Circuits Assembly - September 2008 - (Page 16) NEWS Riding the Storm Out at SMTAI Industry Edited by Mike Buetow Pointedly, Dr. Nunes urged scientists on either side of the environmental issues to take an unemotional and fact-based approach. "These problems are too big for one company," she said. "They need to be tackled broadly by competitors and people on opposite sides of the issue." Also at the luncheon, SMTA presented its annual awards. The SMTA+ Corporate Award, for an SMTA corporate member company that has shown exceptional support of the SMTA, went to CirCuits Assembly. The magazine joined Celestica as the only two-time recipients of the award. The Founder’s Award, for the person who has made exceptional contributions to the industry and the SMTA, went to Dr. Paul Vianco of Sandi National Labs. Dr. Bev Christian of RIM and Dave Hillman of Rockwell Collins received the Member of Technical Distinction Award, for individuals who make significant and continuing contributions to the SMTA over a period of at least three years. Dale Lee of Plexus won the Excellence in Leadership Award for exceptional dedication to the SMTA. Bob Willis garnered the International Leadership Award. Lei Nie, a graduate student at the University of Maryland, received the Charles Hutchins Educational Grant, a $5,000 stipend toward her research work. (CirCuits Assembly provides the stipend.) SMTA’s Oregon chapter was named chapter of the year. – Mike Buetow ORLANDO – Orlando: You’ll come for the rain. You’ll stay for the wind. Or because of it, perhaps. Tropical Storm Fay put a damper on the second annual SMTA International trade show, although those who braved the elements were treated to a strong technical conference and an eye-opening keynote. The show floor was slow by most standards. While the weather did not attain epic storm proportions, it cast an ominous pall over the area, and doubtlessly convinced many to stay away. (It also reminded many of the earthquake that hit Anaheim, CA, during Nepcon West about 20 years ago.) There were a few new products, including a very low cost BGA rework system, RE-7500, from Shenzhen-based Jovy Systems (jovy.avrepair.com), and shown by AV Repair, its distributor in the US. In her luncheon keynote Wednesday, Dr. Sharon Nunes, vice president of Big Green Innovations at IBM, who got her start in flex circuits some 20 years ago, stressed the role IT could play in helping companies and governments conserve resources. Noting that many of the earth’s minerals, including lead, tin, copper, mercury, indium and others, were on pace to run out within 50 years, Dr. Nunes said greater collaboration would be needed, and in short order, to head off worldwide crises. Most populated regions, including the entire Middle East, most of Asia, Central America, and Africa will have no access to clean, potable water at some point in most of our lifetimes, she said. Meanwhile, overall population growth – especially among the middle class – is rampant, stressing not just the earth’s natural resources, but transportation and energy systems to the max. Today, China and India are planning mega-cities capable of handling 10 million to 20 million people, she noted. The US, meanwhile, houses 3% of the world’s population, yet consumes more than 25% of its resources. And while Europe is attempting to tackle the situation, a resolution will require global participation. Using true bidirectional communication, well designed IT systems can help governments and businesses achieve greater efficiency and cost-savings for water management, carbon management and energy use, she said, pointing to several successes in IBM-led pilot programs. Driven out: The looming storm and top-notch technical program slowed floor traffic. 16 Circuits Assembly SEPTEMBER 2008 circuitsassembly.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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