Circuits Assembly - September 2008 - (Page 40) Cover Story to be on the reduction of non-value-added times, from staging, kitting, changeover, unplanned downtime, material handing, labor resources and quality. A recent episode shows how OEMs can reduce operational costs through proper evaluation of the entire operation, not just the SMT lines. A leading commercial alarm system manufacturer was producing PCBs for its finished products. It recently had reduced lot sizes to meet customer schedule needs, but did not improve internal processes to reduce changeover and downtime. The OEM’s primary concern was improving a shrinking on-time delivery rate, which slipped to 80% from an original target above 95%. The solution: a four-line facility, two-shift operation with each production line containing approximately 25 different models to build. Lot sizes ranged from 10 to 600, with an average of about 60, a changeover time averaging 20 min., and 15 min. of additional unplanned downtime with an average cycle time around 1.1 min. The high percentages of changeover and additional unplanned downtime were due to waiting for the next work order to be ready from kitting, incorrect parts loaded onto feeders, and process steps performed during a changeover. Figure 6 represents the current OEE state of about 60%. After an in-depth, weeklong onsite analysis consisting of observing current factory processes, a new model was developed, approved by management and implemented. The model included development of a combination of fixed feeder and exchange feeder setups on each line, which reduced kitting activities along with changeover activities. Program cycle times were improved through better optimization tools, as well as integration of fixed nozzle changer and board support setups. Tables 1-3 show the solution proposal results. The solution proposal included: • Using customer-provided data of production schedules, volumes and observations during onsite visits, the proposal focused on reduced kitting efforts. • Each line was carefully evaluated to determine part commonality. • Figure 7 shows the feeder tables determined to be most effective to be fixed with specific high use parts across each of the three production lines. • Figure 8 shows benefits gained by assigning specific parts to fixed locations with tape splicing over kitting exact processes. Product family A (SMT2) details: • 50% reduction in exchange carts 8 carts 4 carts. • 33% reduction in changeover time 15min 10 min. • Estimated 40% reduction loading parts into feeders. • Estimated 10% reduction in overall product cycle times. • Estimated 10% increase in line capacity. Product family B (SMT3) details: • 50% reduction in exchange carts 8 carts 4 carts. • 33% reduction in changeover time 15 min 10 min. • 40% reduction loading parts into feeders 239 kitting/ setup man-hours. • 21% reduction in overall product cycle times. • 18% increase in line capacity: Current 200 hr. to produce Proposed 145 hr. to produce. • Increase possibility to produce within one shift, with occasional OT or 2d shift based on demand spikes. Product family C (SMT4) details: • 25% reduction in exchange carts 8 carts 6 carts. • 33% reduction in changeover time 15 min 10 min. Figure 5. OEE % relation to lot size based on 2 min. CT, 10 min. C/O, 4 min. unplanned downtime. Figure 6. OEE % relation to lot size based on 1.1 min. CT, 20 min. C/O, 25 min. unplanned. 40 Circuits Assembly SEPTEMBER 2008 Figure 7. Most effective feeder tables setup. circuitsassembly.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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