Circuits Assembly - September 2008 - (Page 26) On the Forefront Will Electronics Manufacturing Return to North America? Despite the signs, don’t hold your breath, our columnist warns. ith the weakening of the dollar, higher logistics costs, especially transporting goods from Asia to the US, rapid wage inflation in Asia, growing concerns about quality and intellectual property protection, many are asking if manufacturing will return to the US. Will it? It is unlikely. Why not? Manufacturing of many electronics products moved out of the US over the past several years largely because of lower costs elsewhere. Some manufacturing moved to Mexico, but most moved to Asia, specifically China. Even though the bloom is off that rose for a number of reasons, manufacturing is not likely to come back. What caused the migration? For many companies, it was not just high labor costs in the US, but also associated costs of health insurance for workers and other overhead expenses. More important, the major and growing markets for many electronic goods have moved to Asia, and manufacturers benefit by manufacturing where they sell. For that reason, some markets for goods produced in the US several years ago are now mostly targeted for sale in Asia. One reason Delphi sited a manufacturing operation in China, for example, was to provide “China-made content” for that market. Benchmark Electronics CEO Cary Fu crystallized the argument in July, responding to investors who asked whether programs would be migrating to Mexico from Asia: You have to look at the type of product in the market you serve. Yes, there is a higher cost related to labor as well as logistic costs in Asia. But at the same time, the demand for certain products is definitely shifting from the US to Asia; e.g., a lot more semiconductor test equipment businesses are moving to Asian sites. [There are] two different forces in the marketplace. One is the product we serve in the US or Europe. If they’re heavy, they’re very expensive to Circuits Assembly SEPTEMBER 2008 W move around. They tend to be moved back to either Asia or the US, as well as Europe. But for the product enjoying increased demand in Asia, we see those products staying in Asia because they have the benefit of lower logistics costs from just producing the product in Asia. Loss of Infrastructure Other factors that make it unlikely for manufacturing to move back to America include the loss of US infrastructure. The knowledge base of manufacturing engineers in the US is shrinking. In Asia, the engineer is on the manufacturing floor working on issues. With the exception of morning and end-of-day meetings, the typical engineer takes a hands-on role. In the US, the engineer is typically not involved in hands-on engineering and sits in front of a computer screen all day, with the exception of the time lost in endless meetings. Nights are filled with conference calls to the manufacturing sites in Asia. Many people with real manufacturing experience in the electronics industry either were laid off or retired. How many new college graduates look forward to an exciting experience in a manufacturing facility? Once the knowledge is lost, it is gone forever. Replacements in the ranks of younger workers are not even a sure bet. Even some of the top engineering schools such as MIT report an influx of students majoring in mathematics, rather than engineering, so they can get jobs doing quantitative calculations for Wall Street firms. Medical and military electronics are exceptions. For implantable medical devices, the quality factor makes the risk of manufacturing in a low-cost labor region too high. In the case of military electronics, national security is the issue. Closely related to military electronics is aerospace. It, too, has remained in the US. However, discussions with a major medical electronics manufacturer on the West Coast and a major military electronics company on the East Coast point out the same circuitsassembly.com "The typical US engineer is not involved in a handson role, and their knowledge base is shrinking." E. Jan Vardaman is president of TechSearch International (techsearchinc. com); jan@techsearchinc.com. Her column appears bimonthly. 26 http://www.techsearchinc.com http://www.techsearchinc.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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