Circuits Assembly - September 2008 - (Page 61)

SPOTLIGHT COB applications and to increase thermal dissipation from the die into the substrate. Has high copper content in substrate. Has thermal conductivity of 0.8 W/mK, a reported 500% increase over standard underfill products. Is engineered to quickly flow into gaps less than 25 µm with minimal filler settling and no voiding, encapsulating interconnect arrays with a layer of protective polymer. Lord Corp., lord.com Product Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. cups; sizes are 1/4”, 3/8” and 1/2”. Comes with two of each cup, one on a straight probe and the other on a bent probe. Is made from ESDsafe materials, and has no hoses or batteries to replace. Tube is machined aircraft aluminum. Virtual Industries Inc., virtual-ii.com Aim Solder, www.aimsolder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Assembleon, www.assembleon.com/facts . . . . . . . . . . . . . . . . . . 31 Asymtek, www.asymtek.com. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 62 BEST, Inc., www.solder.net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Cognex Corporation, www.cognex.com . . . . . . . . . . . . . . . . . . . . 11 Compufab, www.compufab.com. . . . . . . . . . . . . . . . . . . . . . . . . . 63 High-Volume AOI Upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and throughhole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard. YESTech Inc., yestechinc.com Cookson Electronic Assembly Materials, www.cooksonelectronics.com . . . . . . . . . . . . . . . . . . . . . . . . . . 13 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . C3 DEK USA, www.dek.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 eFabPCB, www.efabpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 EFD, INc., www.efd-inc.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Electronics Group of Henkel, www.electronics.henkel.com . . . . . . . 5 Endicott Interconnect Technologies, www.eitny.com. . . . . . . . . . . . 4 EPIX Inc., www.epixinc.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 ERSA, www.ersa.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C2 Europlacer, www.europlacer.com . . . . . . . . . . . . . . . . . . . . . . . . . 35 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 IPC Midwest 2008, www.ipcmidwestshow.org . . . . . . . . . . . . . . . 50 ITW Chemtronics, www.chemtronics.com . . . . . . . . . . . . . . . . . . . 28 JETPCB Inc., www.jetpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Kyzen Corporation, www.kyzen.com . . . . . . . . . . . . . . . . . . . . . . . 27 MEPTEC, www.meptec.org . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Mexitronica 2008, www.mexitronica.com . . . . . . . . . . . . . . . . . . . 38 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . . . . 29 Miyachi Unitek Corp., www.muc.miyachi.com . . . . . . . . . . . . . . . 17 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . 23 Northern Electronics Automation (NEA), www.neainc.com . . . . . . 41 PCB Orlando, www.pcbshows.com/orlando . . . . . . . . . . . . . . . . . . 4 Powell-Mucha Consulting, www.powell-muchaconsulting.com . . 59 Mobile Handheld Dispenser The DX dispensing system includes a refill station for two-component materials. Is said to dispense a variety of ratios. Multiple handheld dispensers can be refilled with one refill station; uses two transfer pumps that feed from 5 gal. bulk containers, each equipped with follower plates. Mixpac Equipment Inc., mixpacequipment.com 12-Zone Reflow Oven The longer, 12-zone Pyramax reflow oven features 350˚C maximum temperature, a flexible platform configuration and a comprehensive menu of options. Capabilities include reduced nitrogen consumption and lower power use. Features closed-loop convection control. BTU International, btu.com Anti-Yellowing Conformal Coatings Elpeguard SL 1307 FLZ series are 1-pack fastdrying polyacrylic resins for yellowing resistance. Cured ink film can be soldered at soldering iron temperature; can be removed by means of product-specific thinner. Colorless fluorescent adjustments are approved as permanent coatings per UL 94; meet requirements of IPC-CC-830B. Lackwerke Peters, peters.de Water-Soluble Solder Paste WS170 is intended for Sn62/Sn63 applications. Reportedly produces fully wetted, shiny solder joints, and has the activity to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, Alloy 42 and bare copper. Print speeds of up to 6”/sec. have been tested with full aperture fill and no slumping. Nonhygroscopic formulation, broad process window, 24-hr. stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, excellent wetting, repeatable paste deposition, and compatibility with all plating types. Provides up to 8 hrs. response-to-pause time without print degradation. FCT Assembly, fctassembly.com On-Board Gang Programmer MultiWriter pps is said to use concurrent programming to program up to 24 parts each of up to 16 different types simultaneously (up to 384 chips). Reportedly speeds programming for microcontrollers and flash memories mounted on boards. Enables programming of data such as serial numbers and date codes. Includes integrated PC system console, Lambda 0-60V, 12.5A programmable power supply, MultiWriter controller and GenRad 227X fixture interface. Bed-of-nails fixture reportedly contains only probes necessary for powering the board and contacting circuit nodes required for programming and verification. CheckSum, checksum.com Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 63 SEHO Systems GmbH, www.seho.de . . . . . . . . . . . . . . . . . . . . . . . 39 Seika Machinery, www.seikausa.com . . . . . . . . . . . . . . . . . . . . . . 33 Speedline Technologies, www.speedlinetech.com . . . . . . . . . . . 15 Viscom, Inc., www.viscom.com. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Vision Engineering, www.visioneng.com/shop . . . . . . . . . . . . . . . 63 Vitronics Soltec, www.vitronics-soltec.com . . . . . . . . . . . . . . . . . . 9 ZESTRON America, www.zestron.com . . . . . . . . . . . . . . . . . . . . . . 53 Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Susan Jones Group Sales Director, (404) 822-8900 email: sjones@upmediagroup.com Krista Fabian Sales Associate, (678) 589-8840 email: kfabian@upmediagroup.com Manual Vacuum Tweezer V8901-HLM-B, for handling SMD packages, is self-contained and manually operated. Has six Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr circuitsassembly.com Circuits Assembly SEPTEMBER 2008 61 http://circuitsassembly.com http://www.aimsolder http://www.assembleon.com/facts http://www.asymtek.com http://www.bareboard.com http://www.solder.net http://virtual-ii.com http://www.cognex.com http://www.compufab.com http://www.cooksonelectronics.com http://www.cyberoptics.com http://lord.com http://www.dek.com http://www.digikey.com http://www.efabpcb.com http://www.efd-inc.com http://www.electronics.henkel.com http://www.eitny.com http://www.epixinc.com http://www.ersa.com http://www.europlacer.com http://www.grid-lok.com http://www.pcbnet.com http://mixpacequipment.com http://www.indium.com http://yestechinc.com http://www.ipcmidwestshow.org http://www.chemtronics.com http://www.jetpcb.com http://www.kyzen.com http://www.meptec.org http://www.mexitronica.com http://www.mirtecusa.com http://www.muc.miyachi.com http://btu.com http://www.nihonsuperior.co.jp http://www.neainc.com http://www.pcbshows.com/orlando http://peters.de http://www.powell-muchaconsulting.com http://www.goppm.com http://www.seho.de http://www.seikausa.com http://www.speedlinetech.com http://www.viscom.com http://www.visioneng.com/shop http://www.vitronics-soltec.com http://www.zestron.com http://fctassembly.com http://checksum.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - September 2008

Circuits Assembly - September 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business Global Sourcing On the Forefront Screen Printing Better Manufacturing Reflow Soldering with a SnCu Eutectic Pb-Free Alloy Improving OEE in High Mix Facilities Effectively Managing RF Design in Utility Metering Applications Solder Joint Reliability of Different BGAs Reworked Using Low Melting Point Pb-Free Alloys Tech Tips Wave Soldering Pb-Free Lessons Learned Materials World Process Doctor Equipment Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - September 2008

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