head High-Speed Dispenser KD-2077 features three standard dispensing heads for a rate of 0.1 sec/shot. Provides automatic syringe pressure compensation, dot size confirmation, low adhesive warning and independent temperature control for each head. Features up to four adhesive dots per dispense cycle. Supports a range of components from 0603 chips to aluminum electrolytic capacitors, SOPs and QFPs. Is backward compatible with KD-775 dispenser. Juki Corp., jas-smt.com 44 Circuits Assembly AUGUST 2008 circuitsassembly.com http://keyence.com http://www.efd-inc.com http://finelinestencil.com http://aiscorp.com http://assembleon.com http://essemtec.com http://almit.com http://jas-smt.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - August 2008 Circuits Assembly - August 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Auditing a Fabricatior Cutting Machine Programming Time Simultaneous Acoustic Imaging and Surface Mapping Tech Tips Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Component Advances Product Spotlight Ad Index Assembly Insider Techincal Abstracts Circuits Assembly - August 2008 Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page Cover1) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page Cover2) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page 1) Circuits Assembly - August 2008 - Circuits Assembly - August 2008 (Page 2) Circuits Assembly - August 2008 - Contents (Page 3) Circuits Assembly - August 2008 - Contents (Page 4) Circuits Assembly - August 2008 - Contents (Page 5) Circuits Assembly - August 2008 - Caveat Lector (Page 6) Circuits Assembly - August 2008 - Caveat Lector (Page 7) Circuits Assembly - August 2008 - Industry News (Page 8) Circuits Assembly - August 2008 - Industry News (Page 9) Circuits Assembly - August 2008 - Industry News (Page 10) Circuits Assembly - August 2008 - Industry News (Page 11) Circuits Assembly - August 2008 - Industry News (Page 12) Circuits Assembly - August 2008 - Industry News (Page 13) Circuits Assembly - August 2008 - Market Watch (Page 14) Circuits Assembly - August 2008 - Market Watch (Page 15) Circuits Assembly - August 2008 - Talking Heads (Page 16) Circuits Assembly - August 2008 - Talking Heads (Page 17) Circuits Assembly - August 2008 - Screen Printing (Page 18) Circuits Assembly - August 2008 - Screen Printing (Page 19) Circuits Assembly - August 2008 - Better Manufacturing (Page 20) Circuits Assembly - August 2008 - Better Manufacturing (Page 21) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 22) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 23) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 24) Circuits Assembly - August 2008 - Auditing a Fabricatior (Page 25) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 26) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 27) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 28) Circuits Assembly - August 2008 - Cutting Machine Programming Time (Page 29) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 30) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 31) Circuits Assembly - August 2008 - Simultaneous Acoustic Imaging and Surface Mapping (Page 32) Circuits Assembly - August 2008 - Tech Tips (Page 33) Circuits Assembly - August 2008 - Soldering (Page 34) Circuits Assembly - August 2008 - Soldering (Page 35) Circuits Assembly - August 2008 - Test and Inspection (Page 36) Circuits Assembly - August 2008 - Process Doctor (Page 37) Circuits Assembly - August 2008 - Pb-Free Lessons Learned (Page 38) Circuits Assembly - August 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - August 2008 - Getting Lean (Page 40) Circuits Assembly - August 2008 - Getting Lean (Page 41) Circuits Assembly - August 2008 - Component Advances (Page 42) Circuits Assembly - August 2008 - Component Advances (Page 43) Circuits Assembly - August 2008 - Product Spotlight (Page 44) Circuits Assembly - August 2008 - Product Spotlight (Page 45) Circuits Assembly - August 2008 - Ad Index (Page 46) Circuits Assembly - August 2008 - Assembly Insider (Page 47) Circuits Assembly - August 2008 - Techincal Abstracts (Page 48) Circuits Assembly - August 2008 - Techincal Abstracts (Page Cover3) Circuits Assembly - August 2008 - Techincal Abstracts (Page Cover4)
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