Circuits Assembly - September 2008 - (Page 23) SN100C Nothing Beats the Original ® Nihon Superior’s SN100C (Sn-Cu-Ni+Ge) alloy has endured the test of time. It is the first leadfree solder based on tin-copper rather than tin-silver-copper to have established a track record of successful use prior to the implementation of the EU RoHS Directive. SN100C is the only tin-copper based solder with a track record of 9 years in mass production with no service failures in more than a billion boards soldered. SN100C’s superior qualities make it the right choice for PCB assembly. Smooth bright fillets No shrinkage defects Lower copper erosion Compliant for high reliability Using SN100C avoids the possibility of patent infringement. Winner of Numerous Industry Awards 2008 Vision Award 2008 New Product Introduction Award A Solution for Wave and Reflow Soldering. Available as Bar, Wire, and Paste. 2007 Global Technology Award 2008 Innovation Award NIHON SUPERIOR CO., LTD. Head Office www.nihonsuperior.com Singapore Nihon Superior Trading (S) Pte., Ltd. Tel: +65 6741-4633 Fax: +65 6741-6636 Email: nstspl@singnet.com.sg Malaysia Nihon Superior (M) Sdn. Bhd. Tel: +60 (0) 5-527-3792 Fax: +60 (0) 5-527-3659 Email: nihonip@nihonsuperior.com.my Thailand Nihon Superior (Thailand) Co., Ltd. Tel: +66 (0) 2-285-4471 Fax: +66 (0) 2-285-4358 Email: nst@nihonsuperior.com China (Suzhou) Nihon Superior (Suzhou) Co., Ltd. Tel: +86 (0) 512-6748-8352 Fax: +86 (0) 512-6748-8551 Email: suzhou@nihonsuperior.com.cn NS Bldg., 1-16-15, Esaka-Cho, Suita 564-0063, Japan Tel: +81 (0) 6-6380-1121 Fax: +81 (0) 6-6380-1262 Email: info@nihonsuperior.co.jp Taiwan Nihon Superior (Taiwan) Co., Ltd. Tel: +886 (0) 3-215-1119 Fax: +886 (0) 3-215-1335 Email: info@nihonsuperior.com.tw USA Nihon Superior USA, LLC Tel: +1 619-684-1422 Fax: +1 619-684-1422 Email: nsusa@nihonsuperior.com China (Shanghai) Nihon Superior (Shanghai) Co., Ltd. Tel: +86 (0) 21-6427-0038 Fax: +86 (0) 21-6441-0554 Email: shanghai@nihonsuperior.com.cn China (Hong Kong) Nihon Superior (Hong Kong) Ltd. Tel:+852 3128-9769 Fax: +852 3128-9969 http://www.nihonsuperior.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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