Circuits Assembly - September 2008 - (Page 58)

SPOTLIGHT Site Dressing System PMT400S is designed for site dressing and repeatable solder removal. Uses Sierra Mate software. Is height-sensing and production-ready. Is Pb-free capable. Features semiautomatic gantry motion, automated nitrogen gas switching and optional IR bottom heater. Has a 28” sq. footprint. Includes a self-contained solder removal tool. Can prepare up to 51 mm BGA site on assemblies with 2” tall top and 1.5” bottom-side components. Handles boards up to 14” by 20”. VJ Electronix Inc., vjelectronix.com Product metal additives with minimal clogging. Is compatible with Pb-free and no-clean solder pastes and silver-filled epoxies. Is for solder paste dots for passive components smaller than 0603, rework of BGA and QFN electrical connections, RF shield attach, low-volume/high-mix applications, and unique patterns of conductive epoxy. Asymtek, asymtek.com Multi-User Labeling Software Pb-Free Batch Oven T200A is for low volumes and limited floor space. Is said to be capable of attaining Pb-free temperatures to 300˚C; offers a ΔT performance envelope of ±1˚C across a 360 x 230 mm processing area. Uses a mix of quartz IR and hot air convection. Solders chips and other SM devices in accordance with recommended profiles. Generates and stores 20 to 40 sequential time and temperature settings. Can be used for curing and drying. Manncorp, manncorp.com Easylabel 5 is for designing and printing product identification, barcode and RFID labels. Can license multiple copies over a network; eliminates the need for individually licensed PCs. Is available in packages of 5, 10 or 25 user licenses. Free trial edition. Tharo Systems, tharo.com UV/Dual Cure Materials RTV 800 series materials, for encapsulating and staking sensitive components, have reported cure speeds of less than 3 sec. Patented chemistry permits paste-like products to cure up to 5/8” thick with minimal energy requirements. Viscosity of encapsulant ranges from a few hundred centipoises (for spraying and dip coating) to several thousand for thick coating and deeper potting applications up to 3/8” thick. Are self-leveling and flowable, and shadow cure at room temperature. Are based on silicone chemistry, translucent, and do not degrade or yellow on longterm exposure to light. Novagard Solutions, novagardsolutions. com Fast-Cure Thixotropic Silicone Loctite 5210 is an alternative to hot-melt glues and is said to be ideal for devices in harsh environments. Is a noncorrosive, room temperature vulcanization silicone material designed for wire tacking, selective sealing, vibration dampening, and rework/repair. Reportedly has dispense times as little as 31 sec. for two connectors and a tack-free time of less than 5 min. Offers a high UPH alternative. Material reportedly will hold its form and will not spread or migrate to other locations. Cures at room temperature. Henkel Corp., henkel.com/electronics Universal Prototyping System Automatic Defluxer and Cleanliness Tester SMT3000LD is reportedly capable of removing all flux residues, including rosin, no-clean and water-soluble, lead and Pb-free. Is equipped with automatic chemical injection and closed-loop wash solution recycling systems. Zero-discharge evaporation system optional. Handles up to 200 101 x 152 mm boards and up to 28 457 x 508 mm boards per hr. Aqueous Technologies, aqueoustech.com Expert-SAFP semiautomatic pick-andplace system is for prototype quantities. Has an air-suspended pick-and-place head, integrated vision and placement system, and picks from reels, sticks, rest tape strips and loose components. Includes turning station for upside-down components. Comes with dispenser and reflow tool. Essemtec, essemtec.com 58 Circuits Assembly SEPTEMBER 2008 circuitsassembly.com http://asymtek.com http://vjelectronix.com http://tharo.com http://manncorp.com http://www.novagardsolutions.com http://henkel.com/electronics http://www.novagardsolutions.com http://essemtec.com http://aqueoustech.com http://circuitsassembly.com

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Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

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