Circuits Assembly - September 2008 - (Page 43)

RF Production shedding, leak detection, customer usage profiling and meter security. One technique for this communication technology is mesh networking, but the actual model used varies widely. As these mesh networks grow in complexity, RF frequency ranges go from UHF (900 Mhz) to microwave (up to 2.3-2.4 GHz). In these continuously available transmission networks, such as GSM, wi-fi or other bespoke systems (450-900 Mhz), meter data is broadcast directly back to a central office. A more localized approach involves fixed transponders and drive-by collectors to capture data locally and transfer to headquarters. Eventually widespread wi-fienabled mesh networks will link to the Internet, transmitting in the 5-plus GHz range. While simplifying meter-to-central office linkage for utilities, this adds complexity to meter design as it drives PCB component miniaturization (e.g., use of 0201s). Companies developing product for this market range from traditional meter manufacturers to companies that simply specialize in developing AMR add-on devices for meters. Common elements among these companies are strong distribution channels and an understanding of market needs. However, many are not manufacturing experts, per se. Instead, they team with independent design firms or EMS providers to access scalable technical expertise and manufacturing resources. Addressing Technology Challenges While R&D expense has significantly been reduced, RF product development efforts in this area typically require engineering resources focused on product enhancement, test plan strategy and test development. Third-party qualification in support of regulatory approvals may drive additional design spins. In short, bridging the gap from RF-oncircuitsassembly.com EFD Solder Paste Now packaged in Optimum™ Syringes & Cartridges a-chip to an approved/fielded product requires specialized RF engineering expertise and ultimately a manufacturing partner capable of supporting a high mix/variable demand technology complex production and test process. From a design standpoint, higher RF transmission ranges force a more precise PCB layout. With RF or any high-speed digital technology, the length of the trace is a function of the wavelengths being sent. Size is shrinking. Every trace is a component at these speeds, rather than just a link. There is virtually no packaging. The product must generate sufficient RF power to work in the correct band, yet have minimal interference with other equipment operating in the same spectrum. Pad design is extremely important. For example, in one project an assembly malfunctioned because the original component layout was not generating the correct power and was sending out harmonics that caused interference. Moving one capacitor half a millimeter to the left solved the problem. Component selection is also important and an area where value for price must be considered. The lowest cost components may not perform as anticipated or may have availability issues over the longer lifecycles normally associated with these products. Integration of design and manufacturing resources becomes critical both in terms of technology and overall product cost competitiveness. Test strategy should help ensure continued product conformance to appropriate regulatory agency compliance standards. Testing should provide an aid for the manufacturer to put in corrective measures to improve yield. The process should also include a feedback loop that ensures, as design issues are identified (i.e., component tolerance variances), information is sent to the design house to drive corrective action in the next design spin. High-impact strength & dimensional stability ZeroDraft™ design ensures consistency Double-wiper piston eliminates waste The Clear Advantage™ 800-338-4353 +1-401-434-1680 www.efd-inc.com/ads/ca-0908 Visit us at ATExpo, Booth 1015 Circuits Assembly SEPTEMBER 2008 43 http://www.efd-inc.com/ads/ca-0908 http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008

Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.