Circuits Assembly - September 2008 - (Page 14) NEWS People Indium promoted Eric Bastow and Mario Scalzo (pictured, top) to senior technical support engineer, responsible for customer inquiries, problem solving and product support. Bastow has been with Indium since 2001, Scalzo since 2000. Also, Tom Pearson (pictured, bottom) has been promoted to inside sales manager, Solder Products, Global Processes, responsible for the Americas, Europe and Asia. He has been with Indium for 24 years. Bob Catardi, a sales engineer at Krayden Inc., was named top distributor seller for Dow Corning Electronics. Kyzen named Serge Tuerlings European technical manager, responsible for developing and implementing business and expansion plans throughout Europe. He has extensive experience in chemicals and electronics and was previously European market development manager at Kester Solder. Krayden Inc. promoted Jill White to Eastern area sales manager. Dover Corp. promoted Robert Livingston to president and chief operating officer. He was president and CEO of its Engineered Systems segment and has spent 24 years at the company. CADParts & Consulting named Victor Tejeda to head its ATE Design Services division. E2open Inc. named Mark Woodward chief executive officer, replacing Greg Clark, who remains the company’s technical advisory committee chairman. He is a former senior advisor to Blackstone Private Equity Group and president and CEO of Serena Software Inc. Barring objections, it should be adopted by the Commission and published by the EU at the beginning of 2009. The first phase comes into effect in 2010. The proposal is already coming under fire from electronics engineers. As one critic noted to a wellknown industry email list, “The EU commission groups seem to be very inept when defining scopes and no two policy making groups seem to learn from the other’s mistakes,” adding that the proposal’s scope is “extremely vague and confusing … the [EU] drops in words like household and office equipment into the scope, possibly with the intention of making it clearer but in reality just making it more obscure.” A pdf of the proposal can be viewed at mtprog.com/ReferenceLibrary/Draft%20EuP%20standby%20post%20vote.pdf. – Chelsey Drysdale Industry Plexus to Close Mass. Plant AYER, MA – Plexus (plexus.com) will close its facility here over the next six months and cut 170 jobs, the EMS company said in August. Production will be shifted to other Plexus facilities, mostly in Wisconsin. Plexus will take a $2 million restructuring charge beginning in the fiscal 2008 fourth quarter. The move will save the company about $5 million annually. In a statement, the company said the 65,000 sq. ft. plant would be closed by March with 170 jobs eliminated. It builds defense, security, aerospace and telecommunications products. Plexus said the plant was performing well, but the company needed to strategically align production with future needs. – Mike Buetow Essemtec Opens Expanded HQ AESCH, SWITZERLAND – Equipment manufacturer Essemtec (essemtec.com) in July expanded its headquarter’s production space by about 4,000 sq. ft. The new two-story building includes production space, offices and a large cafeteria. The company has traditionally expanded every two years. In a statement, CEO Martin Ziehbrunner said, “We are rapidly growing. We are happy that the new building has been finished in time. However, utilization at the present location has now reached its limit. For further enlargement, we must look for other possibilities.” – Mike Buetow Essemtec’s latest expansion. Palomar Achieves Management Buyout CARLSBAD, CA – Palomar Technologies’ (palomar.com) management has bought out the original investor group that spun the company out of Hughes Aircraft in 1995. No financial terms were disclosed. Local management, with Palomar for many years, now owns the provider of precision automation equipment and contract assembly services for microelectronics. “All our current operations, products, and services will continue unchanged,” said Bruce Hueners, Palomar Technologies president and CEO. – Chelsey Drysdale USPTO Rejects Tessera Claims (Again) SAN JOSE – The US Patent and Trademark Office issued an office action confirming the rejections of all claims of a Tessera Technologies’ (tessera.com) patent in ex parte reexamination. The patent office also rejected these claims in an earlier action. The patent relates to semiconductor packaging technologies used in a variety of applications. The provider of miniaturization technologies is asserting the ‘326 patent in two investigations pending in the U.S. International Trade Commission against a number of companies. The first of those actions was completed July 18. The second action is scheduled for a seven-day hearing to begin Feb. 5. – Chelsey Drysdale circuitsassembly.com 14 Circuits Assembly SEPTEMBER 2008 http://mtprog.com/ReferenceLibrary/Draft%20EuP%20standby%20post%20vote.pdf http://mtprog.com/ReferenceLibrary/Draft%20EuP%20standby%20post%20vote.pdf http://plexus.com http://essemtec.com http://palomar.com http://tessera.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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