Circuits Assembly - September 2008 - (Page 60) SPOTLIGHT Biodegradable PCB Cleaner Circuit Suds biodegradable cleaner was formulated to be environmentally friendly. Is said to be suitable for no-clean, rosin, and Pb-free processes. No special handling or disposal reportedly required in the majority of applications; is nonflammable and non-volatile. Can be disposed of as ordinary wastewater with few exceptions. For hand-cleaning through automated lines. Comes in 1 gal., 5 gal. and larger containers. Circuit Suds, circuitsuds.com Product proper setup, feeder replenishment, excess scrap warnings on a given feeder/slot, and machine performance indicators. Features include automatic setup verification, component cycle counting, component level traceability, downloading and saving machine performance information, real-time scrap data collection, and support for reel splicing. Options include MSD tracking, electronic Kanban support, and duty-cycle-based feeder management. Optimal Electronics, optelco.com ESD Workstation Electrostatic dissipative workstation systems are certified to meet specific electrical property requirements, ensuring static dissipation at a safe rate. Pedestals and workbench components can be protected by static dissipative powdercoat finishes available in three standard colors. Also feature worksurfaces and shelves with static dissipative plastic laminate. Worksurfaces and shelves have ground bolts with a 12' grounding cord for proper grounding. Configurable in a variety of heights and lengths, with cabinet pedestals and/or legs. Lista International, listaintl.com Environmental Compliance Manager GreenData Manager PC software collects and manages RoHS compliance status and supplier certificates, material composition substance data, MSL and peak temperature data for Pb-free manufacturing, Sn-whisker mitigation strategies, etc. Will validate compliance information against EU RoHS, China RoHS, Korea RoHS, Halogen-Free, and Norwegian PoHS; report compliance status on all parts or BoMs; provide validation on the required material composition substances for each component and aggregate the status to products or BoMs; determine if test reports or certificates need to be recollected. Free 30-day trial. GreenSoft Technology, greensofttech.com Standalone Wafer Pen VWP-500 is said to accept all of the company’s press-fit wafer tips and an adaptor that accommodates die/SMT handling tips. Available for handling wafer sizes from 2" to 12" in diameter, and for 1/16" ID or 1/8" ID vacuum hoses. Is available as a standalone wafer pen or as a kit with vacuum hose, holder, vacuum source and wafer tip. Virtual Industries Inc., virtual-ii.com Automated PCB Documentation BluePrint for PCBs version 2.0 documentation-authoring tool now integrates with CAM350. Reportedly can be used to create and distribute all deliverables required for a PCB fabrication and assembly release package in one electronic file. Supports a module for panel document creation. Includes flip panel; universal release package navigator; CAM350 Embedding, and usability updates. DownStream Technologies, downstreamtech.com 32 Gb Device Auto-Programmer Flashstream will support up to 32 Gb by year-end, thanks to use of cache-programming modes in select devices, reportedly pushing top speed on NAND memory to 8.23 Mb per sec. data transfer during programming. Now supports MLC flash memory using a bit error rate tolerance method. Managed NAND architecture like eSD/eMMC such as Samsung MoviNAND, Micron e-MMC, and Sandisk iNAND are now supported. Vector Engine has been enhanced with address-data multiplexed (A/D MUX) NOR devices. Now comes in multiple automated handling systems. BPM Microsystems, bpmmicro.com Thermally Conductive Flip Chip Underfill ME-542 is said to offer improved thermal path for heat reduction. Designed to achieve high reliability for in-package or 60 Circuits Assembly SEPTEMBER 2008 circuitsassembly.com http://circuitsuds.com http://optelco.com http://listaintl.com http://greensofttech.com http://virtual-ii.com http://www.downstreamtech.com http://www.downstreamtech.com http://bpmmicro.com http://circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008 Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - September 2008 Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - September 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - September 2008 - Contents (Page 3) Circuits Assembly - September 2008 - Contents (Page 4) Circuits Assembly - September 2008 - Contents (Page 5) Circuits Assembly - September 2008 - Caveat Lector (Page 6) Circuits Assembly - September 2008 - Caveat Lector (Page 7) Circuits Assembly - September 2008 - Industry News (Page 8) Circuits Assembly - September 2008 - Industry News (Page 9) Circuits Assembly - September 2008 - Industry News (Page 10) Circuits Assembly - September 2008 - Industry News (Page 11) Circuits Assembly - September 2008 - Industry News (Page 12) Circuits Assembly - September 2008 - Industry News (Page 13) Circuits Assembly - September 2008 - Industry News (Page 14) Circuits Assembly - September 2008 - Industry News (Page 15) Circuits Assembly - September 2008 - Industry News (Page 16) Circuits Assembly - September 2008 - Industry News (Page 17) Circuits Assembly - September 2008 - Market Watch (Page 18) Circuits Assembly - September 2008 - Market Watch (Page 19) Circuits Assembly - September 2008 - Talking Heads (Page 20) Circuits Assembly - September 2008 - Talking Heads (Page 21) Circuits Assembly - September 2008 - Talking Heads (Page 22) Circuits Assembly - September 2008 - Talking Heads (Page 23) Circuits Assembly - September 2008 - Focus on Business (Page 24) Circuits Assembly - September 2008 - Focus on Business (Page best1) Circuits Assembly - September 2008 - Focus on Business (Page best2) Circuits Assembly - September 2008 - Global Sourcing (Page 25) Circuits Assembly - September 2008 - On the Forefront (Page 26) Circuits Assembly - September 2008 - On the Forefront (Page 27) Circuits Assembly - September 2008 - On the Forefront (Page 28) Circuits Assembly - September 2008 - On the Forefront (Page 29) Circuits Assembly - September 2008 - Screen Printing (Page 30) Circuits Assembly - September 2008 - Screen Printing (Page 31) Circuits Assembly - September 2008 - Better Manufacturing (Page 32) Circuits Assembly - September 2008 - Better Manufacturing (Page 33) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 34) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 35) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 36) Circuits Assembly - September 2008 - Reflow Soldering with a SnCu Eutectic Pb-Free Alloy (Page 37) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 38) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 39) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 40) Circuits Assembly - September 2008 - Improving OEE in High Mix Facilities (Page 41) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 42) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 43) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 44) Circuits Assembly - September 2008 - Effectively Managing RF Design in Utility Metering Applications (Page 45) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 46) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 47) Circuits Assembly - September 2008 - Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys (Page 48) Circuits Assembly - September 2008 - Tech Tips (Page 49) Circuits Assembly - September 2008 - Tech Tips (Page 50) Circuits Assembly - September 2008 - Wave Soldering (Page 51) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 52) Circuits Assembly - September 2008 - Pb-Free Lessons Learned (Page 53) Circuits Assembly - September 2008 - Materials World (Page 54) Circuits Assembly - September 2008 - Process Doctor (Page 55) Circuits Assembly - September 2008 - Equipment Advances (Page 56) Circuits Assembly - September 2008 - Product Spotlight (Page 57) Circuits Assembly - September 2008 - Product Spotlight (Page 58) Circuits Assembly - September 2008 - Product Spotlight (Page 59) Circuits Assembly - September 2008 - Product Spotlight (Page 60) Circuits Assembly - September 2008 - Ad Index (Page 61) Circuits Assembly - September 2008 - Assembly Insider (Page 62) Circuits Assembly - September 2008 - Assembly Insider (Page 63) Circuits Assembly - September 2008 - Technical Abstracts (Page 64) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - September 2008 - Technical Abstracts (Page Cover4)
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