Circuits Assembly - October 2008 - (Page 4) Letters Clean Slate? I have been waiting to read your insights on the recent announcement of a joint conference [on cleaning] sponsored by IPC and SMTA. While I think any personal issues between these or any two groups should not be amplified in the media, this is a case where clearly the glass is more than half full and represents what I would consider a positive move toward collaboration and coordination in the industry. Perhaps your assessment will see fit to expound on the positive trend this alliance illustrates. Name withheld by request The editor responds: You ask a fair question. I haven’t written anything on the joint IPC-SMTA Cleaning Symposium because I’m not sure what, if anything, this really represents. Does one event make a trend? IPC does several events with Jedec each year, and SMTA has its share of cooperative productions as well, so teaming with other groups isn’t new to either entity. Further, “cleaning” is a safe territory. There aren’t a bunch of big equipment companies fighting over owning that space, so the opportunities to derive revenue from large exhibitions are minor and the downsides of working together thus nominal. If the two organizations could come to agreement about their respective fall trade shows, however, that would be a development I wouldn’t be able to avoid. Show Me the Weather I enjoyed reading Susan Mucha’s recent column (“Weathering a Trade Show Storm,” September 2008). Interesting that a limited attended show was one of my best! You see, the people who were prepared were the people I wanted to deal with. And the masses that were not there enabled me to get in front of them with relative ease because I didn’t have to fight for time. I have already made appointments with several prospects – I just left a prospect who will now become a customer. My goal has always been a customer per show, and I will get three good ones out of that storm in Orlando. There must be a reason why I have always loved foul weather! 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Table of Contents Feed for the Digital Edition of Circuits Assembly - October 2008 Circuits Assembly - September 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing 'Checking Up' on Medical Electronics Solder Ball Attachment Using Laser Soldering Improving QFN Reliability Reflow Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Alternative Energies Eastern Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - October 2008 Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - October 2008 - Contents (Page 3) Circuits Assembly - October 2008 - Letters (Page 4) Circuits Assembly - October 2008 - Letters (Page 5) Circuits Assembly - October 2008 - Caveat Lector (Page 6) Circuits Assembly - October 2008 - Caveat Lector (Page 7) Circuits Assembly - October 2008 - Industry News (Page 8) Circuits Assembly - October 2008 - Industry News (Page 9) Circuits Assembly - October 2008 - Industry News (Page 10) Circuits Assembly - October 2008 - Industry News (Page 11) Circuits Assembly - October 2008 - Industry News (Page 12) Circuits Assembly - October 2008 - Industry News (Page 13) Circuits Assembly - October 2008 - Market Watch (Page 14) Circuits Assembly - October 2008 - Market Watch (Page 15) Circuits Assembly - October 2008 - Talking Heads (Page 16) Circuits Assembly - October 2008 - Talking Heads (Page best1) Circuits Assembly - October 2008 - Talking Heads (Page best2) Circuits Assembly - October 2008 - Global Sourcing (Page 17) Circuits Assembly - October 2008 - Screen Printing (Page 18) Circuits Assembly - October 2008 - Screen Printing (Page 19) Circuits Assembly - October 2008 - Better Manufacturing (Page 20) Circuits Assembly - October 2008 - Better Manufacturing (Page 21) Circuits Assembly - October 2008 - Better Manufacturing (Page 22) Circuits Assembly - October 2008 - Better Manufacturing (Page 23) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 24) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 25) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 26) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 27) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 28) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 29) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 30) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 31) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 32) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 33) Circuits Assembly - October 2008 - Reflow Soldering (Page 34) Circuits Assembly - October 2008 - Tech Tips (Page 35) Circuits Assembly - October 2008 - Test and Inspection (Page 36) Circuits Assembly - October 2008 - Test and Inspection (Page 37) Circuits Assembly - October 2008 - Process Doctor (Page 38) Circuits Assembly - October 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - October 2008 - Alternative Energies (Page 40) Circuits Assembly - October 2008 - Alternative Energies (Page 41) Circuits Assembly - October 2008 - Eastern Advances (Page 42) Circuits Assembly - October 2008 - Eastern Advances (Page 43) Circuits Assembly - October 2008 - Product Spotlight (Page 44) Circuits Assembly - October 2008 - Product Spotlight (Page 45) Circuits Assembly - October 2008 - Ad Index (Page 46) Circuits Assembly - October 2008 - Assembly Insider (Page 47) Circuits Assembly - October 2008 - Technical Abstracts (Page 48) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover4)
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