Circuits Assembly - September 2008 - (Page 3)

Vardaman: The Return of Manufacturing? p. 26 IPC Show Issue SEPTEMBER 2008 circuitsassembly.com Line Design Optimizing Small Lot Size Production SEPTEMBER 2008 – Vol. 19 No. 9 RF’s ‘Missing Link’ FIRST PERSON 6 Caveat Lector Not this time. Mike Buetow Reflowing SnCu Converting to VOC-Free Fluxes FEATURES Soldering ON THE COVER: Achieving a well-balanced flow from prep through production. 20 Talking Heads Assembléon’s Dr. Jan Michiels Mike Buetow 34 Reflow Soldering with a SnCu Eutectic Pb-Free Alloy A design of experiment identifies differences in soldering between SAC alloys and SnCuNi. By Gerjan Diepstraten MONEY MATTERS 24 Focus on Business Weathering the storm. Susan Mucha COVER STORY 38 Improving OEE in High Mix Facilities The growing negative overall equipment effectiveness trend can be seen throughout North American facilities, with rates sometimes falling to 50%. Manufacturers can, however, boost OEE through proper process control. By States Mead 25 Global Sourcing The biggest fabricators. Dr. Hayao Nakahara TECH TALK 26 On the Forefront Breathing lessons. E. Jan Vardaman RF Production 42 Effectively Managing RF Design in Utility Metering Applications EMS companies can provide the missing link between meter expertise, good distribution channels and the ability to easily develop RF products. By Roger Allcorn 30 Screen Printing Alden’s printing. Dr. Rita Mohanty Pb-Free Rework 32 Better Manufacturing What role government? Peter Grundy 46 Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Low melt rework process performed on 0.093" and 0.125" thick boards under nitrogen found thermal fatigue life may be comparable or slightly better than that of components reworked using conventional SAC 385. By Simin Bagheri, Polina Snugovsky, Zohreh Bagheri, Craig Hamilton and Heather McCormick 49 Tech Tips Water-based fluxes. American Competitiveness Institute 51 Wave Soldering Common defects. Ursula Marquez de Tino This month at PCDandF.com Behind Black Pad Process control is the only solution for consistent success. By George Milad 52 Pb-Free Lessons Learned Eroding myths of copper. Chrys Shea 54 Materials World Epoxy fluxes. Dr. Renzhe Zhao Design for ‘Green’ Laminates Taking the risk for a greener planet. By Michael Taylor 55 Process Doctor Clean as a ROSE. Terry Munson 56 Equipment Advances Seho’s Go Soldering Line. 64 Technical Abstracts DEPARTMENTS 8 Industry News 18 Market Watch 57 Product Spotlight 61 Ad Index 62 Assembly Insider Photo: Panasonic Factory Solutions http://PCDandF.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008

Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

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