Circuits Assembly - September 2008 - (Page 4)

EI puts BIG ideas in small packages Redesigning PWBA’s into a SiP… • Improves electrical performance • Reduces weight • Achieves size reductions up to 27x • Addresses thermal considerations • Provides miniaturization • Minimizes complexity / cost EI fabricates & assembles highly advanced SiP solutions circuitsassembly.com Editorial Office Circuits Assembly 2400 Lake Park Drive, Ste. 440, Smyrna, GA 30080 678-589-8800 Editor-in-Chief: Mike Buetow (617) 327-4702, mbuetow@upmediagroup.com Senior Editor: Chelsey Drysdale (678) 589-8846, cdrysdale@upmediagroup.com Production Manager/Managing Editor: Javier Longoria Director of Audience Development: Jennifer Schuler Special Projects Manager: Ronda Faries Publisher: Pete Waddell Group Sales Director: Susan Jones (404) 822-8900, sjones@upmediagroup.com Sales Associate: Krista Fabian (678) 589-8840, kfabian@upmediagroup.com Asia (except Korea): Susan Jones, Tech Search International (404) 822-8900, sjones@upmediagroup.com Korea: Young Media 82 2 756 4819, ymedia@ymedia.co.kr Circulation Inquiries: email: jschuler@upmediagroup.com fax: (918) 496-9465 Reprints: Electronic: ca_reprints@upmediagroup.com Print: Edward Kane, FosteReprints 866-879-9144 ext 131; fax: 219-561-2009 ekane@fostereprints.com List Rental: Jennifer Schuler, (918) 496-1476; fax (918) 496-9465 Editorial Advisory Board: John D. Borneman, Delphi Delco Electronics Heather McCormick, Celestica Curt Williams, Morey Corp. Chrys Shea, Shea Engineering UP Media Group, Inc. www.endicottinterconnect.com December 2-4, 2008 Orlando Metropolitan Resort Orlando, FL www.pcbshows.com/orlando President: Pete Waddell Vice President, Sales and Marketing: Frances Stewart Vice President, Editorial and Production: Mike Buetow PCB Show Group: (678) 589-8800 Subscription Policy Circuits Assembly (ISSN 1054-0407/GST124513185/Agreement #1419676) is distributed without charge to qualified subscribers. To all others in the USA and Canada: US$80 per year. Other countries: US$145 per year (air service included, payment required in advance). Single copies US$8.50. Send requests for qualification forms and changes of address (include old label) to: CIRCUITS ASSEMBLY, P.O. Box 35646, Tulsa, OK 74153-0646, email: jschuler@upmediagroup.com, fax (918) 496-9465. Periodicals postage paid at Atlanta, GA 30339 and additional mailing offices. Reproduction of text and illustrations is not allowed without express written permission. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by UP Media Group, Inc. for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $2.00 per copy, plus $0.25 per page is paid directly to CCC, 21 Congress St., Salem, MA 01970. 0009-7306/86, $2.00 + $0.25. 16mm microfilm, 35mm microfilm, 105mm microfiche and article and issue photocopies are available from University Microfilms International, 300 N. Zeeb Rd., Ann Arbor, MI 48106 (313) 761-4700. Canadian GST Permit 124513185. Opinions expressed by authors are not necessarily those of the publisher, and this publication can accept no responsibility in connection with any liability that might develop as a result of articles published. Circuits Assembly is published monthly by UP Media Group, Inc., 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. POSTMASTER: Please send changes of address to CIRCUITS ASSEMBLY, P.O. Box 35646, Tulsa, OK 74153-0646. circuitsassembly.com Circuits Assembly SEPTEMBER 2008 4 http://circuitsassembly.com http://www.endicottinterconnect.com http://www.endicottinterconnect.com http://www.pcbshows.com/orlando http://www.pcbshows.com/orlando http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008

Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.