Circuits Assembly - August 2008 - (Page 47)

Special Advertising Section SPOTLIGHT Assembly Insider codes. Both models use an advanced image formation system. Cognex Corp., cognex.com Product Laser-Cut Stencils ElectroLaser stencils offer precision of laser-cut apertures and paste release properties of 100% electroformed nickel. Contain no trace elements liberated to the aperture walls, causing increased surface roughness. Offer the natural lubricity of electroformed nickel, which improves fine-pitch print consistency. Have a thickness tolerance of ±8% of material thickness selected, and are suitable for applications with surface area ratios to 0.55. Feature positional accuracy of ±0.008% and an aperture dimensional tolerance of ±8 µm. Come in standard material thicknesses of 0.003”, 0.004”, 0.005” and 0.006”. Additional thicknesses available upon request. Fine Line Stencil/FCT Assembly, finelinestencil.com Die-Attach Solder Paste Indium9.32 halogen-free, no-clean, die-attach solder paste is said to exhibit low voiding (<5% total voiding achievable in most instances), and ultra-low residue. For high-volume applications. Indium, indium.com READ IT TODAY! Hot Melt Packaging Adhesives Select Technomelt hot melt adhesives are offered in finger-sized, ready-touse packets. Load directly into the dispensing tank; the dry outer casing melts with the adhesive. Designed to replace sticky cavity packaging and plastic waste. Come in 28 lb. boxes. Available in ethylene-vinyl-acetate, polyolefin and pressure-sensitive technologies. For manufacturing packaging, pressure-sensitive adhesive films, and other applications. Henkel Corp., henkelna.com Stake Out Your Territory Learn how by calling Krista Fabian today at 678-589-8840. • Professor of Engineering and Senior Lecturer, Dartmouth • Senior Technologist, Indium Corp. • Ph.D., Materials Science, Cornell University • SMTA Founders Award winner • Prolific author and lecturer by Dr. Ron Lasky Dr. Ron • Writes 2-3 times weekly • A 17-year veteran of the PCB fabrication and assembly industries, Mike’s industry experience includes six years at IPC and editorial stints at SMT Magazine and PCD&M magazine prior to becoming editor-in-chief of CIRCUITS ASSEMBLY. by Mike Buetow Hot Wires Visit circuitsassembly.com/blog circuitsassembly.com Circuits Assembly AUGUST 2008 47 http://cognex.com http://www.bareboard.com http://www.jetpcb.com http://www.bareboard.com http://www.jetpcb.com http://linestencil.com http://www.circuitsassembly.com/blog http://indium.com http://henkelna.com http://www.circuitsassembly.com/blog http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - August 2008

Circuits Assembly - August 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Screen Printing Better Manufacturing Auditing a Fabricatior Cutting Machine Programming Time Simultaneous Acoustic Imaging and Surface Mapping Tech Tips Soldering Test and Inspection Process Doctor Pb-Free Lessons Learned Getting Lean Component Advances Product Spotlight Ad Index Assembly Insider Techincal Abstracts

Circuits Assembly - August 2008

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