Circuits Assembly - September 2008 - (Page 44) RF Production This helps the design company optimize the product for manufacture. At the same time, while testing should be sufficiently effective to ensure products are compliant, it must also be cost-effective in volume production. In the manufacturing process, robust inspection processes also can be critical because, when products in this application fail, it may be a noticeable compliance failure that draws the attention of not only the end-customer, but also that of the agency regulating the end-customer. Partnering with an EMS Provider While the term product realization is widely used in the EMS industry as a generic description of design-throughdelivery capability, in this case, industry-specialized product realization is truly the service needed. Key benefits the EMS provider should be prepared to deliver include: • A robust product development process, which includes both support of conceptual design issues and the more traditional design for manufacturability/design for testability (DfM/DfT) expertise. • Ability to support needed prototyping for product qualification and the subsequent ability to efficiently transition to volume manufacturing. • Engineering expertise related to RF test strategy and test development. • Component selection recommendations that consider quality, availability and cost. • Ability to place fine-pitch components. • Ability to support software integration and other customization requirements in a variable demand environment. • Ability to provide required testing to ensure continued product regulatory compliance. • Ability to support post-manufacturing requirements such as fulfillment, repair depot and spares support. EMS contributions typically are made incrementally throughout the product development and manufacturing process and over time shorten design cycles, reduce design to production learning curve issues and improve quality. The following example outlines a project outsourced by an OEM wishing to add RF technology into its system solutions for the utility market. Key challenges that needed to be addressed included: • A requirement for a product operational life of 15 or more years. • Hostile operating environments that could include high moisture contact and significant temperature variations. • Different product configurations for different markets. • High engineering change notice (ECN) activity, particularly in relationship to software revisions. • Variable demand driven by utility ordering practices. • A regulated design that could require formal re-qualification if component substitutions were made. 44 Circuits Assembly SEPTEMBER 2008 The EMS provider managed mechanical enclosure design, design for testability and component selection. DfM considerations took into account the EMS provider’s manufacturing equipment constraints and processes, which were aligned with IPC design guidelines. The EMS provider evaluated component lifecycles and approved vendor list (AVL) choices. In terms of component lifecycle analysis, semiconductors were the primary focus in potential obsolescence evaluation. Recommended AVL choices were based on price competitiveness, track record of supplier performance and availability. When component substitutions were recommended, the EMS provider sent samples and data sheets to the OEM’s design house for evaluation. This particular EMS provider also had strengths in custom wound coil design and manufacture. The design house specified the requirements for an inductive coil, but the actual bobbin was selected and wound by the EMS provider. DfT was another area of focused collaboration. The EMS provider had expertise in both in-circuit test development and RF functional test and fixture development. As a result, it developed the test programming, functional test set and fixtures. It also made recommendations to the design firm for connector placement to support test node accessibility and optimum RF signal integrity during test. Test development was an area of greatest technical complexity. Test node accessibility and RF signal integrity drove specialized focus in both the product design and test fixture development. Additionally, the test process needed to incorporate a software programming step. Product life issues were addressed in the initial design process during component selection and qualification testing. A potting process was used to minimize/eliminate environmental exposure. The EMS provider’s systems for configuration control and traceability supported the high levels of ECO activity and challenges associated with multiple product configurations. Market drivers are creating significant opportunities in RF-based utilities metering applications. For OEMs, the trick to capitalize on these opportunities is combining existing marketing expertise with a strong team capable of rapidly developing, qualifying, manufacturing and shipping products. n Reference 1. R. Allcorn, “Emerging Technologies in RF Design and Implications on Design for Manufacturing and Testability in Outsourced Production,” SMTA International, August 2008. Ed.: This article is adapted from a presentation at SMTA International in August 2008, and is published with permission. Roger Allcorn is senior product engineer-RF products at Syncro Corp. (syncrocorp.com); rogerallcorn@syncrocorp.com. circuitsassembly.com http://www.syncrocorp.com http://www.syncrocorp.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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