Circuits Assembly - September 2008 - (Page 59) SPOTLIGHT 1-Component Conductive Adhesives USB-Compatible Device Programmers PC3200 series are fast-setting, for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits. Reportedly require no premixing. Do not have to be stored below 40˚C, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing. Product Enhanced 7th Generation programmer models 1710, 2710, 2710M, 4710, 4710M, 3710MK2 and 3710MK2-M feature Heraeus Contact Materials Division, 4cmd.com/circuitmahigh-speed USB 2.0 standard bus to roject2:Layout 1 4/14/08 speeds and reliincrease communication 11:42 AM Page 1terials ability. Support devices with densities up to 4 Gb. Replace existing 7th Generation product line. BPM Microsystems, bpmmicro.com Parts Electrical Measurement Option Fuji Data Setup, Parts Tracking Optel Lean/NXT is a standalone solution that monitors the Fuji NXT placement platform. Communicates in real-time using Fuji Open Interface. Downloads program data directly from Fuji Flexa. Provides data on FLX-CVU comes as an option for the FXL2011 placement machine and verifies component electrical characteristics. Reportedly prevents setup flaws and wrong placement actions as a result of labeling and packing errors, localizes divergences in component reels, and eliminates placement of out-of-spec parts. Measurement values are stored in a database and permit traceability to single parts. Measurement unit is directly integrated into machine; contacts are designed so that components with different outlines and form factors can be tested. Essemtec, essemtec.com circuitsassembly.com Circuits Assembly SEPTEMBER 2008 59 http://4cmd.com/circuitmaterials http://4cmd.com/circuitmaterials http://bpmmicro.com http://essemtec.com http://www.powell-muchaconsulting.com/ http://www.powell-muchaconsulting.com/ http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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