Circuits Assembly - September 2008 - (Page 57) SPOTLIGHT Solvent-Based Defluxer Zestron DS 100 is for water-free and low-temperature cleaning applications. Is designed to remove flux residues from assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. Is said to ensure extended bath life, short cycle times and residue-free drying. Is halogenfree; meets new RoHS and WEEE guidelines. Zestron America, zestron.com Product ‘9-Thermocouple’ Profiler KIC Explorer 9 profiler uses modern hardware and features a total of nine thermocouples using standard type K TC connectors. The channel completes the range of compact profilers. Is said to feature easy-to-use software. The optional auto-focus process optimization software automatically selects the best oven setup for each application. KIC, kicthermal.com Halide-Free, No-Clean Flux Kester 295 is halide- and bromide-free and designed for cored solder wire. Conforms to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01. Is said to eliminate splattering and expensive cleaning. Residues are nonconductive and noncorrosive and require no removal. Comes in a variety of alloys, wire diameters and flux percentages. Classified as type ROLO flux per J-STD-004A; can be used for Pb- and Pb-free soldering. Emits low smoke and odor. Kester, kester.com Automated Lead Tinning LTS200 is a programmable, automated machine for conventional lead tinning or reconditioning SnPb parts. Comes with central fluxing station with two solder pots. Handles transistors, capacitors, diodes, axials, radials, QFPs, pin grid array, sips, dips and connectors. Uses KISS selective soldering system designs, components and software. ACE Production Technologies, aceprotech.com Automated Conformal Coating Inspection B-UV uses UV lighting and proprietary inspection algorithms. Inspects coverage, selected areas of non-coverage, delamination, cracks and bubbles. No programming required for setup. Uses a known good board to learn coverage and non-coverage areas. Inspection typically takes a few seconds, with inspection results immediately displayed. Results can be stored and reviewed offline. Reads all common barcodes for product traceability. Optional inspection software upgrade for component presence and location. YesTech Inc., yestechinc.com Semiconductor Test Contacts ZIP features planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs. Everett Charles Technologies, ectinfo. com Ultrasonic Stencil Cleaners Series 500 are designed for fine-pitch, low-volume stencils. Come standard with a heated wash and other basic requirements for cleaning Pb-free solder paste, pallets and adhesives. Can be customized. Model 520 cleans up to 20” stencils; Model 529 cleans larger stencils. Smart Sonic, smartsonic.com Dispenser Slider Valve SV-100 is said to be up to 20% faster than standard auger dispensers; reportedly achieves 20,000 dots per hr. (on 1 mm grid), while delivering dots of less than 0.012” for solder paste types 4, 5 and 6. Dots as small as 0.005” in diameter can be achieved with type 6 paste. Dispenses dots, lines of pastes and fluids that contain ESD-Safe Vacuum Tweezer TV-1000 is said to permit handling of parts from 0.10” to several inches in diameter. The long-life diaphragm vacuum pump generates up to 10” of mercury with an open-air flow of 2.3 lpm. Is ESD-safe. Has three-wire power cord. Small-parts tips handle items to 100 µm, and pickup heads with two or three pickup points handle larger parts. Virtual Industries Inc., virtual-ii.com circuitsassembly.com Circuits Assembly SEPTEMBER 2008 57 http://kicthermal.com http://zestron.com http://kester.com http://aceprotech.com http://aceprotech.com http://yestechinc.com http://www.ectinfo.com http://www.ectinfo.com http://smartsonic.com http://virtual-ii.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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