Circuits Assembly - September 2008 - (Page 12)

NEWS People DEK International promoted Michael Brianda to president. He has been with DEK since 1996, most recently as global sales and marketing director. He also has held roles as general manager, and sales manager for Germany. Elcoteq named Cecilia Liu general manager of its plant in Dongguan, China. She has been with Elcoteq since 1999 as product line manager and operations manager, and has a bachelor’s in refrigeration engineering from the Wuhan University of Textile Technology and master’s in strategy management from University of Wales. Photo Stencil chief executive Keith Favre resigned in August. COO Todd Woods was named interim CEO. Separately, the company promoted Skye McDaniel to sales manager and Bill Vaughn to CAD manager. ERSA named Ernie Grice vice president of sales for the firm’s North American operations, responsible for all equipment areas. He has worked for ERSA for six years and has 20 years’ experience in the electronics manufacturing industry. Millennia Technology Inc. named Ray Lindner quality assurance manager. He was previously quality manager/process engineer at Monitech Interlock Systems, and quality manager/proof of design manager at Celestica. Aegis Software named Brian Worrall director of system integration and customization services, responsible for overseeing customer deployments and analyzing customer requirements. He was a business systems analyst and programmer at Fiber-Line Inc. ECT (ectinfo.com) demonstrated a new feature of its Pogo test probes, Zip (Z Interconnect Pin) compliant contacts, which have planar contact surfaces and come in radial, flat and hybrid configurations. Radial uses traditional machined 3-D components; flat uses 2-D components, and hybrid combines both technologies – marrying a flat contact for the interface board with a radial contact for the device under test. CPG President Bud Fabian says the three probes are interchangeable in the same test tool, and come in 0.5, 0.8 and 1.0 mm test pitches. Wire bonding equipment OEM Palomar Technologies (palomartechnologies.com) was among those that opted not to bring equipment. The company is now one year into its subcontract work business, Palomar Microelectronics and finding the market for such services healthy, with five to six customers per month. Asymtek (asymtek.com) displayed a new jetting technology that features a heater inside the jet. The DispenseJet DJ-9500 pneumatic valve is for jetting underfill, or silicone for LEDs. The new jet is said to work better with multiple types of materials, and reduces operator variability by eliminating the air-adjustment controls. Many placement companies, including Juki (jas-smt.com), Panasonic (panasonicfa.com) and Siemens (ea.automation.siemens.com), exhibited, but again, equipment wasn't part of the package. On the other hand, BTU (btu.com) broke from the pack by displaying a Pyramax 75A, which debuted earlier this year. – Mike Buetow Industry Zestron to Open Expanded European Site INGOLSTADT, GERMANY – Zestron (zestron.com) this year will open a 30,500 sq. ft. facility in Ingolstadt, about 62 miles north of Munich. The new European headquarters will include a state-of-the-art, 9,000 sq. ft. analytical and technical center, the largest in Europe, the company said. The company also has hired an unspecified number of process engineers. The facility is scheduled for completion by the end of 2008. Last year, Zestron America moved to new headquarters in the US and the company expanded its facility in China. – Mike Buetow EUP Draft Sent to EU BRUSSELS – The EC Regulatory Committee on Ecodesign and Energy Labeling on July 7 agreed to a draft concerning the standby and off modes of energy-using household and office products. The proposal has been sent to the European Council and European Parliament for review. Continued on pg. 14 EMS firm NBS Design recently moved into a new, larger facility in Santa Clara, CA. circuitsassembly.com 12 Circuits Assembly SEPTEMBER 2008 http://www.ectinfo.com http://palomartechnologies.com http://asymtek.com http://jas-smt.com http://panasonicfa.com http://ea.automation.siemens.com http://btu.com http://zestron.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008

Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

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