Circuits Assembly - September 2008 - (Page 55) The Great Testing Migration As 0201s and 01005s pop up, cleanliness monitoring progresses as well. Process Doctor T raditional resistivity of solvent extract (ROSE) is a quick board-level assessment of the entire immersed board surface and components in an alcohol water solution. This solution (75% isopropyl alcohol/25% deionized water) is a recirculating system of a monitored resistivity, both static (not using cleaned solution) and dynamic (using cleaned solution), that decreases when ionic and some organic material is exposed to the probe. After test, the contaminated solution is easily cleaned: Once the solution is passed through a mixed bed of resin, it is ready for the next test. The ROSE test is a measure of ionic residue in solution. Automated ROSE Tester Automated ROSE Tester Automated Localized Extraction Automated Localized Extraction C3 C3 Pump Detector Detector Pump Figure 2. Localized extraction diagram. The principle behind all automated ROSE testers (Figure 1) that perFigure 1. Automated ROSE form to IPC-TM-650 test diagram. method 2.3.25 is to use the recirculated solution to rinse ionic residues from the board and component surfaces and measure the resistivity change. As this change occurs over the testing time (15 to 60 min.), it reports the amount of ionic residue cumulatively detected from the board surface in the 3-5 gal. testing tank with a 2 gal. solution reserve. Because no standard operating protocol has been developed for determining the ratio of solution to board surface area, it is generally accepted to use the largest tank and volume with a single bare board or assembly to determine ionic residues. The principle of localized extraction (Figure 2) is to isolate a single area (cell #1 = 0.1 in2 area) and to administer heated extraction solution (18.3 MΩ DI water with less than five TOC level) to the specific area. The extraction has three phases: 1. Apply heated solution to the spot (this is a microburst of steam). 2. Allow the solution to soak for at least 5 sec. 3. Aspirate the solution of the spot surface. 4. Repeat a total of nine times to solublize and remove the residue in the specific location. Now the solution can be electrically assessed and analyzed by ion chromatography with a small ratio of Mixed Mixed Resin Resin Switch Switch Figure 3. Sample anion analysis. 0.1 in2 to 2.5 mls of solution. Now the topside repaired part cleanliness can be compared against the cleanliness of the first reflow step, or the cleanliness of a soldered area versus the bare board area. Using localized extraction to assess the residue, we can see the contamination is from the specific area, and understand the electrical effect of the amount and type of ionic residue. Contamination found in an area of failure also can be compared to other assemblies in the same area that are not failing. This allows us to understand processing variables that impact performance. Using a Dionex ICS 2000 system to run anion and cation analysis in 17 min., we have great separation for the following ionic and organic residues (Figure 3): • Anions by AS22 separate fluoride, formate, acetate, MSA, chloride, nitrite, bromide, nitrate, phosphate, sulfate, succinic, malic, maliec, glutaric and adipic acids. • Cations by CS12a separate sodium, potassium, amine, lithium, calcium and magnesium. Continued on pg. 56 Terry Munson is with Foresite Inc. (residues.com); tm_foresite@ residues.com. This column appears monthly. circuitsassembly.com Circuits Assembly SEPTEMBER 2008 55 http://residues.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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