Circuits Assembly - September 2008 - (Page 6) Caveat Lector Be Still, Shakeup Seers ere we go again. A recent report predicted a coming shakeout in electronics manufacturing services. And the media, doing what media do best, picked up and ran with it, facts be damned. The Reuters news service in August wrote Flextronics International and Hon Hai (Foxconn) are “driving a wave of consolidation that will boost their big customers while squeezing some of the smaller ones.” That assumption came on the heels of an iSuppli report claiming falling revenues among Celestica, Sanmina-SCI and Elcoteq will ultimately lead to contraction in the EMS world. Further, some 88% of the world’s top EMS/ODM executives believe that by 2013 one or more of those companies will not exist, iSuppli said. If I had a nickel for every time someone insisted to me their competitor was going to disappear, well, I’d have a lot of nickels. iSuppli based its findings in part on a predicted halving in industry revenue growth. Per the research firm, global sales will hit $432.3 billion by 2012, a CAGR of 7.2% from 2007, which is less than half the 15.5% CAGR from the previous five years. Faced with slowing revenue growth, the thinking goes, businesses will naturally merge or gobble each other up in an attempt to drive the topline. Except if they don’t. A not-so-closer look reveals sanity has returned to many of the larger firms. Burned by round after round of acquisitions gone awry, most of the Top Tier has ceased buying revenue. As Joe Bronson, Sanmina-SCI president and COO, said in these pages in January (circuitsassembly.com/cms/content/view/5872/95), “Our focus is on improving asset management. … We have to pursue markets where we can generate value and grow margins.” Likewise, in an interview in mid August, Celestica technology department director Peter Tomaiuolo told me, “We’re growing incremental revenue profitably. We’re not going to be the biggest.” In 2008 the company is tracking more than a full point ahead of last year’s margins. The iSuppli report ignores this, noting midsingle-digit revenue drops in 2007 at Sanmina-SCI, Celestica and Elcoteq. Yet the former two firms are orienting more toward the higher margin military, aerospace and medical markets. Sanmina-SCI this H summer dumped its low-margin PC business, a roughly $2 billion operation that barely broke even. That’s 19% of the $10.4 billion in sales the company reported in 2007. For its part, Elcoteq is undergoing a transition from being the largest provider of handsets to Nokia to broadening (slightly) its portfolio to telecom and IT. It’s a highly competitive market, but one the Finnish EMS company knows very, very well. Could merger mania reduce the Top Tier to, say, Foxconn and Flextronics? One longtime industry watcher told me major OEMs will never let it happen, that they need many players around – even in the Top Tier – to keep the biggest guys in line on pricing. While I don’t believe there’s any type of thought-out conspiracy afoot (and I don’t think that’s what the observer was suggesting), it’s true few OEMs single source a program, and more than a few contracts are awarded for head-scratching reasons. Traditionally, Foxconn has grown almost completely organically (or with smoke and mirrors claims one prominent analyst who, for obvious reasons, declines to be named), not through big acquisitions. And as we reported last month, a new three million sq. ft. campus in Juarez, Mexico, is in the offing. That doesn’t sound like a company planning a big acquisition. At the Top Tier level, no one absorbs and integrates as well as Flextronics. It’s part of their business model, and I can’t imagine that will change soon. But Flextronics historically has been as or more active in snapping up OEM assets. I can’t imagine that will change, either. Our just published 2008 Directory of EMS Companies (circuitsassembly.com/cms/dems) lists more than 1,000 companies and 1,400 sites, up a couple hundred from the 2007 edition. If a shakeout is ahead, it’s going to take awhile just to pick up all those pieces. And yet … “The competition is becoming more intense,” iSuppli quotes Calvin Huang of the Daiwa Institute of Research. “We will see another round of consolidation among these (contract) providers.” Truth be told, I once made that misassumption. In 1993. Not this time. Mike Buetow, Editor-in-Chief mbuetow@upmediagroup.com 6 Circuits Assembly SEPTEMBER 2008 circuitsassembly.com http://circuitsassembly.com/cms/dems http://circuitsassembly.com/cms/content/view/5872/95 http://circuitsassembly.com/cms/content/view/5872/95 http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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